Multilayer Ceramic Capacitors General Purpose Series Chinocera HGC0805R7471K500NTHJ for Digital Circuits
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Product Description
Product Overview
The Hongming Huaci Technology Multilayer Ceramic Capacitors (MLCC) are designed for high-density, high-efficiency surface-mount applications. These general-purpose series capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering excellent electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, they provide high capacitance in compact dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and telecommunications.
Product Attributes
- Brand: Hongming Huaci Technology ()
- Series: General Purpose Series (4V~63V)
- Supplier: Suining Hongming Huaci Technology Co., Ltd. ()
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
- Origin: China
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Name | Multilayer Ceramic Capacitors | |
| Series | General Purpose Series | 4V~63V |
| Available Sizes | 0201 ~ 1210 | |
| Applications | General digital circuit, Power supply bypass, Consumer electronics, Telecommunication | |
| Model Representation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | See detailed breakdown in document. |
| Temperature Characteristics |
| |
| External Dimensions (Example) | 0201 (0603): L: 0.600.03mm, W: 0.300.03mm, T: 0.300.03mm | |
| External Dimensions (Example) | 0402 (1005): L: 1.000.05mm, W: 0.500.05mm, T: 0.500.05mm | |
| External Dimensions (Example) | 0603 (1608): L: 1.600.20mm, W: 0.800.20mm, T: 0.800.20mm | |
| Packaging Standard Quantity (Examples) | 0201: 15,000 pcs/7" reel (Paper tape) | |
| Packaging Standard Quantity (Examples) | 0402: 10,000 pcs/7" reel (Paper tape) | |
| Packaging Standard Quantity (Examples) | 0603: 4000 pcs/7" reel (Paper tape) | |
| Capacitance Range & Rated Voltage | Detailed tables provided for C0G, X7R, X7S, X5R, X6S dielectrics across various sizes and voltages. | See document pages 5-7. |
| Reliability Test - Capacitance Tolerance | Class I (C0G, C0H): Specified tolerance levels. | Test Temp: 253 |
| Reliability Test - Capacitance Tolerance | Class II (X7R/X5R, X7S/X6S): Specified tolerance levels. | Test Temp: 253 |
| Reliability Test - Dissipation Factor (DF, tan) | Class I: Varies by capacitance value. | Test Temp: 253 |
| Reliability Test - Dissipation Factor (DF, tan) | Class II: Varies by size, rated voltage, and capacitance. | Test Temp: 253 |
| Reliability Test - Insulation Resistance (IR) | Class I: Ri50000M (C10 nF), RiCR500S (C10 nF). | Measuring Voltage: Rated Voltage. Test Temp: 253. |
| Reliability Test - Insulation Resistance (IR) | Class II: Ri10000M (C25 nF), RiCR100S (C25 nF). | Measuring Voltage: Rated Voltage. Test Temp: 253. |
| Reliability Test - Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Class I: 300% Rated Voltage; Class II: 250% Rated Voltage. Duration: 1~5s. |
| Reliability Test - Solderability | 95% tin coverage, no visible damage. | Lead-free: 2455 for 20.5s. Leaded: 2355 for 20.5s. |
| Reliability Test - Termination Adhesion | No visible damage. | Force varies by size (2N for 0201, 5N for 0402-0805, 10N for 1206). Time: 101s. |
| Reliability Test - Resistance to Soldering Heat | Electrical performance and appearance requirements met. | Solder temp: 2655 for 101s. Recovery: 242h. |
| Reliability Test - Moisture Resistance (Steady State) | C/C: Class I: 2% or 1pF. Class II: 10%. | 402, 90%~95%RH for 500h. Recovery: 242h. |
| Reliability Test - Temperature Cycle | C/C: Class I: 1% or 1pF. Class II: 10%. | 5 cycles, -55 to +125 (or other specified temps). Recovery: 242h. |
| Reliability Test - Durability | C/C: Class I: 2% or 1pF. Class II: 20%. | 1.5x Rated Voltage at elevated temps (125/85/105) for 1000h. Recovery: 242h. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70%. Guaranteed solderability for 6 months. | |
| Soldering Profile | Recommended temperature profiles for Reflow Soldering, Wave Soldering, and Hand Soldering are provided. | Refer to document pages 18-21. |
| Typical Characteristic Data | Includes |Z|-Frequency, Temperature Characteristics, and DC Bias Characteristics curves. | For reference only. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina