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Multilayer Ceramic Capacitors Chinocera HHV1206R7121K102NSLJ Featuring NP0 C0G and X7R Dielectric for SMT

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Product Description

Product Overview

The HHV series of Multilayer Ceramic Capacitors (MLCCs) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R dielectric materials, offering superior electrical performance and high reliability. They are suitable for mid-to-high voltage applications ranging from 100V to 3000V, with case sizes from 0402 to 1812. Key features include high voltage capability in a given case size and high stability and reliability. Applications include analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.

Product Attributes

  • Brand: HHV Series
  • Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
  • Origin: China
  • Dielectric Materials: NP0 (C0G, C0H), X7R

Technical Specifications

Category Specification Details
Product Name Multilayer Ceramic Capacitors HHV Series
Series Mid-High Volts Series 100V ~ 3000V
Specification (Size) Case Sizes 0402 ~ 1812
Description High voltage ceramic capacitors for high density and high efficiency SMT application.
Features High voltage in a given case size. High stability and reliability.
Applications Analog & Digital Modems, LAN/WAN Interface, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters
How to Order (Example) HHV 1206 R7 102 K 202 N S L J Series, Size, Dielectric, Capacitance, Tolerance, Rated Voltage, Termination, Packaging, Thickness Symbol, Reel Size
Dielectric Characteristics C0G (C0H) Temp. Coefficient: 0 30 ppm/ (0 60 ppm/ for C0H), Operating Temp: -55125
Dielectric Characteristics X7R Temp. Coefficient: 15%, Operating Temp: -55125
External Dimensions Size (Inch/mm) L (mm), W (mm), T (mm)/Symbol, MB (mm)
0402 (1005) 1.000.05, 0.500.05, 0.500.05 E, 0.250.10
0603 (1608) 1.600.20, 0.800.20, 0.800.20 H, 0.400.15
0805 (2012) 2.000.20, 1.250.20, 0.700.10 G / 0.800.20 H / 1.250.20 L, 0.500.20
1206 (3216) 3.200.20, 1.600.20, 0.800.20 H / 1.000.10 J / 1.250.20 L / 1.600.20 P, 0.600.20
1210 (3225) 3.200.30, 2.500.20, 1.250.20 L / 1.600.20 P / 2.000.20 U / 2.500.20 V, 0.750.25
1808 (4520) 4.50.40, 2.00.25, 1.250.20 L / 1.600.20 P / 2.000.20 U, 0.750.25
1812 (4532) 4.50.40, 3.20.30, 1.250.20 L / 1.600.20 P / 2.000.20 U / 2.500.30 V, 0.750.25
Packaging Standard Quantity Size Thickness (mm)/Symbol, Paper Tape (7reel), Plastic Tape (7reel)
0402 (1005) 0.500.05 E, 10,000, --
0603 (1608) 0.800.20 H, 4000, --
0805 (2012) 0.700.10 G / 0.800.20 H, 4000, -- / 1.250.20 L, --, 3000
Capacitance Range & Rating Voltage (C0G/C0H) See Table 8-1 Details available in Table 8-1
Capacitance Range & Rating Voltage (X7R) See Table 8-2 Details available in Table 8-2
Reliability Test: Appearance & Electrical Performance Item Technical Requirements & Test Method
Appearance No remarkable defects or abnormalities.
Size Within the specified size range.
Capacitance (Class I) Within specified tolerance. Test: 253, 1MHz10% (1000pF) or 1KHz10% (>1000pF), 1.00.2Vrms.
Capacitance (Class II) Within specified tolerance. Test: 253, 1KHz10% (10F) or 12024 Hz (>10F), 1.00.2Vrms.
Dissipation Factor (DF) Class I: 0.56% (Cr5pF), 0.15% (5pFCr1000pF), 1KHz (1000pF). Class II: 2.5%.
Insulation Resistance (IR) Class I: C10nF Ri50000M, C10nF RiCR500S. Class II: C25nF Ri10000M, C25nF RiCR100S. Test: 253, 75% RH, 605s @ Rated Voltage (Max 500V).
Reliability Test: Performance Item Technical Requirements & Test Method
Dielectric Withstanding Voltage (DWV) No breakdown or damage. Voltage applied: 200% (100-500V), 150% (500-1000V), 120% (1000-5000V) of rated voltage for 5s. Max current 50mA (or 10mA for >2000V).
Solderability 95% tinning rate, no visible damage. Lead solder: 2355, 20.5s. Lead-free solder: 2455, 20.5s. Preheating: 80-120, 10-30s.
Termination Adhesion No visible damage. Force: 5N (0402-0805), 10N (1206). Duration: 101s.
Resistance to Soldering Heat Electrical & Appearance requirements met. Preheating: 100-200, 20.5min. Solder Temp: 2655, 101s. Recovery: 242h.
Resistance to Flexure of Substrate C/C 10%; No visible damage. Test: 1.60.2mm PCB, 1mm flexure, 1mm/sec, 51s hold.
Moisture Resistance (Steady State) C/C: Class I 2% or 1pF, Class II 10%. DF 2x initial. IR: Class I 2500M or RiCR25S. Class II 1000M or RiCR25S. Test: 402, 90-95%RH, 500h. Recovery: 242h.
Temperature Cycle C/C: Class I 1% or 1pF, Class II 10%. Cycle: 5 times (-55 to +125). Recovery: 242h.
Durability C/C: Class I 2% or 1pF, Class II 20%. Voltage: 2x (500V), 1.5x (500-1000V), 1.2x (>1000V). Temp: 125. Duration: 1000h. Recovery: 242h. IR: Class I 4000M or RiCR40S. Class II 2000M or RiCR50S.
Storage Method Guaranteed solderability period: 6 months. Conditions: 5~40, 20%~70% RH.
Soldering Conditions Refer to Soldering Profile, Manual Soldering, Optimum Solder Amount, Recommended Soldering Amounts, and Temperature Profile charts. Includes Reflow Soldering (SnPb/Lead-free), Wave Soldering, and Hand Soldering guidelines.
Typical Characteristic Data Graph |Z|-Frequency Characteristics Temperature Characteristics
DC Bias Characteristics (Note: Characteristics are for reference only)

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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