Multilayer Ceramic Capacitors Chinocera HGC0805S6106K250NSLJ for Power Supply and Consumer Electronics
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density and high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in compact dimensions. Applications include general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: (Suining Hongming Huaci Technology Co., Ltd.)
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
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| Part Name | Multilayer Ceramic Capacitors | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Series | General Purpose Series (4V~63V) | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Specification / Size | 0201 ~ 1210 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| How to Order (Example: HGC 0805 R7 104 K 500 N T H J) |
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| Temperature Coefficient / Characteristics |
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| Product Peripheral Dimensions |
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| Packaging Standard Quantity |
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| Capacitance Range and Rated Voltage (Partial Data) |
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| Reliability Test - Appearance and Electrical Performance |
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| Storage Methods | Guaranteed solderability for 6 months (under delivered package condition). Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%. | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Precautions for Use | MLCCs may fail in short or open circuit. Severe conditions can lead to burn out, flaming, or explosion. Follow specifications and contact technical department for uncertainties. Soldering requires careful temperature control to avoid cracks or damage. Ensure optimal solder amount for proper connection. | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Profile | Refer to provided temperature profile charts for Reflow Soldering (SnPb and Lead-free), Wave Soldering, and Hand Soldering. Minimize temperature differential (T) during preheating. | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Typical Characteristic Data Graph | |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics. (Note: Characteristics are for reference only.) | |||||||||||||||||||||||||||||||||||||||||||||||||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina