General Purpose Multilayer Ceramic Capacitors Chinocera HGC0402G08R2C500NTEJ from 0201 to 1210 Size Range

• Supplier: Suining Hongming Huaci Technology Co., Ltd.
• Issue Date: 20201116
• Version: HC202002
• Product Name: Multilayer Ceramic Capacitors
• Series: General Purpose Series (4V~63V)
• Specification: 0201 ~ 1210 Size

• Wide selection of sizes: 0201 to 1210 available.
• High capacity in a small size.

• General digital circuits
• Power supply bypass capacitors
• Consumer electronics
• Telecommunication industry

Format: HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size]

Example Codes:

• Series: HGC (General Purpose)
• Size: 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225)
• Dielectric: R5=X5R, R7=X7R, G0=C0G
• Capacitance: 104=100nF, 105=1F, 106=10F
• Tolerance: J=5%, K=10%, M=20%
• Rated Voltage: 500=50Vdc, 101=100Vdc, 631=630Vdc
• Termination: N=Cu/Ni/Sn
• Packaging: T=Paper taping, S=Embossed taping
• Thickness Code: C=0.3mm, H=0.8mm, P=1.6mm
• Reel Size: 7 Inch, 13 Inch

Note: R=Reflow Soldering, W=Wave Soldering

(Detailed tables for C0G/C0H, X7R, X7S, X5R, X6S dielectrics are provided in the source document, listing specific capacitance values available for each size and rated voltage.)

Appearance and Electrical Performance Test: Includes checks for appearance, dimensions, capacitance, dissipation factor (DF), and insulation resistance (IR) under specified conditions.

Reliability Tests:

• Insulation Resistance (IR): Specified values for Class I and Class II capacitors.
• Dielectric Withstanding Voltage (DWV): No breakdown or damage required.
• Solderability: Over 95% tin coverage required.
• Termination Adhesion: Specified force and time for various sizes.
• Resistance to Soldering Heat: Electrical and appearance requirements after soldering.
• Resistance to Flexure of Substrate: Capacitance change and appearance requirements after bending.
• Moisture Resistance (Steady State): Capacitance change, DF, IR, and appearance requirements after exposure to humidity.
• Temperature Cycle: Capacitance change and appearance requirements after cycling through temperature extremes.
• Durability: Capacitance change, DF, IR, and appearance requirements after prolonged operation at elevated temperatures and voltage.

• Paper Taping Dimensions: Detailed dimensions for 0201, 0402, 0603, 0805, 1206 sizes.
• Embossed Taping Dimensions: Detailed dimensions for 0805~1812 types.
• Reel Dimensions: Available in 7" and 13" reels.
• Taping Specification: Top tape peeling strength requirements for paper and plastic tape.

• Guaranteed Solderability Period: 6 months (under delivered package condition).
• Storage Conditions: Temperature 5C~40C, Relative Humidity 20%~70%.

• MLCCs may fail in short or open circuit and can cause fire, burning, or explosion under severe conditions.
• Follow specified ratings and conditions.
• Soldering Conditions: Use recommended temperature profiles to avoid chip cracking or explosion.
• Manual Soldering: Handle with care to avoid thermal shock and damage.
• Solder Amount: Use optimum solder amounts for reflow and wave soldering to ensure proper connection and prevent damage.
• Recommended Soldering Temperature Profiles: Provided for Reflow Soldering (Leaded and Lead-free) and Wave Soldering.
• Hand Soldering Conditions: Specific preheating, iron temperature, power, diameter, and time limits are provided. Avoid direct contact with the ceramic component.

• |Z|-Frequency Characteristics Curve
• Temperature Characteristics
• DC Bias Characteristics

Note: The above product characteristics are for reference only.