Multilayer Ceramic Capacitors Chinocera HHV0603R7221K501NTHJ High Voltage NP0 and X7R SMT Components

• C0G: 030 ppm/, -55125
• C0H: 060 ppm/, -55125
• X7R: 15%, -55125
• X7S: 22%, -55125

• Size: 1.000.05mm (L) x 0.500.05mm (W) x 0.500.05mm (T)
• MB: 0.250.10mm
• Soldering Method: R (Reflow Soldering)

• Thickness (mm)/Symbol: 0.500.05 / E
• Paper tape 7reel: 10,000 pcs

• 0402 Size: 0.5pF to 100pF with various rated voltages (100V to 1000V)
• 1812 Size: 200pF to 0.10F with various rated voltages (200V to 3000V)

• 0603 Size: 100pF to 270pF with various rated voltages (100V to 250V)
• 1812 Size: 8.200pF to 4.7F with various rated voltages (500V to 3000V)

• Appearance: No remarkable defects or abnormalities.
• Size: Within specified dimensions.
• Capacitance Tolerance: Class I (C0G, C0H) within specified tolerance; Class II (X7R) within specified tolerance.
• DF (tan): Class I 0.15% (for Cr50pF); Class II 2.5%.
• Insulation Resistance (IR): Class I (C10nF) 50000M; Class II (C25nF) 10000M.

• Dielectric Withstanding Voltage (DWV): No breakdown or damage. (e.g., 200% Rated voltage for 5 sec for 100VVr500V)
• Solderability: 95% tinning rate, no visible damage.
• Termination Adhesion: No visible damage (e.g., 5N for 0402-0805, 10N for 1206).
• Resistance to Soldering Heat: Electrical performance and appearance requirements met.
• Resistance to Flexure of Substrate: C/C 10%, no visible damage.
• Moisture Resistance (Steady State): C/C: Class I 2% or 1pF; Class II 10%. IR: Class I 2500M; Class II 1000M.
• Temperature Cycle: C/C: Class I 1% or 1pF; Class II 10%.
• Durability: C/C: Class I 2% or 1pF; Class II 20%. IR: Class I 4000M; Class II 2000M.

• Paper Taping Dimensions available for 0402, 0603, 0805, 1206.
• Embossed Taping Dimensions available for 0805~1812.
• Reel Sizes: 7-inch and 13-inch.
• Top tape peeling strength: 0.1N

• Guaranteed solderability period: 6 months (under delivered package condition).
• Storage Temperature: 5~40.
• Storage Relative Humidity: 20%~70%.

• MLCCs may fail in short or open circuit. Risk of fire, burning, or explosion under severe conditions. Follow specifications carefully.
• Soldering profiles (Re-flow, Wave, Manual) are provided to avoid chip cracking.
• Optimum solder amounts and temperature profiles are recommended.
• For manual soldering, use caution to avoid thermal shock and contact with ceramic body.
• Temperature differential (T) limits are specified for re-flow and wave soldering.

• |Z|-Frequency Characteristics
• Temperature Characteristics
• DC Bias Characteristics

Note: The above product characteristics are for reference only.