Surface Mount Technology Capacitors Chinocera HHV0805R7222K101NTHJ with NP0 and X7R Dielectric Types
Product Overview
The HHV series of Multilayer Ceramic Capacitors (MLCCs) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency Surface Mount Technology (SMT) applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R materials, offering superior electrical performance and high reliability. They are suitable for mid-to-high voltage applications ranging from 100V to 3000V and are available in case sizes from 0402 to 1812. Key features include high voltage capability in a given case size, high stability, and reliability, making them ideal for applications such as analog & digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverters.
Product Attributes
- Brand: HHV Series
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Material: NP0 (C0G/C0H), X7R
- Series: Mid-High Volts Series
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Multilayer Ceramic Capacitors |
| Series | Mid-High Volts Series (100V~3000V) |
| Specification (Size) | 0402 ~ 1812 |
| Dielectric Types | NP0 (C0G/C0H), X7R, X7S, X7T, X8R, X5R, X6R, X6S |
| Case Sizes (Inch/mm) | 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225), 1808 (4520), 1812 (4532) |
| Rated Voltage | 100Vdc to 3000Vdc |
| Capacitance Range | 0.5pF to 100F (depending on dielectric and size) |
| Tolerance | 0.05pF, 0.1pF, 0.25pF, 0.5pF, 1%, 2%, 5%, 10%, 15%, 20%, -20%~+50% |
| Temperature Coefficient (C0G/C0H) | 0 30 ppm/, 0 60 ppm/ |
| Temperature Coefficient (X7R) | 15% |
| Operating Temperature Range | -55125 |
| Termination Types | Cu/Ni/Sn, Cu/Resin/Ni/Sn |
| Packaging | Paper taping, Embossed taping, Bulk |
| Reel Size | 7 Inch, 13 Inch |
| Dimensions (L x W x T) | Refer to section 6-1 for detailed dimensions per case size. |
| Soldering Method | Reflow Soldering, Wave Soldering |
| Reliability Test Items | Appearance, Size, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure of Substrate, Moisture Resistance, Temperature Cycle, Durability. |
| Storage Conditions | Temperature: 5~40, Relative Humidity: 20%~70% |
| Guaranteed Solderability Period | 6 months (under delivered package condition) |
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