Multilayer Ceramic Capacitors Chinocera HGC0805G0350J500NTGJ General Purpose Series for SMT Applications
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The Hongming HGC series of Multilayer Ceramic Capacitors (MLCCs) are designed for high-density, high-efficiency Surface Mount Technology (SMT) applications. These general-purpose capacitors are available in sizes from 0201 to 1210 and offer a wide range of dielectric materials including NP0 (C0G/C0H), X7R, X5R, X7S, and X6S, ensuring excellent electrical performance and high reliability. They are ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication applications.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Name | Multilayer Ceramic Capacitors | HGC Series |
| Size Range | 0201 ~ 1210 | (0603 to 3225 in mm) |
| Voltage Rating | 4V to 630V DC | (See detailed table for specific ratings per dielectric and size) |
| Capacitance Range | 0.3pF to 220F | (Varies by dielectric and size) |
| Temperature Characteristics | C0G/C0H: 30 ppm/ (-55 to 125) X7R: 15% (-55 to 125) X5R: 15% (-55 to 85) X7S: 22% (-55 to 125) X6S: 22% (-55 to 105) | |
| Dimensions (example: 0805) | Length (L): 2.000.20 mm Width (W): 1.250.20 mm Thickness (T): 0.700.10 mm (G), 0.800.20 mm (H), 1.250.20 mm (L) | |
| Termination Type | Cu/Ni/Sn (N) | |
| Packaging | Paper Taping (T), Bulk (B), Embossed Taping (S) | Reel Sizes: 7 Inch, 13 Inch |
| How to Order (Example) | HGC 0805 R7 104 K 500 N T H J | Series, Size, Dielectric, Capacitance, Tolerance, Voltage, Termination, Packaging, Thickness Code, Reel Size |
| Applications | General digital circuits, Power supply bypass, Consumer electronics, Telecommunication | |
| Reliability Testing | Appearance, Dimensions, Capacitance, DF, IR, DWV, Solderability, Adhesion, Thermal Shock, Flexure, Moisture Resistance, Temperature Cycle, Durability | (See detailed test requirements in the document) |
| Storage Conditions | Temperature: 5~40 Relative Humidity: 20%~70% | Guaranteed solderability period: 6 months |
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