Chinocera HGC0402G09R1C500NTEJ capacitors designed for high density SMT applications and electronic performance
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The Hongming Huaci High-Density Multilayer Ceramic Capacitors (MLCCs) are designed for high-density and high-efficiency SMT applications. Manufactured with NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectrics, these capacitors offer superior electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacity in compact dimensions. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: Hongming Huaci
- Supplier: Suining Hongming Huaci Ceramics Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Series | Series Code | HGC |
| Series Name | General Purpose Series | |
| Voltage Range | 4V ~ 63V | |
| Available Sizes | 0201 ~ 1210 | |
| Part Name | Multilayer Ceramic Capacitors | |
| Ordering Code Breakdown | Series | HGC |
| Size (inch/mm) | 0201 (0603) to 1210 (3225) | |
| Dielectric | R5=X5R, R7=X7R, G0=C0G | |
| Capacitance | e.g., 104=100nF, 105=1F, 106=10F | |
| Tolerance | A=0.05pF, B=0.1pF, C=0.25pF, D=0.5pF, F=1%, G=2%, J=5%, K=10%, L=15%, M=20%, S=-20%~+50% | |
| Rated Voltage | e.g., 4R0=4Vdc, 6R3=6.3Vdc, 500=50Vdc, 101=100Vdc | |
| Termination Type | N=Cu/Ni/Sn, C=Cu/Resin/Ni/Sn | |
| Packaging | Packaging Type | T=Paper taping, B=Bulk, S=Embossed taping |
| Reel Size | J=7Inch, D=13Inch | |
| Temperature Coefficient / Characteristics | Dielectric | C0G, C0H, X7R, X5R, X7S, X6S |
| Reference Temperature Point | 20C | |
| Temperature Coefficient | C0G: 30 ppm/, C0H: 60 ppm/, X7R/X5R: 15%, X7S/X6S: 22% | |
| Operation Temperature Range | -55C to 125C (varies by dielectric) | |
| Note on Class I/II | Class I determined by 20C to 85C capacitance change. Class II determined by capacitance change relative to 20C within the operating range. | |
| External Dimensions | Size (Inch/mm) | 0201 (0603) to 1210 (3225) |
| Length (L), Width (W), Thickness (T) | Varies by size (e.g., 0201: L=0.600.03mm, W=0.300.03mm, T=0.300.03mm) | |
| Thickness Codes | A=0.1mm, B=0.2mm, C=0.3mm, D=0.4mm, E=0.5mm, F=0.6mm, G=0.7mm, H=0.8mm, J=1.0mm, L=1.25mm, P=1.6mm, U=2.0mm, V=2.5mm | |
| Soldering Method | R=Reflow Soldering, W=Wave Soldering | |
| Terminal Width (MB) | Varies by size | |
| Structure | Internal structure details not fully specified, but external dimensions and solderable terminations are provided. | |
| Packaging Standard Quantity | Size | Quantity per reel/tape varies by size and packaging type (Paper tape, Plastic tape, 7" reel). e.g., 0201 (0.30mm C) on paper tape: 15,000 pcs. |
| Example Quantities | 0201 (0.30mm C): 15,000 pcs (Paper tape). 1210 (2.50mm V): 1,000 pcs (Embossed tape). | |
| Capacitance Range and Rated Voltage | Dielectric | C0G/C0H, X7R, X7S, X5R, X6S |
| Size | 0201 to 1210 | |
| Rated Voltage (VDC) | Available from 4Vdc up to 630Vdc (e.g., 4R0, 6R3, 100, 160, 250, 500, 101, 631, 102, 602). Specific voltage availability depends on dielectric and size. | |
| Capacitance Values | Range from 0.3pF (0R3) to 220F (227), depending on dielectric and size. | |
| Example C0G/C0H Capacitance | 0.3pF (0R3) to 0.10F (104) | |
| Example X7R Capacitance | 100pF (101) to 47F (476) | |
| Reliability Test | Appearance & Electrical Performance | No defects, within size range, capacitance within tolerance, DF (Dissipation Factor) and IR (Insulation Resistance) within specified limits. DWV (Dielectric Withstanding Voltage) test applied. |
| Solderability | >95% tinning rate, no visible damage. Tested with leaded and lead-free solder. | |
| Termination Adhesion | No visible damage. Tested with applied force and time (e.g., 0201: 2N for 10s; 1206: 10N). | |
| Resistance to Soldering Heat | Electrical performance within limits (C/C, DF, IR), appearance no damage, tinning rate 95%. Tested with preheating, solder temperature, and recovery time. | |
| Resistance to Flexure of Substrate (Bending Strength) | C/C 10%, no visible damage. Tested on PCB with specified flexure. | |
| Moisture Resistance (Steady State) | C/C within limits (Class I: 2% or 1pF; Class II: 10%). DF and IR within specified limits. No visible damage. Tested at 402C, 90%~95%RH for 500 hours. | |
| Temperature Cycle | C/C within limits (Class I: 1% or 1pF; Class II: 10%). Tested over 5 cycles from -55C to +125C (or other specified temperatures for X5R/X6S). | |
| Durability | C/C within limits (Class I: 2% or 1pF; Class II: 20%). DF and IR within specified limits. No visible damage. Tested at 1.5x rated voltage for 1000 hours at elevated temperatures (125C for C0G/X7R/X7S, 85C for X5R, 105C for X6S). | |
| Pretreatment (Class II) | Capacitor placed at upper category temperature or 150C for 1 hour, then recovered at standard conditions for 241h. | |
| Test Conditions | Specific test temperatures, humidity levels, voltages, and durations are detailed for each test. | |
| Insulation Resistance (IR) | Specified limits based on dielectric type and capacitance. | |
| Dissipation Factor (DF) | Specified limits based on dielectric type, rated voltage, and capacitance. | |
| Dielectric Withstanding Voltage (DWV) | Class I: 300% rated voltage; Class II: 250% rated voltage for 1-5 seconds. No breakdown. | |
| Packaging Details | Paper Taping Dimensions | Detailed dimensions (A0, B0, W, F*, E, P1, P2*, P0, D0, T) provided for 0201/0402 and 0603/0805/1206 sizes. |
| Embossed Taping Dimensions | Detailed dimensions (A, B, C, D*, E, F, G*, H, J, T) provided for 0805~1812 sizes. | |
| Reel Dimensions | Dimensions (A, B, C, D, E, F, G) provided for 7" and 13" reels. | |
| Taping Specification | Top tape peeling strength: 0.1N | |
| Storage Methods | Guaranteed solderability for 6 months under specified conditions: Temperature 5C~40C, Relative Humidity 20%~70%. | |
| Precautions For Use | General Warning | MLCCs may fail short or open, leading to burn out, flaming, or explosion under severe conditions. Follow specifications and contact technical department for clarification. |
| Soldering Profile | Follow recommended temperature profiles to avoid cracking or explosion due to sudden temperature changes. | |
| Manual Soldering | Handle with care to avoid thermal shock; control soldering iron tip temperature and selection. Avoid direct contact with ceramic body. | |
| Solder Amount | Use optimum solder amounts for reflow and wave soldering to ensure proper connection and avoid chip damage. | |
| Typical Characteristic Data Graph | Includes |Z|-Frequency Characteristics, Temperature Characteristics, and DC Bias Characteristics. (Note: These are for reference only.) |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
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Contact Person
Sellina