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High Reliability Multilayer Ceramic Capacitors Chinocera HGC0805G0560J500NTGJ for Consumer Electronics

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Product Description

Product Overview

The General Purpose Series Multilayer Ceramic Capacitors (MLCC) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering superior electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, they provide high capacitance in compact dimensions, making them suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.

Product Attributes

  • Brand: HGC
  • Supplier: Suining Hongming Huaci Technology Co., Ltd.
  • Series: General Purpose Series (4V~63V)
  • Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S

Technical Specifications

Category Specification Details
Series HGC General Purpose Series (4V~63V)
Size (Inch/mm) 0201 (0603) to 1210 (3225)
Dielectric C0G (NP0) Temperature Coefficient: 0 30 ppm/; Operating Temperature: -55125
Dielectric C0H Temperature Coefficient: 0 60 ppm/; Operating Temperature: -55125
Dielectric X7R Temperature Coefficient: 15%; Operating Temperature: -55125
Dielectric X5R Temperature Coefficient: 15%; Operating Temperature: -5585
Dielectric X7S Temperature Coefficient: 22%; Operating Temperature: -55125
Dielectric X6S Temperature Coefficient: 22%; Operating Temperature: -55105
Rated Voltage 4Vdc to 630Vdc (and higher) See section 8 for detailed breakdown
Capacitance Range 0.3pF to 220F See section 8 for detailed breakdown
Dimensions (L x W x T) 0201: 0.600.03 x 0.300.03 x 0.300.03 mm Other sizes available (see section 6-1)
Termination Cu/Ni/Sn (N)
Packaging Paper Taping (T), Bulk (B), Embossed Taping (S) Reel sizes: 7 Inch, 13 Inch
Soldering Method Reflow Soldering (R), Wave Soldering (W)
Reliability Test Items Appearance, Dimensions, Capacitance, DF, IR, DWV, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability See section 9 for detailed requirements and test methods
Storage Conditions Temperature: 5~40, Relative Humidity: 20%~70% Guaranteed solderability period: 6 months

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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