High Density SMT Multilayer Ceramic Capacitors Chinocera HGC0603G0330J500NTHJ General Purpose Series
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The Hongming Huaci Multilayer Ceramic Capacitors (MLCC) General Purpose Series (4V~63V) are designed for high-density and high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectric materials, offering excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in compact dimensions. Key applications include general digital circuits, power supply bypass, consumer electronics, and the telecommunication industry.
Product Attributes
- Brand: Hongming Huaci
- Manufacturer: Suining Hongming Huaci Ceramic Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
| Category | Specification | Details | ||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Part Name | Multilayer Ceramic Capacitors | |||||||||||||||||||||||||||||
| Series | General Purpose Series (4V~63V) | |||||||||||||||||||||||||||||
| Specification | 0201 ~ 1210 Size | |||||||||||||||||||||||||||||
| General Info | Suitable for high density and high efficiency SMT application. | |||||||||||||||||||||||||||||
| Features | Wide size selection (0201 to 1210), High capacity in small size. | |||||||||||||||||||||||||||||
| Applications | General digital circuit, Power supply bypass, Consumer electronics, Telecommunication. | |||||||||||||||||||||||||||||
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | Refer to detailed breakdown in document. | ||||||||||||||||||||||||||||
| Temperature Coefficient / Characteristics |
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| External Dimensions (mm) |
| Soldering Method: R=Reflow, W=Wave | ||||||||||||||||||||||||||||
| Packaging Standard Quantity | See detailed table in document for Paper tape and Plastic tape quantities per reel size. | |||||||||||||||||||||||||||||
| Capacitance Range and Rated Voltage | Detailed tables provided for C0G/C0H, X7R, X7S, X5R, X6S dielectrics across various sizes and voltages. | |||||||||||||||||||||||||||||
| Reliability Test | Includes tests for Appearance, Size, Capacitance, Dissipation Factor, Insulation Resistance, Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, and Durability. | Refer to detailed requirements and test methods in document. | ||||||||||||||||||||||||||||
| Storage Methods | Guaranteed solderability period of 6 months. Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%. | |||||||||||||||||||||||||||||
| Precautions for Use | MLCCs may fail in short or open circuit. Risk of fire, burning, or explosion under severe conditions. Follow specifications and contact technical department for clarification. | |||||||||||||||||||||||||||||
| Soldering Conditions | Recommended temperature profiles for Reflow Soldering (Lead/Lead-free), Wave Soldering, and Hand Soldering. Optimal solder amounts and temperature differentials (T) specified. | Refer to detailed graphs and tables in document. | ||||||||||||||||||||||||||||
| Typical Characteristic Data | Includes |Z|-Frequency Characteristics, Temperature Characteristics, DC Bias Characteristics. | Note: Characteristics are for reference only. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina