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China Multilayer ceramic capacitors Chinocera HHV1206R7102K102NSLJ designed for high density and high voltage SMT applications for sale

Multilayer ceramic capacitors Chinocera HHV1206R7102K102NSLJ designed for high density and high voltage SMT applications

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The Suining Hongming Huaci Technology Co., Ltd. offers a series of Mid-High Voltage Multilayer Ceramic Capacitors (MLCCs) designed for high-density, high-efficiency surface mount applications. These capacitors are constructed with NP0 (C0G/C0H) and X7R dielectrics, providing superior electrical performance and high reliability. They are suitable for a wide range of applications including analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits. Key features include high voltage capability in a given case size and high stability.

Product Attributes

  • Brand: Suining Hongming Huaci Technology Co., Ltd.
  • Series: Mid-High Volts Series (100V~3000V)
  • Materials: NP0 (C0G/C0H), X7R

Technical Specifications

Specification Details
Product Name Multilayer Ceramic Capacitors
Series Mid-High Volts Series (100V~3000V)
Specification (Size) 0402 ~ 1812
Description High voltage ceramic capacitors for high density and high efficiency SMT application. Available in NP0(C0G/C0H)/X7R dielectrics with high reliability and excellent electrical performance.
Features High voltage in a given case size; High stability and reliability.
Applications Analog & Digital Modems, LAN/WAN Interface, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters.
How to Order (Example: HHV1206R7102K202NSL)
  • Series: HHV (High Voltage)
  • Size: 0402 (1005) to 1812 (4532)
  • Dielectric: R7 (X7R), G0 (C0G), H0 (C0H), etc.
  • Capacitance: 102 (1000pF), 103 (10nF), 104 (100nF), etc.
  • Tolerance: K (10%), J (5%), M (20%), etc.
  • Rated Voltage: 202 (2000 Vdc), 101 (100 Vdc), 302 (3000 Vdc), etc.
  • Termination: N (Cu/Ni/Sn)
  • Packaging: T (Paper taping), B (Bulk), S (Embossed taping)
  • Thickness Symbol: E (0.5mm), H (0.8mm), L (1.25mm), P (1.6mm), U (2.0mm), V (2.5mm)
  • Reel Size: J (7Inch), D (13Inch)
Temperature Coefficient / Characteristics
  • C0G: 30 ppm/, -55125
  • C0H: 60 ppm/, -55125
  • X7R: 15%, -55125
  • X7S: 22%, -55125
External Dimensions (Example: 0402)
Size (Inch/mm)Length L (mm)Width W (mm)Thickness T (mm)/SymbolSoldering MethodMB (mm)
0402 (1005)1.000.050.500.050.500.05 ER0.250.10
0603 (1608)1.600.200.800.200.800.20 HR / W0.400.15
0805 (2012)2.000.201.250.200.700.10 G / 0.800.20 H / 1.250.20 LR / W0.500.20
1206 (3216)3.200.201.600.200.800.20 H / 1.000.10 J / 1.250.20 L / 1.600.20 PR / W0.600.20
1210 (3225)3.200.302.500.201.250.20 L / 1.600.20 P / 2.000.20 U / 2.500.20 VR0.750.25
1808 (4520)4.50.402.00.251.250.20 L / 1.600.20 P / 2.000.20 UR0.750.25
1812 (4532)4.50.403.20.301.250.20 L / 1.600.20 P / 2.000.20 U / 2.500.30 VR0.750.25
Note: R=Reflow Soldering, W=Wave Soldering
Packaging Standard Quantity (Example: 0402, 0.500.05mm Thickness E) Paper tape: 10,000 pcs
Capacitance Range and Rated Voltage (Example: C0G/C0H Dielectric, 0805 Size) See detailed tables in the original document for specific combinations of dielectric, size, rated voltage, and capacitance.
Reliability Test - Appearance and Electrical Performance
  • Appearance: No remarkable defects or abnormalities.
  • Size: Within specified range.
  • Capacitance: Within specified tolerance. (Test conditions vary by dielectric type and capacitance value).
  • Dissipation Factor (DF): Specified limits for Class I and Class II.
  • Insulation Resistance (IR): Specified limits for Class I and Class II.
Reliability Test - General
  • Dielectric Withstanding Voltage (DWV): No breakdown or damage under specified voltage and duration.
  • Solderability: At least 95% terminal electrode covered by new solder; no visible damage.
  • Termination Adhesion: No visible damage under applied force.
  • Resistance to Soldering Heat: Electrical performance within limits, appearance no visible damage, solderability 95%.
  • Resistance to Flexure of Substrate: C/C 10%, no visible damage.
  • Moisture Resistance (Steady State): C/C within specified limits, DF 2x initial, IR within specified limits, no visible damage.
  • Temperature Cycle: C/C within specified limits.
  • Durability: C/C within specified limits, DF 2x initial, IR within specified limits, no visible damage.
Storage Method
  • Guaranteed Period for Solderability: 6 months (under delivered package condition).
  • Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%.
Precautions For Use
  • MLCCs may fail in short or open circuit. Extreme conditions can lead to burn out, flaming, or explosion. Adhere to specifications and contact technical department for clarification.
  • Soldering Conditions: Follow temperature profile charts to avoid chip cracking or local explosion due to sudden temperature changes.
  • Manual Soldering: Handle with care to avoid thermal cracks. Avoid direct contact of soldering iron tip with ceramic body.
  • Solder Amount: Use optimum solder amount to avoid chip damage or poor connection.
  • Soldering Temperature Profile: Recommended profiles for Reflow Soldering (SnPb and Lead-free) and Wave Soldering are provided. Temperature differential (T) limits are specified for different series.
  • Hand Soldering Conditions: Preheating, soldering iron temperature, power, tip diameter, and soldering time are specified. Avoid direct contact between soldering iron head and ceramic components.

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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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