| General Information | - Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Issue Date: 20201116
- Product Name: Multilayer Ceramic Capacitors
- Series: General Purpose Series (4V~63V)
- Specification: 0201 ~ 1210 Size
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| Product Features | - Wide selection of sizes: 0201 to 1210 available.
- High capacity achievable in small sizes.
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| Applications | - General digital circuits
- Power supply bypass capacitors
- Consumer electronics
- Telecommunication industry
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| How to Order (Part Number Structure) | HGC (Series) + Size + Dielectric + Capacitance + Tolerance + Rated Voltage + Termination + Packaging + Thickness Code + Reel Size |
| Temperature Coefficient / Characteristics | | Dielectric | Reference Temp. | Temp. Coefficient | Operating Temp. Range | | C0G | 20C | 30 ppm/ | -55C125C | | C0H | 20C | 60 ppm/ | -55C125C | | X7R | 20C | 15% | -55C125C | | X5R | 20C | 15% | -55C85C | | X7S | 20C | 22% | -55C125C | | X6S | 20C | 22% | -55C105C | |
| External Dimensions (Sample) | | Size (Inch/mm) | Length L (mm) | Width W (mm) | Thickness T (mm) | | 0201 (0603) | 0.600.03 | 0.300.03 | 0.300.03 | | 0402 (1005) | 1.000.05 | 0.500.05 | 0.500.05 | | 0603 (1608) | 1.600.20 | 0.800.20 | 0.800.20 | | 0805 (2012) | 2.000.20 | 1.250.20 | 0.700.10 | | 1206 (3216) | 3.200.20 | 1.600.20 | 0.700.10 | | 1210 (3225) | 3.200.30 | 2.500.30 | 1.250.20 | |
| Packaging Standard Quantity | | Size | Thickness (mm) | Paper Tape (7" reel) | Plastic Tape (7" reel) | | 0201 (0603) | 0.300.03 | 15,000 | - | | 0402 (1005) | 0.500.05 | 10,000 | - | | 0603 (1608) | 0.800.20 | 4000 | - | | 0805 (2012) | 0.700.10 | 4000 | - | | 0805 (2012) | 0.800.20 | 4000 | - | | 0805 (2012) | 1.250.20 | - | 2000/3000 | | 1206 (3216) | 0.700.10 | 4000 | - | | 1206 (3216) | 0.800.20 | 4000 | - | | 1206 (3216) | 1.000.10 | - | 3000 | | 1206 (3216) | 1.250.20 | - | 3000 | | 1206 (3216) | 1.600.20 | - | 2000 | | 1210 (3225) | 1.250.20 | - | 2000 | | 1210 (3225) | 1.600.20 | - | 2000 | | 1210 (3225) | 2.000.20 | - | 2000 | | 1210 (3225) | 2.500.30 | - | 1000 | |
| Capacitance Range and Rated Voltage (Sample) | | Dielectric | Size | Rated Voltage (VDC) | Capacitance | | C0G/C0H | 0201 | 16, 25, 50 | 0.3pF to 0.10F | | 0402 | 25, 50 | 0.3pF to 0.12F | | 0603 | 25, 50 | 0.3pF to 0.12F | | 0805 | 25, 50 | 0.3pF to 0.12F | | X7R | 0201 | 6.3, 10, 16, 25, 50 | 100pF to 0.10F | | 0402 | 6.3, 10, 16, 25, 50 | 100pF to 0.12F | | 0603 | 6.3, 10, 16, 25, 50 | 100pF to 0.15F | | 0805 | 6.3, 10, 16, 25, 50 | 100pF to 1.0F | | X7S | 0402 | 6.3, 10, 16, 25 | 1.0F to 22F | | X5R | 0201 | 6.3, 10, 16, 25, 50 | 100pF to 0.10F | | X5R | 0402 | 6.3, 10, 16, 25, 50 | 100pF to 0.15F | | X5R | 0603 | 6.3, 10, 16, 25, 35, 50 | 100pF to 0.22F | | X5R | 0805 | 6.3, 10, 16, 25, 35, 50 | 100pF to 0.47F | | X5R | 1206 | 6.3, 10, 16, 25, 35, 50 | 100pF to 1.0F | | X5R | 1210 | 4, 6.3, 10, 16, 25, 35, 50 | 100pF to 220F | | X6S | 0402 | 6.3, 10, 16, 25 | 0.10F to 0.47F | | X6S | 0603 | 4, 6.3, 10, 16, 25 | 0.10F to 0.68F | | X6S | 0805 | 4, 6.3, 10, 16, 25, 50 | 0.10F to 1.0F | | X6S | 1206 | 4, 6.3, 10, 16, 25, 50 | 0.10F to 10F | | X6S | 1210 | 4, 6.3, 10, 16, 25, 50 | 0.10F to 220F | |
| Reliability Test (Sample) | | No. | Item | Technical Requirements | Test Method | | 1 | Appearance | No remarkable defects or abnormalities. | Through microscope (10) | | 2 | Size | Within the specified size range. | Using a vernier caliper | | 3 | Capacitance | Should be within the specified tolerance. | Test Temp: 253C; Conditions vary by dielectric and capacitance. | | 4 | Dissipation Factor (DF, tan) | Refer to specifications for Class I and Class II. | Test Temp: 253C; Conditions vary by dielectric and capacitance. | | 5 | Insulation Resistance (IR) | Refer to specifications for Class I and Class II. | Test Temp: 253C; Humidity: 75% | | 6 | Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Class I: 300% Rated voltage; Class II: 250% Rated voltage. Duration: 1~5s. | | 7 | Solderability | At least 95% of the terminal electrode is covered by new solder. No visible damage. | Lead-free: 2455C, 20.5s; Leaded: 2355C, 20.5s. | | 8 | Termination Adhesion | No visible damage. | Force applied varies by size (2N to 10N). Time: 101s. | | 9 | Resistance to Soldering Heat | Electrical performance and appearance requirements met. | Preheating, Solder Temp: 2655C, Duration: 101s. Recovery: 242h. | | 10 | Resistance to Flexure of Substrate | C/C: 10%; Appearance: No visible damage. | PCB Thickness: 1.60.2mm, Flexure: 1mm. | | 11 | Moisture Resistance (Steady State) | C/C: Class I: 2% or 1pF; Class II: 10%. DF, IR, Appearance requirements met. | Temp: 402C, Humidity: 90%~95%RH, Duration: 500h. Recovery: 242h. | | 12 | Temperature Cycle | C/C: Class I: 1% or 1pF; Class II: 10%. | 5 cycles. Temp range: -55C to +125C (varies by dielectric). | | 13 | Durability | C/C: Class I: 2% or 1pF; Class II: 20%. DF, IR, Appearance requirements met. | Applied Voltage: 1.5x Rated Voltage. Duration: 1000h. Temp: 85C to 125C (varies by dielectric). | |
| Packaging Details | | Section | Details | | Paper Taping Dimensions | Dimensions provided for 0201, 0402, 0603, 0805, 1206 types. | | Embossed Taping Dimensions | Dimensions provided for 0805~1812 types. | | Reel Dimensions | Available for 7" and 13" reels (8mm, 12mm width tape). | | Taping Specification | Top tape peeling strength: 0.1N | |
| Storage Methods | - Guaranteed solderability period: 6 months (under delivered package condition).
- Storage Temperature: 5C~40C
- Storage Relative Humidity: 20%~70%
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| Precautions For Use | - MLCCs may fail in short or open circuits. Severe conditions can lead to burn out, flaming, or explosion.
- Adhere to specifications and contact technical support for clarification.
- Soldering conditions and temperature profiles must be followed to prevent cracking or explosion.
- Manual soldering requires careful operation, tip selection, and temperature control to avoid thermal shock.
- Use optimum solder amounts for reflow and wave soldering to ensure proper connection and prevent damage.
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| Recommended Soldering Temperature Profile | - Reflow Soldering: Profiles provided for SnPb and Lead-free. Temperature differential (T) should be minimized (150C for most sizes, 130C for HGC1210).
- Wave Soldering: Profile provided. Temperature differential (T) should be minimized (150C for HGC0603/0805/1206).
- Hand Soldering: Conditions specified: Preheating 130C, Max Temp: 350C, Power: 20W, Tip Diameter: 1mm recommended, Duration: Max 3s. Avoid direct contact with ceramic components.
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| Typical Characteristic Data Graph | - |Z|-Frequency Characteristics Curve
- Temperature Characteristics
- DC Bias Characteristics
Note: The above product characteristics are for reference only. |