High Voltage Multilayer Ceramic Capacitors Chinocera HHV0603G0220J251NTHJ with Case Sizes from 0402 to 1812
Product Overview
The HHV series of Multilayer Ceramic Capacitors (MLCCs) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R dielectrics, offering superior electrical performance and high reliability. They are suitable for mid-to-high voltage applications ranging from 100V to 3000V, with case sizes from 0402 to 1812. Key features include high voltage capability in a given case size, high stability, and reliability. Applications include analog & digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV Series
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Origin: China
- Dielectric Materials: NP0 (C0G, C0H), X7R
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Product Series | Mid-High Volts Series | 100V ~ 3000V |
| Case Sizes | 0402 ~ 1812 | (1005 to 4532 metric) |
| Dielectric Types | NP0 (C0G/C0H), X7R | |
| Capacitance Range (Example) | 0.5pF to 10F (for C0G/C0H) | 0.10F to 4.7F (for X7R) |
| Rated Voltage | 100 Vdc to 3000 Vdc | (Specific values vary by dielectric and case size) |
| Temperature Coefficient (C0G/C0H) | 30 ppm/ (C0G), 60 ppm/ (C0H) | Operating Temp: -55 ~ 125 |
| Temperature Coefficient (X7R) | 15% | Operating Temp: -55 ~ 125 |
| Dimensions (Example: 0402) | Length: 1.000.05 mm | Width: 0.500.05 mm, Thickness: 0.500.05 mm |
| Dimensions (Example: 1812) | Length: 4.50.40 mm | Width: 3.20.30 mm, Thickness: 1.250.20 mm |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) | |
| Packaging Options | Paper Taping, Embossed Taping, Bulk | 7-inch and 13-inch reels available |
| Reliability Tests | Dielectric Withstanding Voltage, Solderability, Termination Adhesion, Resistance to Soldering Heat, Temperature Cycle, Durability, Moisture Resistance | (Refer to datasheet for detailed requirements) |
| Storage Conditions | Temperature: 5~40 | Relative Humidity: 20%~70% |
| Guaranteed Solderability Period | 6 months | (Under delivered package condition) |
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