Multilayer Ceramic Capacitors Chinocera HGC0603G0220J500NTHJ General Purpose Series 4V to 63V for SMT Applications
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Product Description
Multilayer Ceramic Capacitors (MLCC) - General Purpose Series (4V~63V)
Product Overview
These multilayer ceramic capacitors are designed for high-density and high-efficiency SMT applications. Manufactured using NP0 (C0G, C0H), X7R, X5R, X7S, and X6S dielectric materials, they offer superior electrical performance and high reliability. Available in a wide range of sizes from 0201 to 1210, these capacitors provide high capacity in small sizes, making them suitable for general digital circuits, power supply bypass, consumer electronics, and telecommunication industries.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
Model Designation
HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size]
Available Sizes
0201 (0603) to 1210 (3225)
Dielectric Characteristics
| Dielectric Type | Reference Temperature Point | Nominal Temperature Coefficient | Operation Temperature Range |
|---|---|---|---|
| C0G | 20C | 30 ppm/ | -55C125C |
| C0H | 20C | 60 ppm/ | -55C125C |
| X7R | 20C | 15% | -55C125C |
| X5R | 20C | 15% | -55C85C |
| X7S | 20C | 22% | -55C125C |
| X6S | 20C | 22% | -55C105C |
Product Dimensions (Example: 0201 Size)
| Size (Inch/mm) | Length L (mm) | Width W (mm) | Thickness T (mm) / Symbol | Soldering Method | Terminal Width MB (mm) |
|---|---|---|---|---|---|
| 0201 (0603) | 0.600.03 | 0.300.03 | 0.300.03 C | R | 0.150.05 |
| 0402 (1005) | 1.000.05 | 0.500.05 | 0.500.05 E(C105) | R | 0.250.10 |
Packaging Standard Quantity
| Size (mm) | Thickness (mm) / Symbol | Paper Tape (7" Reel) | Plastic Tape (7" Reel) |
|---|---|---|---|
| 0201 (0603) | 0.300.03 C | 15,000 | ------- |
| 0402 (1005) | 0.500.05 E(C105) | 10,000 | ------- |
Capacitance Range and Rated Voltage (Example: C0G/C0H Dielectric)
| Dielectric | Size | Rated Voltage (VDC) | Capacitance |
|---|---|---|---|
| C0G, C0H | 0201 | 16 | 0.3pF (0R3) to 100pF (101) |
| 25 | 10pF (100) to 100pF (101) | ||
| 50 | 10pF (100) to 100pF (101) | ||
| 25 | 120pF (121) to 0.10F (104) |
Reliability Test - Electrical Performance
| No. | Item | Technical Requirements | Test Method and Remarks |
|---|---|---|---|
| 3 | Capacitance | Should be within the specified tolerance. | Test Temp: 253. Test Conditions vary by Class (I/II) and capacitance value. |
| 4 | Dissipation Factor (DF, tan) | Specifications vary by Class (I/II), rated voltage, and capacitance. | Test Temp: 253. Test Conditions vary by Class (I/II) and capacitance value. |
| 5 | Insulation Resistance (IR) | Specifications vary by Class (I/II) and capacitance. | Test Temp: 253, Humidity: 75%. |
| 6 | Dielectric Withstanding Voltage (DWV) | No breakdown or damage. | Class I: 300% Rated voltage; Class II: 250% Rated voltage. Duration: 1~5s. |
Reliability Test - Mechanical/Environmental
| No. | Item | Technical Requirements | Test Method and Remarks |
|---|---|---|---|
| 7 | Solderability | At least 95% of the terminal electrode is covered by new solder. No visible damage. | Preheating, Sn/Pb or Lead-free solder dip at specified temperatures and times. |
| 8 | Termination Adhesion | No visible damage. | Applied Force and Time vary by size (e.g., 0201: 2N for 101S). |
| 9 | Resistance to Soldering Heat | C/C and DF within limits. No visible damage. | Preheating, solder dip at specified temperatures and times. Recovery time: 242h. |
| 11 | Moisture Resistance (Steady State) | C/C, DF, and IR within specified limits. No visible damage. | Temp: 402, Humidity: 90%~95%RH, Duration: 500h. Recovery time: 242h. |
| 12 | Temperature Cycle | C/C within specified limits. | 5 cycles of temperature extremes (-55C to +125C/85C/105C). Recovery time: 242h. |
| 13 | Durability | C/C, DF, and IR within specified limits. No visible damage. | Applied Voltage: 1.5x Rated Voltage. Temperature: 125C/85C/105C. Duration: 1000h. Recovery time: 242h. |
Storage Methods
- Guaranteed Solderability Period: 6 months (under delivered package condition).
- Storage Conditions: Temperature: 5~40, Relative Humidity: 20%~70%.
Precautions for Use
- MLCCs may fail in short or open circuit modes. Severe conditions beyond ratings can cause fire, burning, or explosion. Follow specifications and contact technical support for any uncertainties.
- Soldering profiles must be followed to avoid cracking or local explosions due to sudden temperature changes.
- Manual soldering requires careful operation to prevent thermal shock and damage.
- Ensure optimum solder amount for reflow and wave soldering to avoid chip damage or poor connection.
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