General Purpose Series Multilayer Ceramic Capacitors Chinocera HGC0805G04R7C500NTGJ for SMT Applications
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The HGC General Purpose Series Multilayer Ceramic Capacitors (MLCCs) are designed for high-density, high-efficiency SMT applications. These capacitors are manufactured using NP0 (C0G/C0H), X7R, X5R, X7S, and X6S dielectric materials, offering excellent electrical performance and high reliability. They are available in a wide range of sizes from 0201 to 1210, providing high capacitance in compact dimensions. Ideal for general digital circuits, power supply bypass, consumer electronics, and telecommunication applications.
Product Attributes
- Brand: HGC
- Supplier: Suining Hongming Huaci Technology Co., Ltd.
- Series: General Purpose Series (4V~63V)
- Dielectric Materials: NP0 (C0G/C0H), X7R, X5R, X7S, X6S
Technical Specifications
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| Product Name | Multilayer Ceramic Capacitors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Series | General Purpose Series (4V~63V) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Specification (Size) | 0201 ~ 1210 Size | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Supplier | Suining Hongming Huaci Technology Co., Ltd. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Issue Date | 20201116 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Model Designation | HGC [Size] [Dielectric] [Capacitance] [Tolerance] [Rated Voltage] [Termination] [Packaging] [Thickness Code] [Reel Size] | See detailed breakdown in document. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Available Sizes (Inch/mm) | 0201 (0603), 0402 (1005), 0603 (1608), 0805 (2012), 1206 (3216), 1210 (3225) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dielectric Characteristics |
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| External Dimensions (mm) |
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| Packaging Standard Quantity (Pieces/Reel) |
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| Capacitance Range & Rated Voltage | See detailed tables in document (Pages 5-7) for specific dielectric types (C0G/C0H, X7R, X7S, X5R, X6S) and size combinations. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Reliability Test Standards | Appearance, Dimensions, Capacitance, Dissipation Factor (DF), Insulation Resistance (IR), Dielectric Withstanding Voltage (DWV), Solderability, Termination Adhesion, Resistance to Soldering Heat, Resistance to Flexure, Moisture Resistance, Temperature Cycle, Durability. | Detailed requirements and test methods are provided in the document (Pages 8-13). | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Storage Method | Guaranteed solderability for 6 months (under delivered package condition). Storage Conditions: Temperature 5~40, Relative Humidity 20%~70%. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Conditions | Reflow Soldering (Lead/Lead-free), Wave Soldering, Manual Soldering. Temperature profiles and recommended solder amounts are provided in the document. | Preheating temperature differentials (T) specified for different sizes. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina