High Voltage NP0 X7R Dielectric Multilayer Ceramic Capacitors Chinocera HHV0603R7681K101NTHJ for SMT
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The HHV series of Multilayer Ceramic Capacitors (MLCCs) from Suining Hongming Huaci Technology Co., Ltd. are designed for high-density, high-efficiency surface-mount applications. These capacitors are manufactured using NP0 (C0G, C0H) and X7R dielectric materials, offering superior electrical performance and high reliability. They are suitable for mid-to-high voltage applications ranging from 100V to 3000V, with case sizes from 0402 to 1812. Key features include high voltage in a given case size, high stability, and reliability. Applications include analog and digital modems, LAN/WAN interfaces, voltage multipliers, DC-DC converters, and back-lighting inverter circuits.
Product Attributes
- Brand: HHV
- Manufacturer: Suining Hongming Huaci Technology Co., Ltd.
- Series: Mid-High Volts Series (100V~3000V)
- Dielectric Materials: NP0 (C0G, C0H), X7R
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Multilayer Ceramic Capacitors |
| Series | Mid-High Volts Series (100V~3000V) |
| Specification (Size) | 0402 ~ 1812 |
| Description | High voltage ceramic capacitors for high density and high efficiency SMT application. Available in NP0(C0G/C0H)/X7R dielectrics with high reliability and excellent electrical performance. |
| Features | High voltage in a given case size; High stability and reliability. |
| Applications | Analog & Digital Modems, LAN/WAN Interface, Voltage Multipliers, DC-DC Converters, Back-lighting Inverters. |
| Temperature Coefficient/Characteristics (C0G) | Reference Temperature: 20C; Temperature Coefficient: 30 ppm/; Operating Temperature Range: -55125 |
| Temperature Coefficient/Characteristics (C0H) | Reference Temperature: 20C; Temperature Coefficient: 60 ppm/; Operating Temperature Range: -55125 |
| Temperature Coefficient/Characteristics (X7R) | Reference Temperature: 20C; Temperature Coefficient: 15%; Operating Temperature Range: -55125 |
| Temperature Coefficient/Characteristics (X7S) | Reference Temperature: 20C; Temperature Coefficient: 22%; Operating Temperature Range: -55125 |
| External Dimensions (Example: 0402) | Length: 1.000.05mm, Width: 0.500.05mm, Thickness: 0.500.05mm |
| External Dimensions (Example: 0603) | Length: 1.600.20mm, Width: 0.800.20mm, Thickness: 0.800.20mm |
| External Dimensions (Example: 0805) | Length: 2.000.20mm, Width: 1.250.20mm, Thickness: 0.700.10mm or 0.800.20mm |
| External Dimensions (Example: 1206) | Length: 3.200.20mm, Width: 1.600.20mm, Thickness: 0.800.20mm |
| External Dimensions (Example: 1210) | Length: 3.200.30mm, Width: 2.500.20mm, Thickness: 1.250.20mm |
| External Dimensions (Example: 1808) | Length: 4.50.40mm, Width: 2.00.25mm, Thickness: 1.250.20mm |
| External Dimensions (Example: 1812) | Length: 4.50.40mm, Width: 3.20.30mm, Thickness: 1.250.20mm |
| Soldering Method | Reflow Soldering (R), Wave Soldering (W) |
| Packaging Standard Quantity (Example: 0402, 0.500.05mm Thickness) | Paper tape: 10,000 pcs |
| Packaging Standard Quantity (Example: 0603, 0.800.20mm Thickness) | Paper tape: 4000 pcs |
| Packaging Standard Quantity (Example: 0805, 0.700.10mm Thickness) | Paper tape: 4000 pcs |
| Packaging Standard Quantity (Example: 1206, 1.600.20mm Thickness) | Paper tape: 2000 pcs |
| Packaging Standard Quantity (Example: 1210, 2.500.30mm Thickness) | Plastic Tape: 1000 pcs |
| Packaging Standard Quantity (Example: 1812, 2.500.30mm Thickness) | Plastic Tape: 500 pcs |
| Reliability Test: Appearance | No remarkable defects or abnormalities. |
| Reliability Test: Capacitance (Class I C0G/C0H) | Within specified tolerance. Test temp: 253; Test freq: 1MHz10% (C1000pF), 1KHz10% (C>1000pF); Voltage: 1.00.2Vrms. |
| Reliability Test: Capacitance (Class II X7R) | Within specified tolerance. Test temp: 253; Test freq: 1KHz10% (C10F), 12024 Hz (C>10F); Voltage: 1.00.2Vrms (C10F), 0.50.1Vrms (C>10F). |
| Reliability Test: Dissipation Factor (DF, tan) (Class I C0G/C0H) | 0.56% (Cr1000pF, 1KHz). |
| Reliability Test: Dissipation Factor (DF, tan) (Class II X7R) | 2.5% (Test temp: 253; Test freq: 1KHz10% or 12024 Hz; Voltage: 1.00.2Vrms or 0.50.1Vrms). |
| Reliability Test: Insulation Resistance (IR) (Class I C0G/C0H) | C10 nF: Ri50000M; C>10 nF: RiCR500S. Test voltage: Rated Voltage (Max 500V); Duration: 605s; Temp: 253; Humidity: 75%. |
| Reliability Test: Insulation Resistance (IR) (Class II X7R) | C25 nF: Ri10000M; C>25 nF: RiCR>100S. |
| Reliability Test: Dielectric Withstanding Voltage (DWV) | No breakdown or damage. Applied voltage: 200% Vr (100VVr |
| Reliability Test: Solderability | 95% tinning rate, no visible damage. Lead-free solder temp: 2455, duration: 20.5s. |
| Reliability Test: Termination Adhesion | No visible damage. Applied Force: 5N (0402-0805), 10N (1206). Duration: 101s. |
| Reliability Test: Resistance to Soldering Heat | Electrical performance and appearance requirements met. Preheating 100-200 for 20.5min. Solder temp 2655 for 101s. Recovery 242h. |
| Reliability Test: Resistance to Flexure of Substrate (Bending Strength) | C/C 10%; Appearance: No visible damage. Test Board thickness: 1.60.2mm. Flexure: 1mm. Holding time: 51s. |
| Reliability Test: Moisture Resistance (Steady State) | C/C: Class I 2% or 1pF (whichever is larger); Class II 10%. DF 2x initial. IR: Class I 2500M or RiCR25S (whichever is smaller); Class II 1000M or RiCR25S (whichever is smaller). Temp: 402; Humidity: 90%~95%RH; Duration: 500h. Recovery: 242h. |
| Reliability Test: Temperature Cycle | C/C: Class I 1% or 1pF (whichever is larger); Class II 10%. 5 cycles: -55 (30min), +20 (2-3min), +125 (30min), +20 (2-3min). Recovery: 242h. |
| Reliability Test: Durability | C/C: Class I 2% or 1pF (whichever is larger); Class II 20%. Applied Voltage: 2x Vr (1000V). Temp: 125; Duration: 1000h. Recovery: 242h. DF 2x initial. IR: Class I 4000M or RiCR40S (whichever is smaller); Class II 2000M or RiCR50S (whichever is smaller). |
| Storage Method | Guaranteed solderability period: 6 months. Storage Temperature: 5~40; Relative Humidity: 20%~70%. |
| Soldering Profile (Reflow) | Refer to provided temperature profile graphs for SnPb and Lead-free. T 150 (0603/0805/1206), T 130 (1210/1808/1812). |
| Soldering Profile (Wave) | Refer to provided temperature profile graph. T 150 (0603/0805/1206). |
| Soldering Profile (Hand) | Preheating T130; Soldering iron temp: Max 350; Power: Max 20W; Diameter: 1mm recommended; Duration: Max 3s; Solder paste: 1/2 chip thickness. Avoid direct contact with ceramic. |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina