Wire wound chip common mode choke coil cjiang FDCW2012-2-501TF compact design for high speed line noise reduction

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Product Description

Product Overview

The FDCW2012 series wire wound chip common mode choke coils offer excellent noise suppression performance with high common mode impedance at high frequencies. These coils are designed in a compact and low-profile 2.0*1.2*1.2 mm package. They are 100% Lead (Pb) & Halogen-Free and RoHS compliant. Applications include power switches, servers, telecommunication systems, USB communication, LCD panel links, and countering common mode noise in high-speed lines.

Product Attributes

Series Name: FDCW
Compliance: 100% LeadPb& Halogen-Free, RoHS compliant
Hazardous Substance Free Products (HSF Products)

Technical Specifications

Part Number	Common Mode Impedance (@100MHz) ( 25%)	DCR (m) MAX	Rated Voltage (Vdc)	IR (mA) MIN
FDCW2012-2-300TF	30	200	10	50
FDCW2012-2-500TF	50	250	10	50
FDCW2012-2-750TF	75	250	10	50
FDCW2012-2-900TF	90	300	10	50
FDCW2012-2-121TF	120	300	10	50
FDCW2012-2-161TF	160	350	10	50
FDCW2012-2-181TF	180	350	10	50
FDCW2012-2-201TF	200	350	10	50
FDCW2012-2-221TF	220	350	10	50
FDCW2012-2-251TF	250	400	10	50
FDCW2012-2-261TF	260	400	10	50
FDCW2012-2-301TF	300	400	10	50
FDCW2012-2-361TF	360	400	10	50
FDCW2012-2-371TF	370	450	10	50
FDCW2012-2-481TF	480	550	10	50
FDCW2012-2-501TF	500	550	10	50
FDCW2012-2-601TF	600	550	10	50
FDCW2012-2-671TF	670	600	10	50
FDCW2012-2-681TF	680	700	10	50
FDCW2012-2-751TF	750	800	10	50
FDCW2012-2-801TF	800	1000	10	50
FDCW2012-2-901TF	900	1000	10	50
FDCW2012-2-102TF	1000	1000	10	50

Dimension	A (mm)	B (mm)	C (mm)	D (mm)	E (mm)
Value	2.000.20	1.200.20	1.200.20	0.5TYP	0.5TYP

Structure and Components	Part Name	Material Name
	Lid	Ni-Zn Ferrite
	Epoxy	Epoxy resin
	Wire	Enameled copper wire
	Core	Ni-Zn Ferrite
	Electrode structure	Ag+Ni+Sn plating

Operating Condition	Value
Operating temperature range	-40 C to +85 C
Maximum part temperature (ambient + temp rise)	125 C

Packaging Information	Value
Tape Packaging Dimension W (mm)	8.00 0.10
Tape Packaging Dimension P1 (mm)	4.00 0.10
Tape Packaging Dimension A0 (mm)	1.50 0.10
Tape Packaging Dimension B0 (mm)	2.30 0.10
Tape Packaging Dimension K0 (mm)	1.45 0.10
Tape Packaging Dimension t (mm)	0.20 0.05
Tape Packaging Dimension E (mm)	1.75 0.10
Tape Packaging Dimension F (mm)	3.50 0.10
Tape Packaging Dimension P2 (mm)	2.00 0.10
Tape Packaging Dimension D0 (mm)	1.55 0.05
Tape Packaging Dimension D1 (mm)	0.80 0.05
Tape Packaging Dimension P0 (mm)	4.00 0.10
Reel Inner box Quantity	5 Reel / box (10000 pcs)
Carton box Quantity	10 Middle boxes (100000 pcs)
Peel force of top cover tape	10 to 100gf
Peel speed of top cover tape	About 300mm/minute

Reliability Test Items	Requirements	Test Methods and Remarks
Operating life	1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min	1. Reflow 2 times 2. Temperature: 155 2
Resistance to Soldering Heat	1. No visible mechanical damage 2. Impedance change: Within20%	1. Solder on PCB to Reflow test Peak Temp. 2605510 secs ,Cycles :2 times. 2. Test board thickness: 1.5mm 3. Test board material: glass epoxy resin 4. Storage: 1 hour at standard atmospheric conditions before measurement.
High Temperature	1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min	1. Temperature: 1252 2. Duration: 1000 hours 3. Storage: 1 hour at standard atmospheric conditions before measurement.
Steady damp-heat	1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min	1. Temperature:85 2. Humidity: 85% RH 3. Duration:1000 hours 4. Storage: 1 hour at standard atmospheric conditions before measurement.
Mechanical Vibration	1. No visible mechanical damage 2. Impedance change: Within 20%	1. Frequency: 10HZ55HZ10HZ/Min Cycles 2. Amplitude: 1.5 mm 3. Directions: X,Y,Z 4. Time: 2 hours in each direction (total of 6 hours)
Thermal Shock	1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min	1. Temperature and time: -40for 303 min125for 303min. 2. Transforming interval: Max. 3 Min 3. Tested cycle: 1000 cycles 4. Storage: 1 hour at standard atmospheric conditions before measurement.
Salt Spray	1. No visible mechanical damage 2. Impedance change: Within 20%	1. Salt concentration: (5 1)% (mass percent) 2. pH value: 6.5 - 7.2 3. Temperature: 35 2 4. Humidity: 85% 5. Time: 24 hours 6. Inductance measurement after 1-2 hours in normal temperature and humidity. Inductance value change cannot be more than 10% before test.
Terminal strength	No visible mechanical damage	1. Electrode soldered to PCB, apply force as per Fig-3. 2. Force: 5N. 3. Keep time: 10(1)s. 4. Test speed: 3 ~ 8mm/min.