Wire wound chip common mode choke coil cjiang FDCW2012-2-102TF designed for power switches and noise reduction
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The FDCW2012 series of wire wound chip common mode choke coils offers excellent noise suppression performance with high common mode impedance at high frequencies. These coils are designed in a compact and low-profile 2.0*1.2*1.2 mm package, making them suitable for space-constrained applications. They are 100% Lead (Pb) & Halogen-Free and RoHS compliant, ensuring environmental responsibility. Applications include power switches, servers, telecommunication equipment, USB communication, panel links for LCD panels, and countering common mode noise in high-speed lines.
Product Attributes
- Series Name: FDCW
- Compliance: 100% LeadPb& Halogen-Free, RoHS compliant
- Product Type: Wire Wound Chip Common Mode Choke Coil
- HSF Products: Yes (Hazardous Substance Free Products)
Technical Specifications
| Part Number | Common Mode Impedance (@100MHz) ( 25%) | DCR (m) MAX | Rated Voltage (Vdc) | Rated Current (mA) | Dimensions (mm) | Operating Temperature Range (C) |
|---|---|---|---|---|---|---|
| FDCW2012-2-300TF | 30 | 200 | 50 | 450 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-500TF | 50 | 250 | 50 | 550 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-750TF | 75 | 250 | 50 | 400 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-900TF | 90 | 300 | 50 | 400 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-121TF | 120 | 300 | 50 | 400 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-161TF | 160 | 350 | 50 | 350 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-181TF | 180 | 350 | 50 | 350 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-201TF | 200 | 350 | 50 | 300 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-221TF | 220 | 350 | 50 | 300 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-251TF | 250 | 400 | 50 | 300 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-261TF | 260 | 400 | 50 | 300 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-301TF | 300 | 400 | 50 | 290 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-361TF | 360 | 400 | 50 | 300 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-371TF | 370 | 450 | 50 | 280 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-481TF | 480 | 550 | 50 | 200 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-501TF | 500 | 550 | 50 | 200 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-601TF | 600 | 550 | 50 | 300 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-671TF | 670 | 600 | 50 | 180 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-681TF | 680 | 700 | 50 | 180 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-751TF | 750 | 800 | 50 | 150 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-801TF | 800 | 1000 | 50 | 300 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-901TF | 900 | 1000 | 50 | 100 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-102TF | 1000 | 1000 | 50 | 100 | 2.0*1.2*1.2 | -40 to +85 |
| Dimension | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) |
|---|---|---|---|---|---|
| Recommended Land Pattern | 2.000.20 | 1.200.20 | 1.200.20 | 0.5 TYP | 0.5 TYP |
| Structure Part | Material Name |
|---|---|
| Lid | Ni-Zn Ferrite |
| Epoxy | Epoxy resin |
| Wire | Enameled copper wire |
| Core | Ni-Zn Ferrite |
| Electrode structure | Ag+Ni+Sn plating |
| Packaging Type | Tape Dimensions (mm) | Reel Dimensions (mm) | Standard Quantity per Reel | Inner Box Quantity | Carton Box Quantity |
|---|---|---|---|---|---|
| FDCW2012 | W: 8.00 0.10, P1: 4.00 0.10, A0: 1.50 0.10, B0: 2.30 0.10, K0: 1.45 0.10, t: 0.20 0.05, E: 1.75 0.10, F: 3.50 0.10, P2: 2.00 0.10, D0: 1.55 0.05, D1: 0.80 0.05, P0: 4.00 0.10 | A: 188, B: 195, C: 67 (Inner Box), L: 390, W: 350, H: 215 (Carton) | 2000 pcs / reel | 5 Reel / box (10000 pcs) | 10 Middle boxes (100000 pcs) |
| Reliability Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Life | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Reflow 2 times 2. Temperature: 155 2 |
| Resistance to Soldering Heat | 1. No visible mechanical damage 2. Impedance change: Within20% | 1. Solder on PCB to Reflow test Peak Temp. 2605 510 secs, Cycles: 2 times. Re-flowing Profile: Please refer to Fig-1 2. Test board thickness: 1.5mm 3. Test board material: glass epoxy resin 4. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made. Product showed no damage under microscope. |
| High Temperature | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature: 1252 2. Duration: 1000 hours 3. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made. |
| Steady Damp-Heat | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature: 85 2. Humidity: 85% RH 3. Duration: 1000 hours 4. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made. |
| Mechanical Vibration | 1. No visible mechanical damage 2. Impedance change: Within 20% | 1. Frequency: 10HZ55HZ10HZ/Min Cycles 2. Amplitude: 1.5 mm 3. Directions: X,Y,Z 4. Time: 2 hours in each directions (total of 6 hours) |
| Thermal Shock | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature and time: -40 for 303 min 125 for 303 min, please refer to Fig-2 2. Transforming interval: Max. 3 Min 3. Tested cycle: 1000 cycles 4. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made. |
| Salt Spray | 1. No visible mechanical damage 2. Impedance change: Within 20% | 1. Salt concentration: (5 1)% (mass percent) 2. pH value: 6.5 - 7.2 3. Temperature: 35 2 4. Humidity: 85% 5. Time: 24 hours 6. In normal temperature and humidity for 12 hours, testing inductance, the inductance value change cannot be more than before test 10%. |
| Terminal Strength | No visible mechanical damage | 1. The electrode of the inductor is soldered to the PCB, to Fig-3 Then apply a force in the direction of the arrow. 2. 5N force. 3. Keep time: 10(1)s The first three tests were OK, and the force was applied until the peak value of the product peeling. The test speed was set in the range of 3 ~ 8mm/min. |
| Packaging Detail | Dimensions (mm) | Peel Force (gf) |
|---|---|---|
| Leader and blank portion | P1: 4.00 0.10, A0: 1.50 0.10, B0: 2.30 0.10, K0: 1.45 0.10, t: 0.20 0.05, E: 1.75 0.10, F: 3.50 0.10, P2: 2.00 0.10, D0: 1.55 0.05, D1: 0.80 0.05, P0: 4.00 0.10 | 10 to 100 gf (Peel speed: approx. 300mm/minute) |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina