Beijing Silk Road Enterprise Management Services Co., Ltd.
                                                                                                           
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Wire Wound Chip Common Mode Choke Coil cjiang FDCW2012-2-301TF for Noise Suppression in High Speed Lines

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The FDCW2012 series of wire-wound chip common mode choke coils offers excellent noise suppression performance due to high common mode impedance at high frequencies. These components are designed for small size and low profile, measuring 2.0*1.2*1.2 mm. They are 100% Lead (Pb) & Halogen-Free and RoHS compliant. Applications include power switches, servers, telecommunication equipment, USB communication, panel links for LCD panels, and countering common mode noise in high-speed lines.

Product Attributes

  • Series Name: FDCW
  • Compliance: 100% Lead (Pb) & Halogen-Free, RoHS compliant
  • HSF Products (Hazardous Substance Free Products)

Technical Specifications

Part Number Common Mode Impedance @100MHz ( 25%) DCR (m) MAX IR (A) MIN Rated Voltage (Vdc)
FDCW2012-2-300TF 30 200 10 50
FDCW2012-2-500TF 50 250 10 50
FDCW2012-2-750TF 75 250 10 50
FDCW2012-2-900TF 90 300 10 50
FDCW2012-2-121TF 120 300 10 50
FDCW2012-2-161TF 160 350 10 50
FDCW2012-2-181TF 180 350 10 50
FDCW2012-2-201TF 200 350 10 50
FDCW2012-2-221TF 220 350 10 50
FDCW2012-2-251TF 250 400 10 50
FDCW2012-2-261TF 260 400 10 50
FDCW2012-2-301TF 300 400 10 50
FDCW2012-2-361TF 360 400 10 50
FDCW2012-2-371TF 370 450 10 50
FDCW2012-2-481TF 480 550 10 50
FDCW2012-2-501TF 500 550 10 50
FDCW2012-2-601TF 600 550 10 50
FDCW2012-2-671TF 670 600 10 50
FDCW2012-2-681TF 680 700 10 50
FDCW2012-2-751TF 750 800 10 50
FDCW2012-2-801TF 800 1000 10 50
FDCW2012-2-901TF 900 1000 10 50
FDCW2012-2-102TF 1000 1000 10 50
Dimensions (mm) A B C D (TYP) E (TYP)
FDCW2012 Series 2.000.20 1.200.20 1.200.20 0.5 0.5
Structure and Components Part Name Material Name
Structure Lid Ni-Zn Ferrite
Epoxy Epoxy resin
Wire Enameled copper wire
Core Ni-Zn Ferrite
Electrode structure Ag+Ni+Sn plating
Operating Conditions Value
Ambient Temperature 25 C (for test data reference)
Operating Temperature Range -40 C to +85 C
Maximum Part Temperature 125 C (under worst-case operating conditions)
Reliability Test Items Requirements Test Methods and Remarks
Operating life 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Reflow 2 times
2. Temperature: 155 2
Resistance to Soldering Heat 1. No visible mechanical damage
2. Impedance change: Within20%
1. Solder on PCB to Reflow test Peak Temp. 2605510 secs ,Cycles :2 times.
2. Test board thickness: 1.5mm
3. Test board material: glass epoxy resin
4. Storage: 1 hour at standard atmospheric conditions before measurement.
High Temperature 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Temperature: 1252
2. Duration: 1000 hours
3. Storage: 1 hour at standard atmospheric conditions before measurement.
Steady damp-heat 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Temperature:85
2. Humidity: 85% RH
3. Duration:1000 hours
4. Storage: 1 hour at standard atmospheric conditions before measurement.
Mechanical Vibration 1. No visible mechanical damage
2. Impedance change: Within 20%
1. Frequency: 10HZ55HZ10HZ/Min Cycles
2. Amplitude: 1.5 mm
3. Directions: X,Y,Z
4. Time: 2 hours in each direction (total of 6 hours)
Thermal Shock 1. No visible mechanical damage
2. Impedance change: Within 20%
3. Insulation resistance10M min
1. Temperature and time: -40for 303 min125for 303min.
2. Transforming interval: Max. 3 Min
3. Tested cycle: 1000 cycles
4. Storage: 1 hour at standard atmospheric conditions before measurement.
Salt Spray 1. No visible mechanical damage
2. Impedance change: Within 20%
1. Salt concentration: (5 1)% (mass percent)
2. pH value: 6.5 - 7.2
3. Temperature: 35 2
4. Humidity: 85%
5. Time: 24 hours
6. Inductance measurement after 1-2 hours in normal temperature and humidity (change not more than 10% before test).
Terminal strength No visible mechanical damage 1. Electrode soldered to PCB, apply force as per Fig-3.
2. Force: 5N.
3. Duration: 10(1)s.
4. Test speed: 3 ~ 8mm/min.
Packaging Information Dimensions (mm) Details
Tape Packaging W: 8.00 0.10 P1: 4.00 0.10
A0: 1.50 0.10 B0: 2.30 0.10
K0: 1.45 0.10 t: 0.20 0.05
E: 1.75 0.10 F: 3.50 0.10
P2: 2.00 0.10 D0: 1.55 0.05
D1: 0.80 0.05 P0: 4.00 0.10
Reel Dimensions Refer to drawing (Page 8)
Packaging Quantity FDCW2012: 2000 pcs / reel, 5 Reel / box (10000 pcs), 10 Middle boxes / Carton (100000 pcs)
Peel force of top cover tape 10 to 100gf (Peel speed: approx. 300mm/minute)
Inner Box Dimensions A (mm): 188, B (mm): 195, C (mm): 67
Carton Packaging Dimensions L (mm): 390, W (mm): 350, H (mm): 215
Label Information Content
Reel Label Customer's part Number, Lot Number, Quantity, date code
Shipping Label Customer's part Number, Manufacturer's part Number, Quantity, date code

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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