Wire wound chip common mode choke coil cjiang FDCW2012-2-481TF designed for in servers and power switch applications
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The FDCW2012 series of wire wound chip common mode choke coils offers excellent noise suppression performance due to high common mode impedance at high frequencies. These coils are designed in a compact and low-profile 2.0*1.2*1.2 mm package, making them suitable for space-constrained applications. They are 100% Lead (Pb) & Halogen-Free and RoHS compliant, ensuring environmental responsibility. Key applications include power switches, servers, telecommunication systems, USB communication, and panel links for LCD panels, effectively countering common mode noise in high-speed lines.
Product Attributes
- Series Name: FDCW
- Compliance: 100% Lead (Pb) & Halogen-Free, RoHS compliant
- HSF Products (Hazardous Substance Free Products)
Technical Specifications
| Part Number | Common Mode Impedance (Z @100MHz) ( 25%) | DCR (m) MAX | Rated Current (IR) (mA) | Rated Voltage (Vdc) | Dimensions (mm) (L*W*H) | Operating Temperature Range (C) |
|---|---|---|---|---|---|---|
| FDCW2012-2-300TF | 30 | 200 | 450 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-500TF | 50 | 250 | 550 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-750TF | 75 | 250 | 400 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-900TF | 90 | 300 | 400 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-121TF | 120 | 300 | 400 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-161TF | 160 | 350 | 350 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-181TF | 180 | 350 | 350 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-201TF | 200 | 350 | 300 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-221TF | 220 | 350 | 300 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-251TF | 250 | 400 | 300 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-261TF | 260 | 400 | 300 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-301TF | 300 | 400 | 290 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-361TF | 360 | 400 | 300 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-371TF | 370 | 450 | 280 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-481TF | 480 | 550 | 200 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-501TF | 500 | 550 | 200 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-601TF | 600 | 550 | 300 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-671TF | 670 | 600 | 180 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-681TF | 680 | 700 | 180 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-751TF | 750 | 800 | 150 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-801TF | 800 | 1000 | 300 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-901TF | 900 | 1000 | 100 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| FDCW2012-2-102TF | 1000 | 1000 | 100 | 50 | 2.0*1.2*1.2 | -40 to +85 |
| Dimension (mm) | A | B | C | D | E |
|---|---|---|---|---|---|
| Value | 2.000.20 | 1.200.20 | 1.200.20 | 0.5TYP | 0.5TYP |
| Structure Component | Material Name |
|---|---|
| Lid | Ni-Zn Ferrite |
| Epoxy | Epoxy resin |
| Wire | Enameled copper wire |
| Core | Ni-Zn Ferrite |
| Electrode structure | Ag+Ni+Sn plating |
| Reliability Test Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating life | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Reflow 2 times 2. temperature: 155 2 |
| Resistance to Soldering Heat | 1. No visible mechanical damage 2. Impedance change: Within20% | 1. Solder on PCB to Reflow test Peak Temp. 2605510 secs ,Cycles :2 times. 2. Test board thickness: 1.5mm 3. Test board material: glass epoxy resin 4. The specimen shall be stored at standard atmospheric conditions for 1 hour, after which the measurement shall be made.product showed no damage under microscope. |
| High Temperature | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature: 1252 2. Duration: 1000 hours |
| Steady damp-heat | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature:85 2. Humidity: 85% RH 3. Duration:1000 hours |
| Mechanical Vibration | 1. No visible mechanical damage 2. Impedance change: Within 20% | 1. Frequency: 10HZ55HZ10HZ/Min Cycles 2. Amplitude: 1.5 mm 3. Directions: X,Y,Z 4. Time: 2 hours in each directions (total of 6 hours) |
| Thermal Shock | 1. No visible mechanical damage 2. Impedance change: Within 20% 3. Insulation resistance10M min | 1. Temperature and time: -40for 303 min125for 303min 2. Transforming interval: Max. 3 Min 3. Tested cycle: 1000 cycles |
| Salt Spray | 1. No visible mechanical damage 2. Impedance change: Within 20% | 1. Salt concentration: (5 1)% (mass percent) 2. pH value:6.5 - 7.2 3. temperature: 35 2 4. humidity: 85% 5. time: 24 hours 6. in normal temperature and humidity for 1 2 hours, testing inductance, the inductance value change can not be more than before test 10%. |
| Terminal strength | No visible mechanical damage | 1. The electrode of the inductor is soldered to the PCB, then apply a force in the direction of the arrow. 2. 5N force. 3. Keep time: 10(1)s The first three tests were OK, and the force was applied until the peak value of the product peeling. The test speed was set in the range of 3 ~ 8mm/min. |
| Packaging Information | Dimension (mm) | Value |
|---|---|---|
| Tape Packaging Type | W | 8.00 0.10 |
| Tape Packaging P1 | P1 | 4.00 0.10 |
| Tape Packaging A0 | A0 | 1.50 0.10 |
| Tape Packaging B0 | B0 | 2.30 0.10 |
| Tape Packaging K0 | K0 | 1.45 0.10 |
| Tape Packaging t | t | 0.20 0.05 |
| Tape Packaging E | E | 1.75 0.10 |
| Tape Packaging F | F | 3.50 0.10 |
| Tape Packaging P2 | P2 | 2.00 0.10 |
| Tape Packaging D0 | D0 | 1.55 0.05 |
| Tape Packaging D1 | D1 | 0.80 0.05 |
| Tape Packaging P0 | P0 | 4.00 0.10 |
| Reel Inner box | Quantity | 5 Reel / box (10000 pcs) |
| Reel Carton box | Quantity | 10 Middle boxes, (100000 pcs) |
| Peel force of top cover tape | Speed | Approx. 300mm/minute |
| Peel force of top cover tape | Force | Between 10 to 100gf |
| Inner Box Dimensions | A (mm) | 188 |
| Inner Box Dimensions | B (mm) | 195 |
| Inner Box Dimensions | C (mm) | 67 |
| Carton Packaging Dimensions | L (mm) | 390 |
| Carton Packaging Dimensions | W (mm) | 350 |
| Carton Packaging Dimensions | H (mm) | 215 |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina