Unibody power inductor COILMX MSM252010-4R7M featuring metal dust core and high current rating for power conversion
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Negotiable
MOQ:
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Delivery Time:
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Product Description
Product Overview
The MSM252010 series is a range of unibody power inductors manufactured by Shenzhen Maixiang Technology Co., Ltd. These inductors are designed for low profile, high current applications, making them suitable for battery-powered devices, DC/DC converters in distributed power systems, and DC/DC converters for field-programmable gate arrays. They feature ROHS compliance, super low resistance, ultra-high current rating, and high performance realized by a metal dust core, operating effectively up to 1MHz.
Product Attributes
- Brand: Maixiang ()
- Product Type: Unibody Power Inductor ()
- Compliance: ROHS compliant
- Core Material: Metal dust core
- Origin: China
Technical Specifications
| Model No. | Inductance L (uH) ±20 %, 1MHz, 1V | DCR (mΩ) TYP. | DCR (mΩ) MAX. | Isat (A) MAX. | Irms (A) MAX. |
|---|---|---|---|---|---|
| MSM252010-R22M | 0.22 | 12 | 17 | 7.90 | 6.50 |
| MSM252010-R24M | 0.24 | 12 | 17.5 | 7.80 | 6.40 |
| MSM252010-R33M | 0.33 | 13 | 19 | 7.20 | 6.20 |
| MSM252010-R47M | 0.47 | 15 | 22 | 6.50 | 5.60 |
| MSM252010-R68M | 0.68 | 23 | 27 | 5.50 | 5.00 |
| MSM252010-R82M | 0.82 | 25 | 29 | 4.80 | 4.10 |
| MSM252010-1R0M | 1.00 | 25 | 30 | 4.80 | 4.10 |
| MSM252010-1R5M | 1.50 | 45 | 55 | 3.90 | 3.00 |
| MSM252010-2R2M | 2.20 | 62 | 70 | 3.00 | 2.10 |
| MSM252010-3R3M | 3.30 | 86 | 100 | 2.50 | 2.10 |
| MSM252010-4R7M | 4.70 | 160 | 180 | 2.00 | 1.60 |
| MSM252010-6R8M | 6.80 | 270 | 320 | 1.90 | 1.40 |
| MSM252010-100M | 10.00 | 500 | 560 | 1.40 | 0.95 |
| Product Dimension (UNIT:mm) | |
|---|---|
| A | 2.5±0.2 |
| B | 2.0±0.2 |
| C | 1.0Max |
| D | 0.85±0.2 |
| E | 0.8±0.2 |
| Characteristics | |
|---|---|
| Operating Temperature Range | -55~+125 |
| Frequency Range | Up to 1MHz |
| Special Request | |
|---|---|
| Marking | NO Marking on top of the body. |
| Application | |
|---|---|
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| Features | |
|---|---|
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| Reliability | |
|---|---|
| Solder ability test | Terminals area must have 95% min solder coverage |
| Solder heat proof | (1) Preheating: 160±10 for 90 seconds (2) Retention time: 245±5 for 2±0.5 seconds |
| Vibration test | Inductance change: Within±5% Without mechanical damage such as break (1) Vibration frequency: (10Hz to 55Hz to 10Hz) in 60 seconds as a period (2) Vibration time: Period cycled for 2 hours in each of 3 mutual perpendicular directions (3) Amplitude: 1.5 mm Max |
| Shock test | Inductance change: Within±5% Without mechanical damage such as break (1) Peak value: 100G (2) Duration of pulse: 11ms (3) Times in each positive and negative direction of 3 mutual perpendicular directions |
| Thermal shock | Inductance change: Within±5% Without mechanical damage such as break (1) Repeat 100 cycles: (-55±2,30±3 minutes) Room temperature,5 minutes (+125±2,30±3 minutes) Room temperature,5 minutes (2) Recovery: 48+4/-0 hours of recovery under the standard condition. |
| High temperature life test | Inductance change: Within±5% Without mechanical damage such as break (1) Environment condition : 85±2 Applied current: Rated current (2) Duration: 1000+4/-0 hours. |
| Humidity Resistance | Inductance change: Within±5% Without mechanical damage such as break (1) Environment condition : 60±2 Humidity: 90~95% Applied current: Rated current (2) Duration: 1000+4/-0 hours. |
| Low temperature life test | Inductance change: Within±5% Without mechanical damage such as break (1) Store temperature -55±2 for total 1000+4/-0 hours |
| High temperature life test | Inductance change: Within±5% Without mechanical damage such as break (1) Store temperature +125±2 for total 1000+4/-0 hours |
| Packaging | |
|---|---|
| Tape packaging dimensions (mm) | W: 8.0 ±0.30, A0: 2.45 ±0.10, B0: 2.80 ±0.10, K0: 1.20 ±0.05, P: 4.0 ±0.10, F: 3.5 ±0.1, E: 1.75 ±0.10, D0: 1.50 ±0.10, P0: 4.0 ±0.10, T: 0.25 ±0.05 |
| Reel dimensions (mm) | A: 180.0 ± 2.0, B: 60.0 ± 1.0, C: 13.0 ± 1.0, D: 2.0± 0.2, W: 14.4 Max, W1: 8.4 ± 1.0 |
| Carton dimensions | 1 Reel: 3000 PCS, 1 Inner Box: 30000 PCS, 1 Outer Box: 120000 PCS |
| Reflow Profile | |
|---|---|
| Reflow Soldering Method | Refer to Reflow Curve |
| Soldering iron method | 350±5 Max. 3 seconds. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina