China High Density Packaging Surface Mount Resistor Network CTS 752091561GTR7 with Lead Free Termination Finish for sale

High Density Packaging Surface Mount Resistor Network CTS 752091561GTR7 with Lead Free Termination Finish

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Product Description

CTS 752 Series Surface Mount Resistor Network

The CTS 752 Series Resistor Networks are single packaged devices featuring an array of homogeneous resistor elements. These networks offer a smaller circuit footprint, excellent reliability, improved TCR tracking, and resistor tolerance matching, while reducing component count for cost savings in placement. Designed for high-density packaging, they are suitable for various demanding applications.

Product Attributes

Brand: CTS
Product Type: Surface Mount Resistor Network
Construction: Solid Ceramic
Termination Finish: Nickel Barrier Solder-Coated Pads (Lead-Free)
Packaging: Tape and Reel
Certifications: RoHS Compliant in Accordance with EU Directive 2011/65/EU - Lead-Free Termination Finish - Exemption 7(c)-I

Features

Low Profile Surface Mount Lead-Less Package
High Density Packaging - Single Row [SRT] & Dual Row [DRT] Terminations
No Internal Dendrite Growth
Designed for Visual Inspection & Board Cleaning

Applications

Telecom Infrastructure
Optical Networking
Wireless Networks
Storage Area Networks
Media Servers
Test & Measurement
Industrial Controls
Medical Electronics
Commercial & Aerospace

Technical Specifications

Specification	Details
Operating Conditions	Power Rating @ +25C: 1.2W (8 Pad SRT) to 2.0W (24 Pad DRT) Power Rating @ +70C: 0.08W (8 Pad SRT) to 1.3W (24 Pad DRT) Maximum Resistor Power (Total network power): 0.12W (SRT 8 Pad) to 2.0W (DRT 24 Pad) @ +25C; 0.08W (SRT 8 Pad) to 1.3W (DRT 24 Pad) @ +70C Resistance Range: 10 ohm to 1M ohm Resistance Tolerance: 2% Std. or 0.5 ohm (whichever is greater) Operating Temperature Range: -55C to +125C Temperature Coefficient: 200ppm/C (standard, 10 Ohms - 1M); 100ppm/C (special, 33 ohms - 1M ohms) Dielectric Strength: 100VAC Maximum Operating Voltage: 25V
Environmental Parameters	Thermal Cycle: 0.50, 5 cycles -65C to +125C Short Time Overload: 0.50, 2 times rated working voltage for 5 seconds (100V maximum) Moisture Resistance: 0.50, 106, 240 hours, 0.1 rated load, -10C to +65C, 90% RH Load Humidity: 1.00, 1,000 hours, 0.1 rated load, +70C, 85% - 92% RH High Temperature Exposure: 1.00, 240 hours @ +125C, no load Load Life: 1.00, 108, Condition F, 2,000 hours @ +70C, rated load Resistance to Solder Heat: 0.25, 30 seconds @ +218C, dwell Mechanical Shock: 0.25, 213 Condition I, 100g, 1m second, 3 shocks each plane Vibration: 0.25, 204 Condition D, 20g, 10Hz - 2,000Hz, 4 hours per plane Leaching Test: No leach > 50% EIA/IS-703-4.13.B, Immerse in +245C 5C SAC305 solder pot for 30 sec. Shear Test: NA, 2,000PSI Low Temperature Storage: 0.25, 24 hours @ -65C, no load Low Temperature Operation: 0.25, 45 minutes @ -65C, full load Flammability: N/A, 94V-0 Non-Fungus: Pass Resistance to Solvents: Pass, Isopropyl alcohol, Freon TMC Solderability: Pass, RMA Flux, +230C, 5 seconds dip, 95% coverage
Mechanical Specifications	Package Dimensions: 11.81 0.12mm (0.465 0.005 in) for 08/16 pads up to 16.89 0.12mm (0.665 0.005 in) for 12/24 pads Termination: JEDEC termination code (e3). Barrier plating is nickel [Ni] over silver [Ag] thick film pad with Matte tin [Sn] finish. Reflow Conditions: Per JEDEC-J-STD-020; +260C maximum, 20 seconds. MSL: 1
Part Weight	08/16 Pads: 180.70mg 09/18 Pads: 203.30mg 10/20 Pads: 225.90mg 12/24 Pads: 271.10mg