Compact SMD power inductor Cybermax CMLO201610T4R7MTT featuring epoxy shield and plating copper base

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Price: Negotiable

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Product Description

Product Overview

The CMLO201610T Series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are built with quality materials.

Product Attributes

Brand: Cybermax
Origin: China (implied by website and numbering)
Materials: Body - Alloy, Winding - Enamelled Wire, Shield - Epoxy, Electric Base - plating-Cu/plating-Ni/plating-Sn
Certifications: Lead Free

Technical Specifications

Part No.	Inductance (uH)	DCR (m) Max	DCR (m) Typ	Saturation Current Isat (A) Max	Temperature Rise Current Irms (A) Max	Dimensions (LxWxH) (mm)
CMLO201610TR24MTT	0.2420%	17.0	14.0	7.80	5.60	2.0x1.6x1.0
CMLO201610TR33MTT	0.3320%	22.0	17.0	6.50	5.30	2.0x1.6x1.0
CMLO201610TR47MTT	0.4720%	25.0	22.0	5.50	5.00	2.0x1.6x1.0
CMLO201610TR68MTT	0.6820%	32.0	25.0	4.70	4.30	2.0x1.6x1.0
CMLO201610T1R0MTT	1.020%	43.0	35.0	4.20	4.10	2.0x1.6x1.0
CMLO201610T1R5MTT	1.520%	100.0	80.0	2.90	2.30	2.0x1.6x1.0
CMLO201610T2R2MTT	2.220%	130.0	120.0	2.80	2.10	2.0x1.6x1.0
CMLO201610T3R3MTT	3.320%	170.0	140.0	2.00	1.50	2.0x1.6x1.0
CMLO201610T4R7MTT	4.720%	220.0	190.0	1.80	1.40	2.0x1.6x1.0

Test Conditions & Equipment

Item	Test Condition	Test Equipment
Ls	1MHz/1V	HP4263BIM3532-50 or equivalent
DCR	direct-current	HP4263BRM3545 or equivalent
Isat	1MH/1V	Microtest 6379 &6220 or equivalent
Irms	ambient temperature 20	Microtest 6379 &6220 or equivalent

Operating & Storage Conditions

Parameter	Condition
Operating Temperature Range	-40+125,Including self-heating
Storage Conditions (Taping)	Temperature: -10 to +40; Humidity: 30~70%RH
Storage Conditions (Body)	Temperature: -40 to +85

Recommended Reflow Profile

Stage	Temperature ()	Time (s)
T1	150	-
T2	180	60 to 120s
T3	230	30 to 50s
T4	250 to 260	10s max

Reliability

No.	Items	Requirements	Test Methods and Remarks
1	Insulation Resistance	100M	100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds.
2	Solderability	90% or more of electrode area shall be coated by new solder.	Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at (2455) for (51) seconds.
3	Resistance to Soldering Heat	Appearance: No visible mechanical damage. Inductance change: Within 10%	Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at (2605) for (101) seconds.
4	Adhesion of terminal electrode	Strong bond between the pad and the core, without come off.	Inductors shall be subjected to (2605) for (205) s Soldering in the base with 0.3mm solder. And then apply pressure 10 N in the vertical electrode direction for (101) seconds.
5	High temperature	Appearance: No visible mechanical damage. Inductance change: Within 10%	Temperature (+85 2 ), Time (962) h.
6	Low temperature	Appearance: No visible mechanical damage. Inductance change: Within 10%	Temperature (-402), Time (962)h.
7	Thermal shock	Appearance: No visible mechanical damage. Inductance change: Within 10%	(-403) for (303) min (1252) /(303) min, conversion time (2~3) min, cycle 32 times; Placed at room temperature for 2 hours, tested within 48 hours.
8	Temperature characteristic	Inductance change Pc-b, Pc-d: Within 20%.	Cycle: a: +20 b: -40 c: +20 d: +125 e: +20 (30~45) min per stage.
9	Static Humidity	Appearance: No visible mechanical damage. Inductance change: Within 10%	Stored in an environment of (933)%RH, Temperature (402) for (10002)h. Placed at room temperature for 2 hours, tested within 48 hours.
10	Life (Durability)	Appearance: No visible mechanical damage. Inductance change: Within 10%	Store at (85 2) for (100024)h, with Irms applied. Placed at room temperature for 2 hours, tested within 48 hours.