metallized polypropylene film capacitor Dersonic CFC2E104JE1I120B5100 with epoxy resin inside coating and low loss
Product Overview
This specification outlines the details for DERSONIC's metallized polypropylene film capacitors. These capacitors are designed for blocking, coupling, decoupling, filtering, bypassing, timing, and temperature control applications. They are ideal for use in telecommunication equipment, data processing equipment, industrial instruments, automatic control systems, and other general electronic equipment. Key features include non-inductive construction, excellent moisture resistance, self-healing properties, flame retardancy (UL 94V-0), very small loss, and excellent capacitance, loss, frequency, and temperature characteristics. They also boast a high insulation resistance.
Product Attributes
- Brand: DERSONIC
- Origin: DONGGUAN CITY DERSONIC ELECTRONICS CO., LTD.
- Materials: Metallized polypropylene film, Zinc-tin layer, Tinned copper-clad steel wire terminals, Epoxy resin (inside coating), Epoxy powder (outside coating). All materials comply with ROHS and REACH requirements.
- Certifications: ROHS, REACH, UL 94-V0 (flame retardant)
Technical Specifications
| Product PN | Specification | Capacitance Range | Capacitance Tolerance | Rated Voltage (VDC) | Dissipation Factor (1KHz) | Insulation Resistance | Operating Temperature |
|---|---|---|---|---|---|---|---|
| (Refer to Part Number Analysis) | CBB Thin Film Capacitor | 0.001uF10.0uF | 1%(F), 2%(G), 2.5%(H), 3%(I), 5%(J), 10%(K) | 100/160/250/400/450/630/1000 | 0.10% (C0.47F) | 100000M (C0.33F) or 30000s or 30000MUf (C0.33F) | -40+105 |
Part Number Analysis
Example: C F C 2A 103 J C 1 H F5 09 3 000 1
- (1) Product Type: CF (Thin Film Capacitor)
- (2) Capacitor Classification: C, D, F, H, J, CBB21, CBB22, CBB81, CBB65, CBB28
- (3) Voltage: 2A (100V), 2E (250V), 2F (300V), 2G (400V), 2W (450V), 2H (500V), 2J (630V), 3A (1KV)
- (4) Rated Capacitance: Three-digit code (e.g., 103 = 10nF)
- (5) Capacitance Tolerance: F (1%), G (2%), H (3%), J (5%), K (10%), M (20%)
- (6) Lead Pitch (mm): C (5.08), D (7.5), E (10.0), G (15.0), H (17.5), I (20), K (25), L (27.5), P (30), Q (37.5)
Key Materials
| No. | Main Materials | Specification | Remark |
|---|---|---|---|
| 1 | Metallized polypropylene Film | MPPZAH or MPPA(412um) | ... |
| 2 | Zinc-tin layer | Zn,Sn line | Zn or Zn and Sn alloy |
| 3 | Terminal | Tinned copper-clad steel wire (0.6 or 0.8/1.0mm CP or CU) | Tin plating thickness 7um |
| 4 | Inside Coating Material | Epoxy resin | UL94-V0 |
| 5 | Outside Coating Material | Epoxy powder | UL94-V0 |
Guide in Useage
- Soldering: Avoid high temperature and long soldering times to prevent characteristic decay or coating breakdown.
- Flow/Wave Soldering: (Details not fully provided in extract)
- Soldering Iron: Iron tip temperature should not exceed 350, and soldering time should be within 5 seconds.
- Assembly: When assembling to a circuit board, try to avoid proximity to heat sources.
Environmental Requirements
- Compliance with ROHS requirements.
- Compliance with REACH requirements.
- Compliance with Halogen-Free (as required).
Reference Standards
- GB-T2693-2001 (IDT IEC 60384-1-2008)
- GB-T10190-1988
- IEC-60384-16-2005
- GB-T 2828.1-2003
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