metallized polypropylene film capacitor Dersonic CF72W274KE1H130HB100 for high current pulse and frequency

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Product Description

Product Overview

The MSB capacitor is constructed with metallized polypropylene series film dielectric in a non-inductive, wound structure. It features tinned copper leads and is encapsulated in a flame-retardant plastic case with epoxy resin, meeting UL94-V0 standards. This capacitor offers excellent self-healing capabilities, good flame retardancy, and is designed for high-frequency, high-current pulse applications.

Product Attributes

Brand: DERSONIC
Origin: Dongguan, China
Material: Metallized polypropylene film, tinned copper leads, flame-retardant plastic case, epoxy resin encapsulation
Color: Gray shell
Certifications: UL94-V0, ROHS, REACH

Technical Specifications

Item	Characteristic requirement	Test method&Condition
Capacitance Range	0.001uF2.2uF	1KHz ,1.0Vrms ,20
Capacitance Tolerance	5%(J),10%(K),20%(M)	1KHz ,1.0Vrms ,20
Rated Voltage	250V/450V/630V/800V/1000V/1250V/1600V/2000VDC
Climatic Category	40/110
Passive Flammability Class	UL94-V0
Operating Temperature	-40+110
Dissipation Factor (tan)	C0.47F: 0.10% 0.47F<C1.0F: 0.10% C>1.0F: 0.10%	1KHZ
Insulation Resistance	C0.33F: 50000MUf C0.33F: 10000MUf	Ur100V,100VDC, 60s,20
Withstand voltage (Between Terminals)	1.6Ur(d.c) 60s
Withstand voltage (Between Terminals and Case)	2Ur+1500V(a.c) 60s	2000V(a.c),
MAX. Pulse rise time	150v/us
Lead spacing	7.5mm, 10mm, 15mm, 22.5mm, 27.5mm, 37.5mm
Cut off Current	10mA , ARC=OFF, Voltage raising time 510s

Item	Characteristic requirement	Test method&Condition
Pull Strength	5N, 10N, 20N (depending on wire diameter)	904, 10S
Terminal Strength	No visible mechanical damage	IEC60384-16 C4.3, IEC60384-1 C4.13, IEC60068-2-21 Test Ua1
Bending Strength	No visible mechanical damage	IEC60384-16 C4.3, IEC60384-1 C4.13, IEC60068-2-21 Test Ua1
Solderability	At least 95% of the circumference of the lead wire coated with solder, no visible damage to the body.	Solder temp: 2355, Immersion time: 2.00.5S. IEC60384-16 C4.5, IEC60384-1 C4.15, IEC60068-2-20 Test Ta
Resistance to Soldering heat	Capacitance Variation: C/C5%, Dissipation Factor: tg <0.0080 (CR1.0F), tg <0.0050 (CR>1.0F) at 1KHZ, Insulation Resistance: R/R50%	Solder temp: 2605, Immersion time: 101S. Recovery time 1-2 hours. IEC60384-16 C4.5, IEC60384-1 C4.14, IEC60068-2-20 Test Ta
Endurance	Capacitance Variation: C/C10%, Dissipation Factor: tg <0.0080 (CR1.0F), tg <0.0050 (CR>1.0F) at 1KHZ, Insulation Resistance: R/R50%	Temp: 1103, Duration: 1000+48h, Applied voltage: 1.25 Ur(a.c.)50hz. Recovery time at least 16 hours. IEC60384-16 C4.14, IEC60384-1 C4.23, IEC60068-2-2
Steady State Humidity	Capacitance Variation: C/C5%, Dissipation Factor: tg <0.0080 (CR1.0F), tg <0.0050 (CR>1.0F) at 1KHZ	Temp: 402, Humidity: 90-95%RH, Duration: 56 days. No voltage applied. Recovery time 1-2 hours. IEC60384-16 C4.12, IEC60384-1 C4.