metallized polypropylene capacitor Dersonic CF72W224KE1H130HB100 for in high frequency pulse circuits

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Product Description

Product Overview

The MSB capacitor is constructed with metallized polypropylene series film dielectric and a non-inductive winding structure. It features tinned copper leads, a flame-retardant plastic case, and epoxy resin encapsulation. This capacitor offers excellent self-healing properties and good flame retardancy, complying with UL 94-V0 standards. It is designed for high-frequency, high-current pulse applications and is suitable for various electronic circuits.

Product Attributes

Brand: DERSONIC
Origin: DONGGUAN DERSONIC ELECTRONIC CO., LTD.
Material: Metallized polypropylene film, tinned copper leads, flame-retardant plastic case, epoxy resin encapsulation.
Color: Grey shell ()
Certifications: UL94-V0, ROHS, REACH

Technical Specifications

Item	Characteristic Requirement	Test Method & Condition
Capacitance Range	0.001F2.2F	1KHz, 1.0Vrms, 20
Capacitance Tolerance	5%(J), 10%(K), 20%(M)	1KHz, 1.0Vrms, 20
Rated Voltage	250V/450V/630V/800V/1000V/1250V/1600V/2000VDC
Climatic Category	40/110
Passive Flammability Class	UL94-V0
Operating Temperature	-40+110
Dissipation Factor (tan)	C0.47F: 0.10% (1KHz) 0.47F<C1.0F: 0.10% (1KHz) C>1.0F: 0.10% (1KHz) C0.47F: 0.20% (10KHz) 0.47F<C1.0F: 0.40% (10KHz) C>1.0F: 0.80% (10KHz)
Insulation Resistance (IR)	C0.33F: IR50000MF C0.33F: IR10000sF Ur>100V, 100VDC, 60s, 20: IR10000s
Withstand Voltage (Between Terminals)	2Ur+1500V(a.c) 60s (No permanent breakdown or flashover)
Withstand Voltage (Between Terminals and Case)	2000V(a.c) 60s (No permanent breakdown or flashover)
Cut off Current	10mA, ARC=OFF, Voltage raising time 510s
MAX. Pulse rise time	150V/s
Terminal Strength	5N (for 0.5mm wire diameter), 10N (for 0.5	904h (Load Time)
Bending Strength	No visible mechanical damage
Solderability	At least 95% of the circumference of the lead wire dipped into new solder, no visible damage to the body.	Solder temp: 2355, Immersion time: 2.00.5S
Resistance to Soldering heat	Capacitance Variation: C/C5%, Dissipation Factor: tg <0.0080 (CR1.0F), tg <0.0050 (CR>1.0F) at 1KHz, Withstand Voltage: 1.6 UR (d.c) 60s (No breakdown or flashover), Insulation Resistance: R/R50%	Solder temp: 2605, Immersion time: 101S, Recovery time: 1-2 hours
Endurance	Capacitance Variation: C/C10%, Dissipation Factor: tg <0.0080 (CR1.0F), tg <0.0050 (CR>1.0F) at 1KHz, Withstand Voltage: 1.6 UR (d.c) 60s (No breakdown or flashover)	Temp: 1103, Applied voltage: 1.25 Ur(a.c.)50hz, Duration: 1000+48h, Recovery time: at least 16 hours
Humidity (Steady State Damp Heat)	Capacitance Variation: C/C5%, Dissipation Factor: tg <0.0080 (CR1.0F), tg <0.0050 (CR>1.0F) at 1KHz, Withstand Voltage: 1.6 UR (d.c) 60s (No breakdown or flashover)	Temp: 402, Humidity: 90-95%RH, Duration: 56 days, No voltage applied