Low Loss Metallized Polypropylene Film Capacitor DGCX MPP125J2GA080C3F0ZR Ideal for AC DC and Pulse Circuits
Price:
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The CBB22/MPP series metallized polypropylene film capacitors are designed for electronic equipment, featuring an epoxy encapsulation and a non-inductive winding structure. These capacitors utilize a metallized polypropylene film and a tin-plated copper wire or tin-plated copper-clad steel wire for lead connection. They are ideal for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key advantages include excellent self-healing properties, low loss, and minimal internal temperature rise, all encapsulated in a flame-retardant epoxy resin powder coating.
Product Attributes
- Brand: (Chengxi Electronics)
- Product Series: CBB22/MPP
- Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
- Construction: Non-inductive winding, Epoxy encapsulated
- Lead Material: Tin-plated copper wire or Tin-plated copper-clad steel wire
- Encapsulation Material: Flame-retardant epoxy resin powder coating (UL94V-0)
- Environmental Compliance: RoHS, REACH, Halogen-free (optional)
- Origin: Heyuan Factory, Guangdong Province, China
Technical Specifications
| Parameter | Specification | Test Condition |
|---|---|---|
| Product Name | CBB22/MPP Type Metallized Polypropylene Film Capacitor (Impregnated Type) | - |
| Model/Specification | CBB22/MPP 1.2uF5% 400V.dc | - |
| Product Code | MPP125J2GA080C3F0ZR | - |
| Dimensions (L x H x T) | 22 x 13 x 7.8 mm | - |
| Pitch (P) | 20.0 mm | - |
| Lead Diameter (d) | 0.8 mm | - |
| Climate Category | 40/105/21 | - |
| Operating Temperature Range | -40C to +105C | (Derating factor 1.25%/C for +85C to +105C) |
| Rated Temperature | 85C | - |
| Capacitance Range | 0.001F to 6.8F | - |
| Capacitance Tolerance | 5% (J), 10% (K) | - |
| Rated Voltage (UR) | 100Vdc, 160Vdc, 250Vdc, 400Vdc, 630Vdc, 1000Vdc, 1250Vdc, 1600Vdc, 2000Vdc | - |
| Dissipation Factor (DF) | 0.0010 | 1kHz, 20C |
| Insulation Resistance (IR) | 30,000 M for C 0.33F; 10,000 M*F for C > 0.33F | 100VDC, 60 seconds |
| Dielectric Strength | 1.6 UR(VDC) | 5 seconds |
| Maximum Pulse Rise Rate (dV/dt) | Refer to chart in source document | - |
| Lead Strength (Tensile) | No visible mechanical damage | 10N, 10 seconds (for 0.6 & 0.8mm wires) |
| Lead Strength (Bending) | - | 5N, 90 2 times (for 0.6 & 0.8mm wires) |
| Solderability | 95% tinning rate on leads | 2455C, 2.50.5 seconds |
| Soldering Heat Resistance | No visible damage; C/C 3%; DF increase 0.004 | 2605C, 101 seconds immersion; 1-2 hours recovery |
| Rapid Temperature Change | No visible damage | -40C to +105C, 5 cycles |
| Vibration | No visible damage | 0.75mm or 98m/s, 10-500Hz, 3 axes, 2h each |
| Shock | No visible damage | 4000 times, 390m/s, 6ms pulse |
| Climate Sequence Test | No visible damage; C/C 5%; DF increase 0.005; IR change 50% | Dry Heat (+105C, 16h), Cyclic Damp Heat (DB), Cold (-40C, 2h), Low Pressure (8.5kPa, 1h), Cyclic Damp Heat (DB) |
| Damp Heat (Steady State) | No visible damage; C/C 5%; DF increase 0.002 (C1.0F) / 0.004 (C>1.0F); IR change 50% | 90-95% RH, 402C, 21 days |
| Endurance Test | No visible damage; C/C 8%; DF increase 0.004; IR change 50% | 85C, 1000 hours, 1.25UR applied |
| Charge/Discharge Test | C/C 5%; DF increase 0.005; IR change 50% | 10,000 cycles |
| Packaging (Inner Box) | 34.5 x 23.5 x 24.5 cm (L x W x H) | - |
| Packaging (Outer Box) | 49 x 36 x 27 cm (L x W x H) | - |
| Storage Conditions | Temperature: Max 35C, Relative Humidity: Max 80% | Original packaging, Max 12 months from production date |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina