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Metallized Polypropylene Film Capacitor with Flame Retardant Epoxy Resin Powder DGCX MPP474J2EB070B200ZR

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Product Description

Product Overview

The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment applications. These capacitors feature a non-inductive winding structure with a flame-retardant epoxy resin powder encapsulation. They are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key advantages include excellent self-healing properties, low loss, and low internal temperature rise.

Product Attributes

  • Brand: DGCX
  • Model Series: CBB21/MPP
  • Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
  • Construction: Non-inductive winding, Epoxy resin powder encapsulation
  • Origin: Dongguan, China
  • Environmental Compliance: RoHS, REACH, Halogen-free (if required)

Technical Specifications

Part Number Capacitance (uF) Tolerance (%) Rated Voltage (V.dc) Dissipation Factor (DF) (1KHz, 20C) Dimensions (mm) (L x W x H) Pitch (mm) Lead Diameter (mm)
MPP474J2EB070B200ZR 0.47 5% 250 0.1% 8.8 x 12.3 x 7.0 7.5 0.6

General Electrical Characteristics

Parameter Specification Standard
Climate Category 40/105/21
Operating Temperature Range -40C to +105C
Rated Temperature 85C
Capacitance Range 0.001F to 6.8F
Capacitance Tolerance 5%(K), 10%(M)
Rated Voltage (VDC) 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 VDC
Dissipation Factor (DF) (1kHz) 0.0010
Insulation Resistance 30,000M (for C0.33uF)
10,000M*uF (for C>0.33uF)
(100VDC, 60s)
Dielectric Strength 1.6 UR(VDC), 5 seconds

Maximum Rated Pulse Rise Time (dV/dt)

dV/dt (V/s) UR (VDC) P=7.5mm P=10.0mm P=15.0mm P=22.5mm P=27.5mm
100/160 130 110 100 70 50
250 240 220 200 120 100
400 450 350 300 180 150
630 550 420 400 250 180
1000/1250 2300 1950 975 600 300
1600 / 6000 4500 2400 /
2000 / 8000 4500 / /

Note: If the actual working voltage (U) is lower than the rated voltage (UR), the capacitor can operate at a higher dV/dt. The allowable dV/dt value should be multiplied by UR/U.

Product Structure and Main Materials

No. Main Material Description Remarks
1 Metallized Polypropylene Film MPPZAH -/-
2 Sprayed Tin Layer Zinc-tin alloy wire -/-
3 Leads Tinned copper-clad steel wire -/-
4 Outer Encapsulation Material Epoxy resin powder Flame retardant UL94V-0
5 Inner Protective Material Epoxy resin

All raw materials and finished products comply with RoHS environmental requirements.

Marking Explanation (Example)

  • DGCX: Company Trademark
  • MPP: Product Model or Model Code
  • 105J: Rated Capacitance and Tolerance
  • 250V: Rated Voltage (V.dc)

Packaging Instructions

  • Inner Box Dimensions: L*W*H = 34.5*23.5*24.5 cm
  • Outer Box Dimensions: L*W*H = 49*36*27 cm
  • Packaging includes: Manufacturer Part Number, package count, quantity per package, Lot No.
  • Capacitors are packaged in transparent PVC bags for moisture and dust protection.
  • RoHS environmental mark.
  • Other customer marking requirements.

Storage Conditions

  • Avoid prolonged exposure to air, which can degrade lead solderability.
  • Do not store in high temperature and high humidity environments.
  • Temperature: Max 35
  • Relative Humidity: Max 80%
  • Storage Time: Maximum 12 months (based on production date marked on the packaging bag).

Environmental Characteristics

  • Complies with RoHS requirements.
  • Complies with REACH requirements.
  • Complies with Halogen-free requirements (if specified).

Product Electrical Characteristics and Test Conditions

Unless otherwise specified, tests are conducted within standard atmospheric conditions: Ambient Temperature: 1535, Relative Humidity: 25%75%. For disputed test results, the following conditions apply: Ambient Temperature: 202, Relative Humidity: 60%70%.

Detailed Electrical Characteristics and Test Methods

No. Item Characteristic Test Method
1 Terminal Strength Tensile Strength No visible mechanical damage.
Wire diameter: 0.6 & 0.8mm. Load: 10N, Time: 10 seconds.
Bending Strength Wire diameter: 0.6 & 0.8mm. Force: 5N, 90 2 times.
2 Solderability Tinning rate of leads: 95% Flux temperature: 2455. Immersion time: 2.50.5 seconds.
3 Soldering Heat Resistance Appearance No visible damage.
Solder temperature: 2605. Immersion time: 101 seconds. Recovery time: 1-2 hours.
Tangent of Loss Angle Increase 0.004 (C1.0F, 10kHz)
0.004 (C>1.0F, 1kHz)
Capacitance Change C/C 3%
4 Initial Measurement Capacitance (1KHz) DF 1F: Test frequency 10kHz
CR > 1F: Test frequency 1kHz
Temperature Rapid Change Appearance No visible damage.
A=-40, B=+105, 5 cycles. Duration: t=30min.
Vibration Appearance No visible damage.
Amplitude 0.75mm or acceleration 98m/s (whichever is less), frequency 10-500Hz. Three directions, mutually perpendicular, 2h per direction, total 6h.
Shock Appearance No visible damage.
4000 times, acceleration 390m/s, pulse duration: 6ms.
Final Measurement Appearance No visible damage.
Capacitance Change C/C 5%
Tangent of Loss Angle Increase 0.004
Insulation Resistance Change IR/IR 50%
5 Initial Measurement Capacitance (1KHz) DF 1F: Test frequency 10kHz
CR > 1F: Test frequency 1kHz
Climatic Sequence Appearance No visible damage.
Dry Heat: +105, 16 hours.
Cyclic Damp Heat: Test Db, first cycle.
Cold: -40, 2 hours.
Low Pressure: No permanent breakdown, arcing, or harmful deformation of the case; 8.5kPa, 1 hour.
Cyclic Damp Heat: Test Db, remaining cycles.
Final Measurement Appearance No visible damage.
Capacitance Change C/C 5%
Tangent of Loss Angle Increase 0.005
Insulation Resistance Change IR/IR 50%
6 Damp Heat (Steady State) Appearance No visible damage.
Relative Humidity: 90-95%RH. Temperature: 402. Duration: 21 days. Recovery time: 1-2 hours.
Capacitance Change C/C 5%
Tangent of Loss Angle Increase 0.002 (C1.0F, 10kHz)
0.004 (C>1.0F, 1kHz)
Insulation Resistance Change IR/IR 50%
7 Endurance Appearance No visible damage.
T=85, 1000 hours. Applied voltage: 1.25UR.
Capacitance Change C/C 8%
Tangent of Loss Angle Increase 0.004
Insulation Resistance Change IR/IR 50%
8 Characteristics Dependent on Temperature Capacitance measurement at points b, d, f. Static method, capacitor held sequentially at each temperature: a.(202), b.(-403), d.(20 2), f.(1052), g.(202).
Characteristics at lower category temperature -40: 0 (Cb-Cd)/Cd +3%.
Characteristics at upper category temperature 105: -4.0% (Cf-Cd)/Cd 0.
9 Charge/Discharge Capacitance Change C/C 5%
Tangent of Loss Angle Increase 0.005 (10KHz, CR1.0uF)
0.005 (1KHz, CR>1.0uF)
Insulation Resistance Change IR/IR 50%

Charge/Discharge Cycles: 10,000. Charging time: 0.5s. Discharging time: 0.5s. Charging voltage: Rated voltage UR. Charging resistance: 220/CR (). Discharging resistance: 10/CR or 20 (whichever is larger). CR: Rated capacitance (uF).

Usage Rules

  • Usage Range: Do not exceed the upper category temperature. Avoid overload. Do not exceed maximum pulse current.
  • Handling Precautions: Avoid repeated squeezing at the lead root. Pay attention to the lead tips.
  • Soldering: Solder heat can transfer to the capacitor core. Be mindful of potential damage from high temperatures and prolonged soldering times.
  • Soldering Temperature Limits:
    • Wave Soldering (MPP Polypropylene Film Capacitors): TP 110 for 120 seconds; Ts 120 for 45 seconds. For P7.5mm, T4mm, wave soldering time
    • Soldering Iron: Tip temperature not exceeding 350, time not exceeding 3 seconds.
    • Film capacitors with leads are not suitable for reflow soldering.
  • Ts: Maximum temperature the capacitor body can withstand during wave soldering.
  • Tp: Maximum temperature the capacitor body can withstand during the preheating stage.

Maximum Effective Voltage vs. Frequency Curve

Note: The typical values in the curve graph are tested under conditions of sinusoidal voltage, ambient temperature 85, and capacitor internal temperature rise T=10.

Product Electrical Characteristic Diagrams

(Diagrams not provided in text)


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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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