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Flame retardant epoxy resin encapsulated metallized polypropylene film capacitor DGCX MPP154J2GC060B200ZR

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The CBB21/MPP series capacitors are metallized polypropylene film capacitors with an encapsulated design, utilizing a non-inductive winding structure. They are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key features include excellent self-healing properties due to the metallized polypropylene film and non-inductive structure, low loss, and low internal temperature rise. The capacitors are encapsulated with flame-retardant epoxy resin powder.

Product Attributes

  • Brand: DGCX
  • Product Type: CBB21/MPP type metallized polypropylene film capacitor (impregnated type)
  • Origin: Dongguan, Guangdong, China
  • Encapsulation Material: Flame-retardant epoxy resin powder (UL94V-0)
  • Internal Coating Material: Epoxy resin
  • Lead Material: Tinned copper clad steel wire
  • Sprayed Metal Layer: Zinc-tin alloy wire
  • Environmental Compliance: RoHS, REACH, Halogen-free (if required)

Technical Specifications

Product Model: CBB21/MPP

Product Code Example: MPP154J2GC060B200ZR

Customer Part Number: CX-MPP-250222-01

Release Date: 2024-07-06

P/N Cap (uF) Tol. % R.V VDC DF (1KHz) % Dimensions (mm)
L (2.0) W (max) H (max) T (max) P 1.0
MPP154J2GC060B200ZR 0.15 5 400 0.1 11.3 10.0 5.5 10.0 20

General Electrical Characteristics

Item Technical Specification Standard
Climate Category 40/105/21
Operating Temperature Range -40~+105 (+85~+105: Rated voltage derating 1.25% / )
Rated Temperature 85
Capacitance Range 0.001F6.8F
Capacitance Tolerance 5%(K), 10%(M)
Rated Voltage 100Vdc/160Vdc, 250Vdc, 400Vdc, 630Vdc, 1000Vdc, 1250Vdc, 1600 Vdc, 2000 Vdc
Dissipation Factor (DF) 0.0010 (1kHz, 20)
Insulation Resistance 30,000M for C0.33uF (100VDC, 60s)
10000M*uF for C>0.33uF (100VDC, 60s)
Dielectric Strength 1.6UR(VDC), 5 seconds

Maximum Pulse Rise Rate (dV/dt)

If the actual working voltage (U) is lower than the rated voltage (UR), the capacitor can operate at a higher dV/dt. The allowable dV/dt value should be multiplied by UR/U.

dV/dt (V/s) UR (VDC) P=7.5 P=10.0 P=15.0 P=22.5 P=27.5
100/160 130 110 100 70 50
250 240 220 200 120 100
400 450 350 300 180 150
630 550 420 400 250 180
1000/1250 2300 1950 975 600 300
1600 / 6000 4500 2400 /
2000 / / 8000 4500 /

Product Structure and Main Materials

No. Main Material Description Remark
1 Metallized Polypropylene Film MPPZAH -/-
2 Sprayed Metal Layer Zinc-tin alloy wire -/-
3 Leads Tinned copper clad steel wire -/-
4 Outer Encapsulation Material Epoxy resin powder Flame-retardant UL94V-0
5 Inner Protective Material Epoxy resin -/-

Note: All raw materials and finished products comply with RoHS environmental requirements.

Marking Explanation (Example)

  • DGCX: Company trademark
  • MPP: Product model or model code
  • 105J: Nominal capacitance and tolerance
  • 250V: Rated voltage (V.dc)

Packaging Instructions

  • Inner Box Dimensions: L*W*H = 34.5*23.5*24.5 cm
  • Outer Box Dimensions: L*W*H = 49*36*27 cm
  • Box Contents: Manufacturer part number, number of packages and quantity per package, Lot No.
  • Packaging: Capacitors are packaged in transparent PVC bags for moisture and dust protection.
  • Environmental Mark: RoHS
  • Other: Customer-specific labeling requirements.

Storage Conditions

  • Prolonged exposure to air may degrade lead soldering performance.
  • Avoid high temperature and high humidity environments.
  • Temperature: Max 35
  • Relative Humidity: Max 80%
  • Storage Time: Maximum 12 months (based on production date marked on the packaging bag).

Environmental Characteristics

  • Complies with RoHS requirements.
  • Complies with REACH requirements.
  • Complies with Halogen-free requirements (if specified).

Product Electrical Characteristics and Test Conditions

Unless otherwise specified, tests are conducted within standard atmospheric conditions:

  • Ambient Temperature: 1535
  • Relative Humidity: 25%75%

For questionable test results, the following limits apply:

  • Ambient Temperature: 202
  • Relative Humidity: 60%70%

Detailed Product Electrical Characteristics and Test Methods

No. Item Characteristic Test Method
1 Terminal Strength Tensile Strength No visible mechanical damage. Lead diameter: 0.6 & 0.8mm. Load: 10N, Time: 10 seconds.
Bending Strength Lead diameter: 0.6 & 0.8mm. Force: 5N, 90 2 times.
2 Solderability Lead tinning rate 95% Soldering temperature: 2455. Immersion time: 2.50.5 seconds.
3 Soldering Heat Resistance Appearance No visible damage. Soldering temperature: 2605. Immersion time: 101 seconds. Recovery time: 1-2 hours.
Dissipation Factor Increase 0.004 (C1.0F, 10kHz)
0.004 (C>1.0F, 1kHz)
Capacitance Change C/C 3%
4 Rapid Temperature Change Initial Measurement (Capacitance @ 1KHz, DF) CR1F: Test frequency 10kHz
CR>1F: Test frequency 1kHz
Appearance No visible damage. A=-40, B=+105, 5 cycles. Duration: t=30min.
Final Measurement (Capacitance Change, DF Increase, Insulation Resistance) Appearance: No visible damage.
Capacitance Change: C/C 5%
DF Increase: 0.004
Insulation Resistance: IR/IR 50%
5 Climatic Sequence Initial Measurement (Capacitance @ 1KHz, DF) CR1F: Test frequency 10kHz
CR>1F: Test frequency 1kHz
Test Conditions Dry Heat: +105, 16 hours
Cyclic Damp Heat: Test Db, first cycle
Cold: -40, 2 hours
Low Pressure: 8.5kPa, 1 hour (No permanent breakdown, arcing, or harmful deformation of the case)
Cyclic Damp Heat: Test Db, remaining cycles
Final Measurement (Capacitance Change, DF Increase, Insulation Resistance) Appearance: No visible damage.
Capacitance Change: C/C 5%
DF Increase: 0.005
Insulation Resistance: IR/IR 50%
6 Damp Heat, Steady State Appearance No visible damage. Relative Humidity: 90-95%RH. Temperature: 402. Duration: 21 days. Recovery time: 1-2 hours.
Capacitance Change C/C 5%
DF Increase & Insulation Resistance DF Increase: 0.002 (C1.0F, 10kHz) 0.004 (C>1.0F, 1kHz)
Insulation Resistance: IR/IR 50%
7 Endurance Appearance No visible damage. T=85, 1000 hours. Applied Voltage: 1.25UR.
Capacitance Change, DF Increase, Insulation Resistance Capacitance Change: C/C 8%
DF Increase: 0.004
Insulation Resistance: IR/IR 50%
8 Characteristics Dependent on Temperature Capacitance measurement at points b, d, f. Characteristics at lower category temperature -40: 0 (Cb-Cd)/Cd +3%
Characteristics at upper category temperature 105: -4.0% (Cf-Cd)/Cd 0
Static method, capacitor held sequentially at each temperature: a.(202), b.(-403), d.(20 2), f.(1052), g.(202).
9 Charge/Discharge Capacitance Change C/C 5%
DF Increase & Insulation Resistance Charge/Discharge Cycles: 10,000
Charging Time: 0.5 seconds
Discharging Time: 0.5 seconds
Charging Voltage: Rated voltage UR
Charging Resistor: 220/CR ()
Discharging Resistor: 10/CR or 20 (whichever is larger)
CR: Rated capacitance (uF)
DF Increase: 0.005 (10KHz, CR1.0uF), 0.005 (1KHz, CR>1.0uF)
Insulation Resistance: IR/IR 50%

Usage Rules

  • Usage Range: Do not exceed the upper category temperature; avoid overload; do not exceed maximum pulse current.
  • Operation Precautions: Avoid repeated squeezing at the lead root; pay attention to lead tips.
  • Soldering: Heat from soldering can transfer to the capacitor core. Avoid solder temperatures and durations that may cause degradation or damage.
  • Soldering Temperature Ranges:
    • Wave Soldering: TP 110 for 120 seconds; Ts 120 for 45 seconds. For P 7.5mm, T 4mm, wave soldering time
    • Soldering Iron: Tip temperature not exceeding 350, time not exceeding 3 seconds.
    • Lead-type film capacitors are not suitable for reflow soldering.
  • Ts: Maximum temperature the capacitor body can withstand during wave soldering.
  • Tp: Maximum preheating temperature the capacitor body can withstand.

Maximum Effective Voltage vs. Frequency Curve

Note: Typical values in the curve are tested under conditions of sinusoidal voltage, ambient temperature 85, and capacitor internal temperature rise T=10.

Product Electrical Characteristic Curves

(Refer to page 13 for diagrams)


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Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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