Metallized polypropylene film capacitor DGCX PPS333J3DA090C3F0ZR with non inductive internal structure
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MOQ:
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Delivery Time:
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Product Description
Product Overview
The CBB81/PPS series high-voltage metallized polypropylene film/foil capacitors (impregnated type) are designed for high-voltage and high-frequency pulse circuits. They feature a metallized film and aluminum foil composite construction with an internal non-inductive structure. These capacitors are widely used in applications such as TV and monitor deflection circuits (S-correction and line flyback waveforms), electronic ballasts, energy-saving lamps, surge absorbers, and SCR rectifier circuits. Key advantages include low loss, low internal temperature rise, and high dv/dt and overcurrent capabilities.
Product Attributes
- Brand: DGCX
- Product Series: CBB81/PPS
- Origin: Dongguan, Guangdong, China
- Material: Metallized Polypropylene Film/Aluminum Foil/Polypropylene Film, Tin-plated Copper Clad Steel Wire leads, Flame Retardant Epoxy Resin Powder encapsulation (UL94V-0)
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
Technical Specifications
| Item | Specification | Details | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Product Name | CBB81/PPS Series High-Voltage Metallized Polypropylene Film/Foil Capacitor (Impregnated Type) | |||||||||||
| Model Example | CBB81/PPS 0.033uF5% 2000V.dc P20 (22*16*9) | |||||||||||
| Product Code | PPS333J3DA090C3F0ZR | |||||||||||
| Scope | High-voltage metallized polypropylene film/foil capacitors (impregnated type) for electronic equipment. | |||||||||||
| Dimensions Table | P/N | Cap (uF) | Tol. % | R.V VDC | DF (1KHz) % | Dimensions (mm) L | W (max) | H (max) | T (max) | P | 1.0 | d 0.05 |
| 1 | 0.022 | 5 | 2000 | 0.1 | 22.0 | 16.0 | 9.0 | 20.0 | 3.5 | 0.8 | ||
| Model Introduction & Usage | Internal series non-inductive structure, tinned copper wire or tinned copper-clad steel wire welded to the sprayed gold layer of the capacitor core. Encapsulated with flame-retardant epoxy resin powder. | |||||||||||
| Typical Applications | High-voltage high-frequency pulse circuits, TV and monitor deflection circuits (S-correction and line flyback waveforms), electronic ballasts, energy-saving lamps, surge absorbers, SCR rectifier circuits. | |||||||||||
| Product Features | Metallized film & metal foil composite internal series structure. Low loss, low internal temperature rise. High dv/dt and high overcurrent capability. | |||||||||||
| Electrical Characteristics | Item | Technical Specification | Standard | |||||||||
| Climate Category | 40/105/21 | |||||||||||
| Operating Temperature Range | -40~+105 (+85~+105: Derating factor 1.5% per for R.V(dc)) | |||||||||||
| Capacitance Range | 0.00022~0.047uF | |||||||||||
| Capacitance Tolerance | 3%(H); 5%(J); 10%(K) | |||||||||||
| Rated Voltage | 630V, 1000V, 1200/1250V, 1600V; 2000V | |||||||||||
| Dissipation Factor | 0.1%(1KHz), 0.2%(10KHz), at 20~25 | |||||||||||
| Insulation Resistance | 50000M for C0.33uF; 15000MuF for C>0.33uF (Measured at 100VDC10VDC/60s / 20~25) | |||||||||||
| Dielectric Strength (Between Terminals) | 1.75UR(VDC), 5 seconds | |||||||||||
| Maximum Pulse Rise Time (dV/dt) | Refer to table (value depends on P and UR/U ratio) | |||||||||||
| Product Structure and Main Materials | No. | Main Material | Description | Remarks | ||||||||
| 1 | Metallized Polypropylene Film/Aluminum Foil/Polypropylene Film | MPPAT/AL/OPP | - | |||||||||
| 2 | Sprayed Welding Layer | Zinc-tin alloy wire | - | |||||||||
| 3 | Leads | Tinned copper clad steel wire | - | |||||||||
| 4 | Outer Encapsulation Material | Epoxy resin powder | Flame Retardant UL94V-0 | |||||||||
| 5 | Inner Protective Material | Epoxy resin | - | |||||||||
| Packaging Instructions | Inner box dimensions: 34.5*23.5*24.5 cm. Outer box dimensions: 49*36*27 cm. Packaging includes manufacturer part number, quantity per bag, Lot No. Capacitors are packed in transparent PVC bags for moisture and dust protection. RoHS environmental mark and other customer-specific markings. | |||||||||||
| Storage Conditions | Store in original packaging. Temperature: Max 35, Relative Humidity: Max 80%. Maximum storage time: 12 months from production date. Avoid prolonged exposure to air which may degrade lead solderability. Avoid high temperature and high humidity environments. | |||||||||||
| Environmental Characteristics | Compliant with RoHS, REACH, and Halogen-free requirements (if specified). | |||||||||||
| Product Electrical Characteristics and Test Conditions | Item | Characteristic | Test Method | |||||||||
| Terminal Strength | Tensile Strength, Bending Strength | Wire diameter: 0.6&0.8mm, Load: 10N/10s, Bending: 5N, 90x2 times | ||||||||||
| Solderability | Tinning rate 95% on leads | Flux temp: 2455, Immersion time: 2.50.5s | ||||||||||
| Soldering Heat Resistance | Appearance, tan increase, Capacitance change | Solder temp: 2605, Immersion time: 101s, Recovery: 1-2h | ||||||||||
| Temperature Rapid Change | Appearance | A=-40, B=+105, 5 cycles, Duration: 30min | ||||||||||
| Vibration | Appearance | Amplitude 0.75mm or Accel. 98m/s, Freq: 10-500Hz, 3 directions, 2h each | ||||||||||
| Shock | Appearance | 4000 times, Accel. 390m/s, Pulse duration: 6ms | ||||||||||
| Final Measurement | Appearance, Capacitance change, tan increase, Insulation Resistance change | As per standard tests | ||||||||||
| Climate Sequence | Appearance, Capacitance change, tan increase, Insulation Resistance change | Dry heat +105/16h, Cyclic damp heat (DB), Cold -40/2h, Low pressure 8.5kPa/1h | ||||||||||
| Steady State Damp Heat | Appearance, Capacitance change, tan increase, Insulation Resistance change | RH 90-95%, Temp: 402, 21 days | ||||||||||
| Endurance | Appearance, Capacitance change, tan increase, Insulation Resistance change | T=85, 1000h, Applied Voltage: 1.25UR | ||||||||||
| Characteristics Dependent on Temperature | Capacitance change | Static method at -40 and +105 | ||||||||||
| Charge/Discharge | Capacitance change, tan increase, Insulation Resistance change | 10,000 cycles, Charge voltage: UR, Charge time: 0.5s, Discharge time: 0.5s | ||||||||||
| Usage Rules | Do not exceed upper category temperature. Avoid overload. Do not exceed maximum pulse current. Avoid repeated squeezing at lead root. Be cautious of lead tip. | |||||||||||
| Soldering | Wave Soldering: TP110/120s; Ts120/45s. For P7.5mm, T4mm: Wave soldering time | |||||||||||
| Maximum Effective Current vs. Frequency Curve | Refer to graph (Typical values under sinusoidal voltage, ambient temp 10, internal temp rise T=10). | |||||||||||
| Product Electrical Characteristic Graphs | Refer to graphs. | |||||||||||
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina