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Metallized Polypropylene Film Capacitor with Non Inductive Winding DGCX MPP155J2GA080B200ZR Epoxy Coated

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Price: Negotiable
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Product Description

Product Overview

The CBB21/MPP series metallized polypropylene film capacitors are designed for electronic equipment with epoxy encapsulation. These capacitors feature a non-inductive winding structure with metallized polypropylene film and are suitable for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. They offer good self-healing properties, low loss, and low internal temperature rise, with a flame-retardant epoxy resin powder coating.

Product Attributes

  • Brand: Dongguan Chengxi Electronics Co., Ltd.
  • Product Type: CBB21/MPP type metallized polypropylene film capacitor (impregnated type)
  • Construction: Non-inductive winding structure
  • Encapsulation: Flame-retardant epoxy resin powder coating
  • Lead Wire: Tinned copper wire or tinned copper-clad steel wire
  • Environmental Compliance: RoHS, REACH, Halogen-free (if required)

Technical Specifications

Model/Part Number Capacitance (uF) Tolerance (%) Rated Voltage (VDC) Dissipation Factor (DF) (1KHz) Dimensions (mm) (L x H x T) Pitch (P) (mm)
MPP155J2GA080B200ZR 1.5 5% 400 0.1% 21.6 x 14.9 x 7.8 20.0

General Electrical Characteristics

Parameter Specification Test Conditions
Climate Category 40/105/21 -
Operating Temperature Range -40 to +105 (Voltage derating of 1.25% / for +85 to +105)
Rated Temperature 85 -
Capacitance Range 0.001F to 6.8F -
Capacitance Tolerance 5% (J), 10% (K) -
Rated Voltage (VDC) 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 -
Dissipation Factor (DF) 0.0010 (1kHz, 20)
Insulation Resistance 30,000M (for C0.33uF)
10000M*uF (for C>0.33uF)
(100VDC, 60 seconds)
Dielectric Strength 1.6 UR(VDC) 5 seconds

Maximum Pulse Rise Rate (dV/dt)

If the actual working voltage (U) is lower than the rated voltage (UR), the capacitor can operate at a higher dV/dt. The allowable dV/dt value should be multiplied by UR/U.

dV/dt (V/s) UR (VDC) P=7.5mm P=10.0mm P=15.0mm P=22.5mm P=27.5mm
100/160 130 110 100 70 50
250 240 220 200 120 100
400 450 350 300 180 150
630 550 420 400 250 180
1000/1250 2300 1950 975 600 300
1600 6000 4500 2400 - -
2000 8000 4500 - - -

Product Structure and Main Materials

No. Main Material Description Remark
1 Metallized Polypropylene Film MPPZAH -/-
2 Sprayed Layer Zinc-tin alloy wire -/-
3 Lead Wire Tinned copper-clad steel wire -/-
4 Outer Encapsulation Material Epoxy resin powder Flame retardant UL94V-0
5 Inner Protective Material Epoxy resin -

Note: All raw materials and finished products comply with RoHS environmental requirements.

Packaging Specifications

Item Dimensions (L*W*H)
Inner Box 34.5 x 23.5 x 24.5 cm
Outer Box 49 x 36 x 27 cm

Packaging Details:

  • Box contents include: Manufacturer part number, number of packages and quantity per package, Lot No.
  • Capacitors are packaged in transparent PVC bags for moisture and dust protection.
  • RoHS environmental mark.
  • Other customer marking requirements.

Storage Conditions

  • Prolonged exposure to air may degrade lead wire soldering performance.
  • Avoid high temperature and high humidity environments.
  • Temperature: Max 35
  • Relative Humidity: Max 80%
  • Storage Time: Maximum 12 months from the production date marked on the packaging bag.

Environmental Characteristics

  • Complies with RoHS requirements.
  • Complies with REACH requirements.
  • Complies with Halogen-free requirements (if specified).

Product Electrical Characteristics and Test Conditions

General Test Conditions: Ambient temperature: 1535, Relative humidity: 25%75%

Strict Test Conditions: Ambient temperature: 202, Relative humidity: 60%70%

Reliability Test Items

No. Item Characteristic Test Method Criteria
1 Terminal Strength Tensile Strength Load: 10N, Time: 10 seconds No visible mechanical damage
Bending Strength Wire diameter: 0.6 & 0.8mm, Force: 5N, 90 2 times -
2 Solderability Tinning rate of leads Flux temperature: 2455, Immersion time: 2.50.5 seconds 95%
3 Soldering Heat Resistance Appearance Solder temperature: 2605, Immersion time: 101 seconds, Recovery time: 1-2 hours No visible damage
DF Increase - 0.004 (C1.0F, 10kHz)
0.004 (C>1.0F, 1kHz)
Capacitance Change - C/C 3%
4 Rapid Change of Temperature Appearance A=-40, B=+105, 5 cycles, Duration: 30 min No visible damage
Vibration Amplitude 0.75mm or acceleration 98m/s, Frequency 10-500Hz, 3 directions, 2h each, total 6h No visible damage
Shock 4000 times, acceleration 390m/s, pulse duration: 6ms No visible damage
Final Measurement Appearance - No visible damage
Capacitance Change - C/C 5%
DF Increase - 0.004
Insulation Resistance - IR/IR 50%
5 Climatic Sequence Appearance Dry Heat: +105, 16h
Cyclic Damp Heat (Test Db, 1st cycle)
Cold: -40, 2h
Low Pressure: 8.5kPa, 1h
Cyclic Damp Heat (Test Db, remaining cycles)
No visible damage
Capacitance Change - C/C 5%
DF Increase - 0.005
Insulation Resistance - IR/IR 50%
6 Damp Heat, Steady State Appearance Relative Humidity: 90-95%RH, Temperature: 402, No load, Duration: 21 days, Recovery time: 1-2 hours No visible damage
Capacitance Change - C/C 5%
DF Increase - 0.002 (C1.0F, 10kHz)
0.004 (C>1.0F, 1kHz)
Insulation Resistance - IR/IR 50%
7 Endurance Appearance T=85, 1000 hours, Applied Voltage: 1.25UR No visible damage
Capacitance Change - C/C 8%
DF Increase - 0.004
Insulation Resistance - IR/IR 50%
8 Characteristics Dependent on Temperature Capacitance measurement at points b, d, f Static method, capacitor held sequentially at each temperature: a.(202), b.(-403), d.(20 2), f.(1052), g.(202) At lower category temperature -40: 0 (Cb-Cd)/Cd +3%
At upper category temperature 105: -4.0% (Cf-Cd)/Cd 0
9 Charge/Discharge Capacitance Change Charge/discharge cycles: 10,000
Charging time: 0.5s
Discharging time: 0.5s
Charging voltage: Rated voltage UR
Charging resistance: 220/CR ()
Discharging resistance: 10/CR or 20 (whichever is larger)
CR: Rated capacitance (uF)
C/C 5%
DF Increase - 0.005 (10KHz, CR1.0uF)
0.005 (1KHz, CR>1.0uF)
Insulation Resistance - IR/IR 50%

Usage Rules

  • Usage Range: Do not exceed the upper category temperature. Avoid overload. Do not exceed maximum pulse current.
  • Operation Precautions: Avoid repeated squeezing at the lead wire root. Be cautious of lead wire tips.
  • Soldering: Solder heat can transfer to the capacitor core through lead wires and encapsulation. Be mindful of potential damage from high temperatures and prolonged soldering.
    • Wave Soldering: TP 110 for 120 seconds; Ts 120 for 45 seconds. For P7.5mm, T4mm, wave soldering time
    • Soldering Iron: Tip temperature not exceeding 350, welding time not exceeding 3 seconds.
    • Lead film capacitors are not suitable for reflow soldering.

Ts: Maximum temperature the capacitor body can withstand during wave soldering.
Tp: Maximum preheating temperature the capacitor body can withstand.

Maximum Effective Voltage and Frequency Curve Diagram

Note: The curve diagram shows typical values tested under conditions of sinusoidal voltage, ambient temperature 85, and capacitor internal temperature rise T=10.

Product Electrical Characteristic Diagrams

(Diagrams not provided in text)


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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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