Flame Retardant Epoxy Resin Encapsulated Capacitor DGCX MPP105J2JD100B200ZR Metallized Polypropylene Film Type
Product Overview
The CBB21/MPP series metallized polypropylene film capacitors (impregnated type) are designed for electronic equipment with epoxy encapsulation. These capacitors feature a non-inductive winding structure with metallized polypropylene film and are equipped with tinned copper wire or tinned copper-clad steel leads. They are widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key advantages include excellent self-healing properties due to the metallized polypropylene film, low loss, and minimal internal temperature rise. The capacitors are encapsulated with flame-retardant epoxy resin powder.
Product Attributes
- Brand: Chengxi Electronics ()
- Product Type: Metallized Polypropylene Film Capacitor (Impregnated Type)
- Series: CBB21/MPP
- Encapsulation: Flame-retardant epoxy resin powder
- Construction: Non-inductive winding
- Leads: Tinned copper wire or tinned copper-clad steel wire
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
- Certifications: UL94V-0 (for encapsulation material)
Technical Specifications
| Specification | Details |
|---|---|
| Model Name | CBB21/MPP |
| Product Code | MPP105J2JD100B200ZR |
| Nominal Capacitance | 1F 5% |
| Rated Voltage | 630V.dc |
| Dimensions (L*W*H) | 16.7*16.2*9.9 mm (P=15) |
| Pitch (P) | 15.0 mm 0.5 |
| Lead Diameter (d) | 0.8 mm 0.05 |
| Climate Category | 40/105/21 |
| Operating Temperature Range | -40 to +105 |
| Rated Temperature | 85 |
| Capacitance Range | 0.001F to 6.8F |
| Capacitance Tolerance | 5% (J), 10% (K) |
| Rated Voltages | 100Vdc, 160Vdc, 250Vdc, 400Vdc, 630Vdc, 1000Vdc, 1250Vdc, 1600Vdc, 2000Vdc |
| Dissipation Factor (DF) (1kHz, 20) | 0.0010 |
| Insulation Resistance (IR) | 30,000M for C0.33F (100VDC, 60s) 10,000M*F for C>0.33F (100VDC, 60s) |
| Dielectric Strength | 1.6 UR(VDC), 5 seconds |
| Lead Material | Tinned copper-clad steel wire |
| Main Material | Metallized Polypropylene Film (MPPZAH) |
| Soldering Layer Material | Zinc-tin alloy wire |
| Outer Encapsulation Material | Flame-retardant epoxy resin powder (UL94V-0) |
| Inner Protective Material | Epoxy Resin |
| Inner Box Dimensions (L*W*H) | 34.5*23.5*24.5 cm |
| Outer Box Dimensions (L*W*H) | 49*36*27 cm |
| Storage Temperature | Max 35 |
| Storage Humidity | Max 80% RH |
| Maximum Storage Time | 12 months (from production date) |
| Soldering Temperature (Wave Soldering) | TP 110 (120s); Ts 120 (45s) For P7.5mm, T4mm: |
| Soldering Temperature (Soldering Iron) | Tip temperature 350, time 3 seconds |
Note: All raw materials and finished products comply with RoHS environmental requirements.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.