Metallized Polypropylene Film Capacitor DGCX MPP105J2GA060C3F0ZR Non Inductive Winding Epoxy Encapsulation
Product Overview
The CBB22/MPP series metallized polypropylene film capacitors are designed for electronic equipment with epoxy encapsulation. These capacitors feature a non-inductive winding structure with metallized polypropylene film and tin-plated copper wire or tin-plated copper-clad steel wire leads. They are encapsulated with flame-retardant epoxy resin powder. These capacitors are widely used for DC blocking, coupling, decoupling, filtering, bypassing, and other high-frequency, DC, AC, and pulse circuits. Key advantages include excellent self-healing properties due to the non-inductive structure, low loss, and low internal temperature rise. They are compliant with RoHS and REACH environmental standards.
Product Attributes
- Brand: DGCX ()
- Product Type: CBB22/MPP Metallized Polypropylene Film Capacitor (Impregnated Type)
- Construction: Non-inductive winding, epoxy encapsulation
- Leads: Tin-plated copper wire or tin-plated copper-clad steel wire
- Encapsulation: Flame-retardant epoxy resin powder (UL94V-0)
- Environmental Compliance: RoHS, REACH, Halogen-free (if required)
- Origin: Dongguan, Guangdong, China
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | CBB22/MPP Metallized Polypropylene Film Capacitor (Impregnated Type) |
| Model Example | CBB22 105J/400V/P=20/L=3.5 (21.9*12.5*6.3) |
| Product Code Example | MPP105J2GA060C3F0ZR |
| Climate Category | 40/105/21 |
| Operating Temperature Range | -40 to +105 (Derating required above +85) |
| Rated Temperature | 85 |
| Capacitance Range | 0.001F to 6.8F |
| Capacitance Tolerance | 5%(K), 10%(K) |
| Rated Voltage (Vdc) | 100, 160, 250, 400, 630, 1000, 1250, 1600, 2000 |
| Dissipation Factor (DF) (1kHz, 20) | 0.0010 |
| Insulation Resistance | 30,000M for C0.33uF; 10000M*uF for C>0.33uF (at 100VDC, 60s) |
| Dielectric Strength | 1.6 UR(VDC), 5 seconds |
| Max. Pulse Rise Rate (dV/dt) | Refer to chart in datasheet (dependent on UR and P) |
| Lead Diameter | 0.6mm & 0.8mm |
| Tinning Rate (Lead) | 95% |
| Solder Heat Resistance | No visible damage, C/C3%, DF increase 0.004 (for C1.0F) |
| Rapid Temperature Change | No visible damage |
| Vibration | No visible damage |
| Shock | No visible damage |
| Damp Heat (Steady State) | No visible damage, C/C5%, DF increase 0.002 (for C1.0F) |
| Endurance (85, 1000h, 1.25UR) | No visible damage, C/C8%, DF increase 0.004 |
| Charge/Discharge Cycles | No visible damage, C/C5%, DF increase 0.005 |
| Dimensions (Example: 105J/400V/P=20/L=3.5) | L: 21.9mm, W: 12.5mm, H: 6.3mm, P: 20mm, Lead Length: 3.5mm |
| Packaging (Inner Box) | 34.5*23.5*24.5 cm (L*W*H) |
| Packaging (Outer Box) | 49*36*27 cm (L*W*H) |
| Storage Temperature | Max 35 |
| Storage Humidity | Max 80% RH |
| Max Storage Time | 12 months (from production date) |
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