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Low DC Resistance Wire Wound Chip Inductor DMBJ PNLS4020-220M 22UH with Closed Magnetic Circuit

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Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

PNLS Series Chip Power Inductor

The PNLS Series Chip Power Inductor is a wire-wound inductor designed for high-performance applications. It features a closed magnetic circuit design for reduced leakage flux and EMI, a metallized ferrite core for enhanced durability, and low DC resistance for minimal power loss. Its compact size and slim profile make it ideal for space-constrained PCB designs.

Product Attributes

  • Brand: Dongguan Zhenbaojia Electronics Co., Ltd.
  • Product Series: PNLS Series
  • Type: Wire Wound Chip Inductor
  • Origin: Dongguan, China

Applications

Widely used in smart phones, set-top boxes, VR, AR, notebooks, desktop computers, servers, portable gaming devices, personal navigation systems, and personal multimedia devices.

Features

  • Large saturation current
  • Metallization on ferrite core results in excellent shock resistance and damage-free durability
  • Closed magnetic circuit design reduces leakage flux and Electro Magnetic Interference (EMI)
  • Low DCR decreases power loss, small and slim take up less PCB real estates.

Technical Specifications

Product TypeExternal Dimensions (L x W) (mm)Nominal InductanceInductance ToleranceFigureA (mm)B (mm)C (max) (mm)D (max) (mm)E (max) (mm)
PNLS2520102.0 x 1.6R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.12.50.32.00.351.052.10.85
PNLS2520122.0 x 1.6R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.12.50.32.00.351.252.00.85
PNLS30103.0 x 3.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.13.00.33.00.351.202.50.85
PNLS30123.0 x 3.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.23.00.33.00.351.302.80.90
PNLS30153.0 x 3.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.23.00.33.00.351.502.60.90
PNLS40104.0 x 4.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.351.153.51.30
PNLS40124.0 x 4.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.351.353.51.30
PNLS40184.0 x 4.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.351.803.51.30
PNLS40204.0 x 4.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.352.103.51.30
PNLS40264.0 x 4.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.352.803.51.30
PNLS40304.0 x 4.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.24.00.34.00.353.003.51.30
PNLS50125.0 x 5.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.351.304.01.50
PNLS50205.0 x 5.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.352.004.01.50
PNLS50405.0 x 5.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.354.004.01.50
PNLS50455.0 x 5.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.25.00.35.00.354.504.01.50
PNLS60126.0 x 6.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.351.305.01.65
PNLS60206.0 x 6.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.26.00.36.00.352.005.01.65
PNLS60306.0 x 6.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.353.005.01.85
PNLS60456.0 x 6.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.354.505.01.65
PNLS60506.0 x 6.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.355.305.01.65
PNLS60606.0 x 6.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.36.00.36.00.356.305.01.65
PNLS80408.0 x 8.0R10 (0.1H) - 100 (10H)K (10%), M (20%), N (30%)Fig.38.00.38.00.354.206.32.45

Operating and Storage Conditions

Operating Temperature Range: -40 to +85

Storage Temperature Range: -10 to +40, 70% RH.

Testing and Reliability

Test Conditions: Ambient Temperature: 2015 , Relative Humidity: 6520%, Air Pressure: 86 kPa to 106 kPa.

Key Tests:

  • DC Resistance (RDC): Refer to Appendix A.
  • Inductance (|Z|): Refer to Appendix A. Test signal: -40dBm or 100mV.
  • Quality Factor (Q): Refer to Appendix A. Test signal: -40dBm or 100mV.
  • Rated Current (Ir): Refer to Appendix A. Inductance drop L/L100%30%.
  • Solderability: 95% min. coverage of all metallized area. Solder temp.: 2405 , Immersion time: 31 sec.
  • Resistance to Solder Heat: No visible damage. Solder Temp.: 2653 , Immersion time: 61 sec.
  • Bend: Inductance within 20%, DC resistance within standard requirements.
  • Vibration: Appearance: no mechanical damage. Inductance within 20%. Frequency: 10~55~10 Hz, Amplitude: 1.5mm(peak-peak). Duration: 2 hrs./axis, total 6 hrs.
  • Temperature Shock: Appearance: no mechanical damage. Inductance within 20%. Temp.: -40, +85 (30 min each). Cycle: 5 times.
  • Humidity Resistance: Appearance: no mechanical damage. Inductance within 20%. Humidity: 90-95% RH, Temp.: 602 , Applied current: Rated current. Testing time: 1000 hours.
  • High Temperature Resistance: Appearance: no mechanical damage. Inductance within 20%. Temp.: +852, Applied current: Rated current. Testing time: 1000 hours.
  • Low Temperature Storage: Appearance: no mechanical damage. Inductance within 20%. Temp.: -402. Testing time: 1000 hours.
  • Terminal Strength: No deformation. Inductance within 20%. DC resistance within standard requirements.
  • Drop: No failure. Height: 100cm. 3 directions, 3 times each direction (Total 9 times).
  • Salt Mist: Appearance: no mechanical damage. Inductance within 20%. Concentration: (50.1)%, PH: 6.5-7.2, Time: 482h.

Packaging and Storage

Packaging: Available in tape and reel packaging. Reel dimensions vary by product type (e.g., 1782mm, 3302mm diameter). Peeling off force and packaging quantities are specified.

Storage: Store in a cool, dry place (below 40, less than 70% RH). Avoid exposure to high humidity, dust, or corrosive gases to maintain solderability.


Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Silk Road Enterprise Management Services Co., Ltd.
Location 16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person Sellina

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