High Reliability Wire Wound Chip Inductor DMBJ PNLS4030-221M 220UH Featuring Closed Magnetic Circuit
PNLS Series Chip Power Inductor
The PNLS Series Chip Power Inductor is a wire-wound chip inductor designed for high-performance applications. It offers a large saturation current, excellent shock resistance and durability due to metallization on the ferrite core, and reduced leakage flux and EMI thanks to a closed magnetic circuit design. Its low DC resistance minimizes power loss, and the small, slim form factor conserves PCB space. This series is widely used in smart phones, set-top boxes, VR/AR devices, notebooks, desktop computers, servers, gaming devices, navigation systems, and multimedia devices.
Product Attributes
- Brand: Dongguan Zhenbaojia Electronics Co., Ltd.
- Product Series: PNLS Series
- Product Type: Wire Wound Chip Inductor
- Origin: Dongguan, China
Technical Specifications
| Type | External Dimensions (LW) (mm) | Nominal Inductance | Inductance Tolerance | Fig. | A | B | C(max) | D(max) | E(max) |
| PNLS252010 | 2.01.6 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.1 | 2.50.3 | 2.00.35 | 1.05 | 2.1 | 0.85 |
| PNLS252012 | 2.01.6 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.1 | 2.50.3 | 2.00.35 | 1.25 | 2.0 | 0.85 |
| PNLS3010 | 3.03.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.1 | 3.00.3 | 3.00.35 | 1.20 | 2.5 | 0.85 |
| PNLS3012 | 3.03.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 3.00.3 | 3.00.35 | 1.30 | 2.8 | 0.90 |
| PNLS3015 | 3.03.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 3.00.3 | 3.00.35 | 1.50 | 2.6 | 0.90 |
| PNLS4010 | 4.04.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 4.00.3 | 4.00.35 | 1.15 | 3.5 | 1.30 |
| PNLS4012 | 4.04.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 4.00.3 | 4.00.35 | 1.35 | 3.5 | 1.30 |
| PNLS4018 | 4.04.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 4.00.3 | 4.00.35 | 1.80 | 3.5 | 1.30 |
| PNLS4020 | 4.04.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 4.00.3 | 4.00.35 | 2.10 | 3.5 | 1.30 |
| PNLS4026 | 4.04.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 4.00.3 | 4.00.35 | 2.80 | 3.5 | 1.30 |
| PNLS4030 | 4.04.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 4.00.3 | 4.00.35 | 3.00 | 3.5 | 1.30 |
| PNLS5012 | 5.05.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 5.00.3 | 5.00.35 | 1.30 | 4.0 | 1.50 |
| PNLS5020 | 5.05.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 5.00.3 | 5.00.35 | 2.00 | 4.0 | 1.50 |
| PNLS5040 | 5.05.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 5.00.3 | 5.00.35 | 4.00 | 4.0 | 1.50 |
| PNLS5045 | 5.05.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 5.00.3 | 5.00.35 | 4.50 | 4.0 | 1.50 |
| PNLS6012 | 6.06.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.3 | 6.00.3 | 6.00.35 | 1.30 | 5.0 | 1.65 |
| PNLS6020 | 6.06.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.2 | 6.00.3 | 6.00.35 | 2.00 | 5.0 | 1.65 |
| PNLS6030 | 6.06.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.3 | 6.00.3 | 6.00.35 | 3.00 | 5.0 | 1.85 |
| PNLS6045 | 6.06.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.3 | 6.00.3 | 6.00.35 | 4.50 | 5.0 | 1.65 |
| PNLS6050 | 6.06.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.3 | 6.00.3 | 6.00.35 | 5.30 | 5.0 | 1.65 |
| PNLS6060 | 6.06.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.3 | 6.00.3 | 6.00.35 | 6.30 | 5.0 | 1.65 |
| PNLS8040 | 8.08.0 | R10 (0.1H) to 100 (10H) | K (10%), M (20%), N (30%) | Fig.3 | 8.00.3 | 8.00.35 | 4.20 | 6.3 | 2.45 |
Operating and Storage Conditions
Operating Temperature Range: -40 to +85
Storage Temperature Range: -10 to +40, 70% RH
Testing and Reliability
Test Conditions: Ambient Temperature: 2015, Relative Humidity: 6520%, Air Pressure: 86 kPa to 106 kPa.
DC Resistance (RDC): Refer to Appendix A. Tested with High Accuracy Milliohmmeter HP4338B or equivalent.
Inductance (|Z|): Refer to Appendix A. Tested with High Accuracy RF Inductance/Material Analyzer Anglient E4991A+HP16192A or equivalent. Test signal: -40dBm or 100mV. Test frequency refers to Item 5.
Quality Factor (Q): Refer to Appendix A. Tested with High Accuracy RF Inductance/Material Analyzer Anglient E4991A+HP16192A or equivalent. Test signal: -40dBm or 100mV. Test frequency refers to Item 5.
Rated Current (Ir): Refer to Appendix A. Tested with HP6632B DC Power Supply and digital surface thermometer or equivalent. Inductance drop L/L100% 30%.
Solderability: 95% min. coverage of all metallized area. Solder temp: 2405, Immersion time: 31 sec. Solder: Sn-3Ag-0.5Cu.
Resistance to Solder Heat: No visible damage. Electrical and mechanical characteristics shall be satisfied. Solder Temp: 2653, Immersion time: 61 sec. Preheating: 100-150 for 1 minute. Measurement after 242 hrs at room temp. Solder: Sn-3Ag-0.5Cu.
Bend: After bending test, no deformation. Inductance within 20%, DC resistance within standard requirements. Test involves bending a test substrate with soldered chip by 2mm for 10s.
Vibration: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: Sine wave, 10-55-10 Hz, Sweep time: 1min, Amplitude: 1.5mm (peak-peak), 3 axes (X,Y,Z), 2 hrs/axis (Total 6 hrs).
Temperature Shock: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: -40 and +85 for 30 mins each, 5 cycles. Measurement after 24 hrs at room temp.
Humidity Resistance: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: 90-95% RH, 602, Rated DC current, 1000 (+48,0) hours. Measurement after 24 hrs at room temp.
High Temperature Resistance: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: +852, Rated DC current, 1000 (+48,0) hours. Measurement after 24 hrs at room temp.
Low Temperature Storage Life: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: -402, 1000 (+48,0) hours. Measurement after 24 hrs at room temp.
Terminal Strength: No deformation. Inductance change within 20%. DC resistance within standard requirements. Test involves applying 10N thrust for 10 sec (2N for 0603[0201] products).
Drop: No failure after test. Dropped on concrete or steel board. Method: free fall. Height: 100cm. 3 directions, 3 times each direction (Total 9 times).
Salt Mist: Appearance: no mechanical damage. Inductance change within 20%. Test Condition: Salt solution concentration (50.1)%, PH: 6.5-7.2, Time: 482h.
Packaging and Storage
Packaging: Available in tape and reel packaging. Reel dimensions and quantities vary by product type. For detailed tape dimensions, refer to the specification table.
Storage: Store in a cool, dry place (below 40, less than 70% RH) and avoid exposure to dust or corrosive gases to maintain solderability.
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