Crystal unit EPSON Q13FC13500049 for consumer electronics offering frequency control and RoHS compliance

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Product Description

Product Overview

The Seiko Epson FC-135 is a crystal unit designed for general consumer electronics equipment. It is RoHS compliant, with an exemption for lead in low-melting type solder. This product is not intended for applications requiring extremely high reliability, such as weapons of mass destruction, purposes, satellites, rockets, or life-support medical equipment. The product is supplied under Seiko Epson Corporation's packing standards and comes with a 12-month warranty against manufacturing defects.

Product Attributes

Brand: SEIKO EPSON CORPORATION
Model: FC-135
Product No.: Q13FC1350004900
Specification No.: ECC2015-0056
Date: Aug. 1, 2015
Version: 20150424
Certifications: RoHS compliant (with lead exemption)

Technical Specifications

Item	Symbol	Min.	Typ.	Max.	Unit	Conditions	Notes
Storage temperature range	T_stg	-55		+125	C		Suppose to be within CI STD at + 25 C 3 C.
Maximum level of drive	GL			0.5	W
Operating temperature range	T_use	-40		+85	C
Level of drive	DL	0.01	0.1	0.5	W
Vibration mode						Fundamental
Nominal Frequency	f_nom		32.768		kHz	CL =6 pF Ta = + 25 3 C Level of drive : 0.1 W Not include aging
Frequency tolerance	f_tol		20 10^-6			CL =6 pF Ta = + 25 3 C Level of drive : 0.1 W Not include aging
Motional resistance	R1			70	k	CI meter : Saunders 140B Level of drive : 0.5 W
Motional capacitance	C1		3.4		fF
Shunt capacitance	C0		1.2		pF
Frequency temperature characteristics Turnover temperature	Ti		+ 25 5		C	Values are calculated by The frequencies at + 10, + 25, + 40 C with C-MOS circuit.
Parabolic coefficient	B			-0.04	10^-6 /C²
Isolation resistance	IR	500			M	DC 100 V 15, 60 seconds Between terminal # 1 and terminal # 2
Frequency Aging	f_age		3 10^-6/year			Ta = + 25 C 3 C Level of drive : 0.1 W
Shock resistance						100 g dummy(EPSON Standard), Natural drop from 1 500 mm height on to the concrete. 3 directions 10 times	*3 f/f : 8 10^-6
Vibration resistance						10 Hz to 55 Hz amplitude 0.75 mm 55 Hz to 500 Hz acceleration 98 m/s² 10 Hz 500 Hz 10 Hz 15 min./cycle 6 h (2 hours , 3 directions)	*3 f/f : 3 10^-6
Soldering heat resistance						For convention reflow soldering furnace (2 times)	f/f : 5 10^-6
High temperature storage						+ 125 C 1 000 h	3 f/f : 10 10^-6 1
High temperature storage						+ 85 C 1 000 h	3 f/f : 7 10^-6 1
Low temperature storage						- 55 C 1 000 h	3 f/f : 10 10^-6 1
High temperature and humidity						+ 85 C 85 %RH 1000 h	3 f/f : 10 10^-6 1
Temperature cycle						- 55 C + 125 C 30 minutes at each temperature 100 cycles	3 f/f : 10 10^-6 1
Sealing				1 10^-8	hPal / s	For He leak detector	*3 Max.
Shear						20 N press for 10 1 s. Ref. IEC 60068-2-21	No peeling-off at a soldered part
Pull - off						20 N press for 10 1 s. Ref. IEC 60068-2-21	No peeling-off at a soldered part
Substrate bending						Bend width reaches 3 mm and hold for 5 s 1 s 1 time Ref. IEC 60068-2-21	No peeling-off at a soldered part
Solvent resistance						Ref. JIS C 0052 or IEC 60068-2-45	The marking shall be legible