RoHS Compliant Crystal Unit EPSON Q13MC14610004 for General Consumer Electronics Equipment Japan Made

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Product Description

Product Overview

The SEIKO EPSON CORPORATION MC-146 crystal unit (Product No.: Q13MC1461000400) is designed as a component for general consumer electronics equipment. It is RoHS compliant, with an exemption for lead in high melting type solder. This product is not intended for use in applications requiring extremely high reliability such as weapons of mass destruction, purposes, satellites, rockets, space life support systems, or medical equipment.

Product Attributes

Brand: SEIKO EPSON CORPORATION
Origin: Japan
Certifications: RoHS compliant

Technical Specifications

Item	Symbol	Min.	Typ.	Max.	Unit	Conditions	Notes
Absolute maximum ratings
Storage temperature range	T_stg	-55		+125	C		Suppose to be within CI STD at + 25 C 3 C.
Maximum level of drive	GL			1.0	W
Operating range
Operating temperature range	T_use	-40		+85	C
Level of drive	DL	0.01	0.1	0.5	W
Vibration mode			Fundamental
Static characteristics
Nominal Frequency	f_nom		32.768		kHz
Frequency tolerance	f_tol		20 10^-6			CL = 9 pF Ta = + 25 3 C Level of drive : 0.1 W	Not include aging
Motional resistance	R1			65	k	CI meter : Saunders 140B Level of drive : 0.5 W
Motional capacitance	C1		1.9		fF
Shunt capacitance	C0		0.8		pF
Frequency temperature characteristics Turnover temperature	Ti		+ 25 5		C	Values are calculated by The frequencies at + 10, + 25, + 40 C with C-MOS circuit.
Parabolic coefficient	B		-0.04	Max.	10^-6 /C²
Isolation resistance	IR	500	Min.		M	DC 100 V 15, 60 seconds Between terminal # 1 and terminal # 4
Frequency Aging	f_age		3 10^-6/year			Ta = + 25 C 3 C Level of drive : 0.1 W
Environmental and Mechanical characteristics
Shock	f/f [1 10⁶]		5			100 g dummy (EPSON TOYOCOM Standard) drop from 1500 mm height on to the concrete 3 directions 10 times	12
Vibration	f/f [1 10⁶]		3			10 Hz to 55 Hz amplitude 0.75 mm 55 Hz to 500 Hz acceleration 98 m/s2 10 Hz 500 Hz 10 Hz 15 min./cycle 6 h (2 hours , 3 directions)	*3
Resistance to soldering heat (Reflow characteristics)	f/f [1 10⁶]		5			Treat the Reflow 2 times by the following profile in the next page	*3
High temperature storage	f/f [1 10⁶]		a ) 20 b ) 10			a ) + 125 C 1 000 h b ) + 85 C 1 000 h	*3
Low temperature storage	f/f [1 10⁶]		10			- 55 C 1 000 h	*3
Temperature humidity storage	f/f [1 10⁶]		10			+ 85 C 85 %RH 1000 h	*3
Temperature cycle	f/f [1 10⁶]		10			- 55 C + 125 C 30 minutes at each temperature 100 cycles	*3
Shear			No peeling-off at a soldered part			10 N press the side for 10 s 1 s. Ref. IEC 60068-2-21
Pull-off			No peeling-off at a soldered part			10 N press the side for 10 s 1 s. Ref. IEC 60068-2-21
Substrate bending			No peeling-off at a soldered part			Bending width reaches 3mm and hold for 5 s 1 s 1 time Ref. IEC 60068-2-21
Solderability			Termination must be 95 % covered with fresh solder			Dip termination into solder bath at + 235 5 C for 3 s (Using rosin flux)
Solvent resistance			The marking shall be legible			Ref. JIS C 0052 or IEC 60068-2-45