RoHS directive compliant crystal unit EPSON Q22FA23V00019 for in various consumer electronic devices

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

The FA-238V is a crystal unit designed as a component for general consumer electronics equipment. It complies with the RoHS Directive and is delivered by Seiko Epson Corporation to DELTA ELECTRONICS, INC. This product is not intended for use in applications requiring extremely high reliability, such as weapons of mass destruction, purposes, or critical life-support systems.

Product Attributes

Brand: SEIKO EPSON CORPORATION
Origin: Japan
Certifications: RoHS Directive compliant

Technical Specifications

Item	Symbol	Rating Value	Unit	Conditions	Notes
Absolute maximum ratings	T_stg	-40 to +125	C		Depends on the Environmental characteristics specifications.
Absolute maximum ratings
Operating range	T_use	-20 to +70	C
Operating range	DL	1 to 100	200 W
Static characteristics	f_o	12	MHz	Fundamental
	f_tol	50 x 10^-6		CL = 10 pF, Ta = +25 C, DL : 100 W (Not include aging)
	R1	100	Max.		Max. circuit IEC 60444-2, Ta = Operating temperature range, DL : 100 W
	C0	5.0	Max. pF		circuit and N.A.
	f_tem	30 x 10^-6		Ta = Operating temperature range (Ref. at Ta = +25 C 3 C), DL : 100 W
	IR	500	Min. M	DC 100 V, 15, 60 seconds between each terminals
	f_age	5 x 10^-6/year		Ta = +25 C 3 C
Environmental and mechanical characteristics	Shock	10 to 100 g		100 g dummy Jig (Seiko Epson Standard) drop from 1 500 mm height on the Concrete, 3 directions, 10 times	f / f [1 x 10^-6] 10
	Vibration			10 Hz to 55 Hz amplitude 0.75 mm, 55 Hz to 500 Hz acceleration 98 m/s², 10 Hz to 500 Hz 15 min./cycle, 6 h (2 hours, 3 directions)	f / f [1 x 10^-6] 5
	High temperature storage	+85 C		1 000 h	f / f [1 x 10^-6] 5
	Low temperature storage	-40 C		1 000 h	f / f [1 x 10^-6] 5
	Temperature cycle	-40 C to +85 C		30 minutes at each temp., 100 cycle	f / f [1 x 10^-6] 5
	Temperature humidity storage	+85 C, 85 %RH		1 000 h	f / f [1 x 10^-6] 10
	Resistance to soldering heat			For convention reflow soldering furnace (3 times)	Shift motional resistance at after above tests should be less than 20 % or less than 10 .
	Substrate bending			Bend width reaches 3.0 mm and hold for 5 s, 1 s, 1 time, Ref. IEC 60068-2-21	No peeling-off at a soldered part
	Shear			10 N press for 10 s, 1 s, Ref. IEC 60068-2-21	No peeling-off at a soldered part
	Pull off			10 N press for 10 s, 1 s, Ref. IEC 60068-2-21	No peeling-off at a soldered part
	Solderability			Dip termination into solder bath at +235 C 5 C for 5 s (Using Rosin Flux)	Terminals must be 95 % covered with fresh solder.