crystal unit EPSON Q24FA20H00491 featuring 24 MHz frequency and compliance with RoHS Directive standards

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Product Description

Product Overview

This document details the specifications for the FA-20H crystal unit, product number Q24FA20H0049100. This product complies with the RoHS Directive and is designed for general consumer electronics. It is not intended for high-reliability applications such as weapons of mass destruction, purposes, satellites, rockets, space life support, or medical equipment.

Product Attributes

Brand: Seiko Epson Corporation
Certifications: RoHS Directive compliant

Technical Specifications

Item	Symbol	Value/Rating	Unit	Conditions	Notes
Absolute maximum ratings	T_stg	-40 to +125	C		Depends on the Environmental characteristics specifications.
Absolute maximum ratings
Operating range	T_use	-40 to +85	C
Operating range	DL	100 to 200	W		Recommended: 100 W
Static characteristics	f_nom	24	MHz	Fundamental
	f_tol	10 10^-6		CL = 10pF, Ta = +25 3C, DL = 100 W (Not include aging)
	R1	48		circuit, IEC 60444-2, Ta = Operating temperature range, DL = 100 W
	C0	2.0	Max. pF	circuit and N.A.
	f_tem	20 10^-6		Ta = Operating temperature range (Ref. at Ta = +25 C 3 C), DL = 100 W
	IR	500	Min. M	DC 100 V15, 60 seconds, Between terminal # 1 and terminal # 3
	f_age	1 (12 -6/year		Ta = +25 C 3 C
Environmental and mechanical characteristics	Shock	2 (12	[1 10^-6]	150 g, dummy Jig (ETC Standard) drop from 1 500 mm height on the Concrete, 3 directions, 10 times	*3
	Vibration	2 (12	[1 10^-6]	10 Hz to 55 Hz amplitude 0.75 mm, 55 Hz to 500 Hz acceleration 98 m/s, 10 Hz 500 Hz 10 Hz, 15 min./cycle, 6 h (2 hours , 3 directions)	*3
	High temperature storage	2 (12	[1 10^-6]	+ 85 C 1 000 h	*3
	Low temperature storage	2 (12	[1 10^-6]	- 40 C 1 000 h	*3
	Temperature cycle	2 (12	[1 10^-6]	- 40 C + 85 C, 30 minutes at each temp., 100 cycle	*3
	Temperature humidity storage	2 (12	[1 10^-6]	+ 85 C 85 %RH 1 000 h	*3
	Resistance to soldering heat	2 (12	[1 10^-6]	For convention reflow soldering furnace (3 times)
	Substrate bending	No peeling-off at a soldered part		Bend width reaches 3 mm and hold for 5 s 1 s 1 time, Ref. IEC 60068-2-21
	Shear	No peeling-off at a soldered part		10 N press for 10 s 1 s, Ref. IEC 60068-2-21
	Pull off	No peeling-off at a soldered part		10 N press for 10 s 1 s, Ref. IEC 60068-2-21
	Solderability	Terminals must be 95 % covered with fresh solder.		Dip termination into solder bath at + 235 C 5 C for 5 s (Using Rosin Flux)