Space Saving MLCC Arrays FH 6124CG100J500NT for Enhanced PCB Performance and Reduced Mounting Time
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MOQ:
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Delivery Time:
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Product Description
MLCC Arrays (C-ARRAY SERIES)
The MLCC Arrays (C-ARRAY SERIES) offer a space-saving solution for PCBs requiring high component density. They provide higher capacitance per volumetric area, reducing mounting times and improving efficiency. These components are cost-effective due to fewer placement steps, shorter manufacturing times, and reduced PCB costs. They are easy to install with SMT packaging and improve the working efficiency of printed boards by reducing printed circuits and increasing operating speed. Compliant with GH/T 21041-2007 and GH/T 21042-2007 standards.
Features
- Space Saving: Can save up to 50% of PCB space and improve assembly density.
- Higher Volumetric Capacitance: One chip equals four 0603 type capacitors, reducing picking and placing times and increasing mounting efficiency.
- Cost Saving: Reduces placement times, manufacturing time, equipment management costs, and PCB costs.
- Easy Installation: SMT package allows for high-speed mounting by pick-and-place machines.
- Improved Circuit Board Efficiency: Reduces printed circuits and increases the operating speed of the circuit board.
Applications
- Suitable for PCBs with strict component space requirements, such as notebook computers, PDAs, and cordless phones.
- Particularly suitable for input and output interface circuits.
Product Attributes
- Manufacturer: Not specified
- Brand: Not specified
- Origin: Not specified
- Material: Not specified (Dielectric types: COG, COH, X7R, X5R, Z5U, Y5V)
- Color: Not specified
- Certifications: GH/T 21041-2007, GH/T 21042-2007
Technical Specifications
| Model Code | Product Size (inch) | Elements Inside | Dielectric Style | Nominal Capacitance (pF) | Capacitance Tolerance | Rated Voltage (V) | Terminal Material | Package Style | Operating Temperature Range |
| 6124 | 0.06 x 0.12 | 4 | COG | 0.5 - 1000 | 0.05pF, 0.10pF, 0.25pF, 0.5pF, 1.0%, 2.0%, 5.0%, 10%, 20%, +50%/-20%, +80%/-20% | 16, 25, 50, 100 | Silver Solderable (S), Copper Solderable (C), Nickel Barrier (N) | Bulk Bag (B), Taping Package (T) | -55125 (COG, X7R), -5585 (X5R), 1085 (Z5U), -2585 (Y5V) |
| 5084 | 0.05 x 0.08 | 4 | COG | 0.5 - 1000 | 0.05pF, 0.10pF, 0.25pF, 0.5pF, 1.0%, 2.0%, 5.0%, 10%, 20%, +50%/-20%, +80%/-20% | 16, 25, 50 | Silver Solderable (S), Copper Solderable (C), Nickel Barrier (N) | Bulk Bag (B), Taping Package (T) | -55125 (COG, X7R), -5585 (X5R), 1085 (Z5U), -2585 (Y5V) |
| 5082 | 0.05 x 0.08 | 2 | COG | 0.5 - 1000 | 0.05pF, 0.10pF, 0.25pF, 0.5pF, 1.0%, 2.0%, 5.0%, 10%, 20%, +50%/-20%, +80%/-20% | 16, 25, 50 | Silver Solderable (S), Copper Solderable (C), Nickel Barrier (N) | Bulk Bag (B), Taping Package (T) | -55125 (COG, X7R), -5585 (X5R), 1085 (Z5U), -2585 (Y5V) |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina