High current multilayer chip ferrite beads FH CBM453215U101T for noise suppression in electronic devices

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Multilayer Chip Ferrite Ultra-High Current Beads

These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, suitable for automatic SMT placement. Their unique terminal electrode structure allows for high permissible currents (up to 6.0A max). They are ideal for noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication devices, computers, and LCD TVs.

Product Attributes

Product Code: CBM
Material: Ferrite
Packaging Style: Tape & Reel (T), Bulk (B)

Technical Specifications

Part Number	Dimensions (LWT mm)	Impedance ()	Test Frequency (MHz)	DCR () Max	Rated Current (mA) Max
CBM060303X220T	0.60.30.3	22	100	0.040	1800
CBM060303X330T	0.60.30.3	33	100	0.055	1500
CBM060303X800T	0.60.30.3	80	100	0.130	1000
CBM060303X121T	0.60.30.3	120	100	0.160	900
CBM100505U000T	1.00.50.5	0	100	0.02	2000
CBM100505U050T	1.00.50.5	5	100	0.02	2000
CBM100505U101T	1.00.50.5	100	100	0.15	1000
CBM100505U102T	1.00.50.5	1000	100	0.65	300
CBM160808U000T	1.60.80.8	0	100	0.01	6000
CBM160808U050T	1.60.80.8	5	100	0.01	6000
CBM160808U101T	1.60.80.8	100	100	0.06	2500
CBM160808U102T	1.60.80.8	1000	100	0.35	700
CBM201209U000T	2.01.20.9	0	100	0.01	6000
CBM201209U050T	2.01.20.9	5	100	0.01	6000
CBM201209U101T	2.01.20.9	100	100	0.045	4000
CBM201209U102T	2.01.20.9	1000	100	0.12	1500
CBM321609U000T	3.21.60.9	0	100	0.01	6000
CBM321609U050T	3.21.60.9	5	100	0.01	6000
CBM321609U101T	3.21.60.9	100	100	0.035	4000
CBM321609U102T	3.21.60.9	1000	100	0.12	2100
CBM322513U110T	3.22.51.3	11	100	0.02	6000
CBM322513U150T	3.22.51.3	15	100	0.02	6000
CBM322513U121T	3.22.51.3	120	100	0.03	5000
CBM322513U102T	3.22.51.3	1000	100	0.23	2500
CBM451616U190T	4.51.61.6	19	100	0.009	6000
CBM451616U600T	4.51.61.6	60	100	0.009	6000
CBM453215U190T	4.53.21.5	19	100	0.01	6000
CBM453215U500T	4.53.21.5	50	100	0.01	6000
CBM453215U101T	4.53.21.5	100	100	0.02	6000
CBM453215U501T	4.53.21.5	500	100	0.08	4000

Reliability Test Methods

No.	Items	Requirements	Test Methods and Remarks
1	Operating Temperature Range	-55+125	Includes product surface temperature rise
2	Solder ability	No visible damage; 95% or more of electrode area shall be coated by new solder.	Preheating temperature:120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth:10mm, Duration: 51s, Dip performance to a flux of about:3 ~ 5 s
3	Resistance to Soldering Heat	At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%	Preheating temperature: 120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth:10mm, Duration: 101s, Dip performance to a flux of about:35 s
4	Adhesion of electrode	The termination and body should be no damage.	Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S
5	Low temperature resistance	No mechanical damage. Impedance change: within 30%.	Temperature: -552, Testing time: 10000 +24 h
6	Bending strength	No mechanical damage.	Testing board: glass epoxy-resin substrate, Bending: 2mm, Keep time: 20s1s