Magnetically Shielded Chip Common Mode Choke Coil FH CMC1206S-102T with Copper Wire and Epoxy Resin

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Product Description

Product Overview

The Chip Common Mode Choke Coils, specifically the CMC0805S and CMC1206S Series, are wire-wound chip common mode chokes designed for various electronic applications. These magnetically shielded inductors offer reliable performance with a range of impedance values. They are manufactured using Ni-Zn ferrite cores and Ni-Zn ferrite cover plates, with copper wires and silver/nickel/tin electrodes.

Product Attributes

Product Type: Chip Common Mode Choke Coils
Series: CMC0805S, CMC1206S
Core Material: Ni-Zn ferrite
Cover Plate Material: Ni-Zn ferrite
Electrode Material: Silver (Ag), Nickel (Ni), Tin (Sn)
Wire Material: Copper (Cu)
Adhesive Material: Epoxy Resin
Design: Magnetically Shielded
Packaging Options: Tape & Reel (T), Bulk (B)
RoHS Compliance: Yes

Technical Specifications

Part Name	Dimensions (L x W x T) (mm)	Impedance ()	Test Frequency (MHz)	Rdc () max	Rated Voltage (Vdc) max	Rated Current Idc (mA) max	Insulation Resistance (M) min
CMC0805S Series
CMC0805S-670T	2.00.2 x 1.20.2 x 1.20.2	67	100	0.25	50	400	10
CMC0805S-700T	2.00.2 x 1.20.2 x 1.20.2	70	100	0.30	50	400	10
CMC0805S-750T	2.00.2 x 1.20.2 x 1.20.2	75	100	0.30	50	400	10
CMC0805S-900T	2.00.2 x 1.20.2 x 1.20.2	90	100	0.35	50	330	10
CMC0805S-121T	2.00.2 x 1.20.2 x 1.20.2	120	100	0.30	50	370	10
CMC0805S-161T	2.00.2 x 1.20.2 x 1.20.2	160	100	0.35	50	330	10
CMC0805S-181T	2.00.2 x 1.20.2 x 1.20.2	180	100	0.35	50	330	10
CMC0805S-261T	2.00.2 x 1.20.2 x 1.20.2	260	100	0.40	50	300	10
CMC0805S-301T	2.00.2 x 1.20.2 x 1.20.2	300	100	0.42	50	290	10
CMC0805S-361T	2.00.2 x 1.20.2 x 1.20.2	360	100	0.45	50	280	10
CMC0805S-371T	2.00.2 x 1.20.2 x 1.20.2	370	100	0.45	50	280	10
CMC0805S-451T	2.00.2 x 1.20.2 x 1.20.2	450	100	0.50	50	250	10
CMC0805S-601T	2.00.2 x 1.20.2 x 1.20.2	600	100	0.60	50	220	10
CMC0805S-901T	2.00.2 x 1.20.2 x 1.20.2	900	100	0.90	50	150	10
CMC1206S Series
CMC1206S-900T	3.20.2 x 1.60.2 x 1.80.2	90	100	0.30	50	370	10
CMC1206S-161T	3.20.2 x 1.60.2 x 1.80.2	160	100	0.40	50	340	10
CMC1206S-261T	3.20.2 x 1.60.2 x 1.80.2	260	100	0.50	50	310	10
CMC1206S-371T	3.20.2 x 1.60.2 x 1.80.2	370	100	0.50	50	300	10
CMC1206S-601T	3.20.2 x 1.60.2 x 1.80.2	600	100	0.80	50	260	10
CMC1206S-801T	3.20.2 x 1.60.2 x 1.80.2	800	100	0.90	50	240	10
CMC1206S-102T	3.20.2 x 1.60.2 x 1.80.2	1000	100	1.00	50	230	10
CMC1206S-142T	3.20.2 x 1.60.2 x 1.80.2	1400	100	1.00	50	220	10
CMC1206S-202T	3.20.2 x 1.60.2 x 1.80.2	2000	100	1.20	50	200	10
CMC1206S-222T	3.20.2 x 1.60.2 x 1.80.2	2200	100	1.20	50	200	10
Reliability Data
Operating Temperature Range	-40~+85
Solder ability	CMC series: 80% electrode surface solder coverage.
Resistance to Soldering Heat	Impedance shall not change more than 20%.
Insulation Resistance	CMC series: 10 M
Vibration	Impedance shall not change more than 20%.
Adhesion of electrode	CMC0805 Series: 5 N; CMC1206 Series: 10 N
Low temperature resistance	Impedance shall not change more than 20%. (Stored at -402 for 1000h)
High Temperature resistance	Impedance shall not change more than 20%. (Stored at 852 for 1000h)
Temperature Characteristic	Impedance shall not change more than 20%.
Thermal Shock	Impedance shall not change more than 20%. (+85 60 min -40 60 min, 32 Cycles)
High temperature load	Impedance shall not change more than 20%. (Rated current applied, stored at 852 for 1000h)
Static Humidity	Impedance shall not change more than 20%. (Stored at 90%95%RH at 602 for 1000h)
Bending strength	No visible mechanical damage.
Solvent Resistance	Impedance shall not change more than 20%.

Packaging

Part NO.	Per Reel	Per Box	Per Case
0805	3000	9000 (3 boxes)	45000 (5 cases)
1206	2000	6000 (3 boxes)	30000 (5 cases)

Notes

Recommended soldering process: Reflow soldering.
Flux: Rosin-based flux, avoid highly acidic flux with halide content exceeding 0.2(wt)%.
Solder: Lead-free solder (96.5Sn /3.0Ag/0.5Cu).
Soldering conditions: Temperature difference between solder and ferrite surface limited to 150 max during pre-heating; cooling into solvent limited to 100 max.
Manual soldering: Iron temperature 350 (Max), 30W max, soldering time
Cleaning conditions: Temperature 60 (Max), time 5 minutes (Max), ultrasonic power 200W max.
Storage period: Use within 6 months from factory inspection date. For longer periods, check solderability.
Storage conditions: Temperature -10 to +40, relative humidity 30-70%. Avoid corrosive substances, moisture, dust, heat shock, vibration, and direct sunlight. Store in airtight packaging.
ODS (Ozone Depleting Substances) such as CCl4, HCFC are not used in the production process.