Chip Common Mode Choke Coil FH CMC1206S-142T Featuring Copper Wire and Epoxy Resin Adhesive Material
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Product Description
Product Overview
The Chip Common Mode Choke Coils, specifically the CMC0805S and CMC1206S Series, are wire-wound chip common mode chokes designed for magnetically shielded applications. These components are constructed with Ni-Zn ferrite cores and cover plates, utilizing silver, nickel, and tin electrodes, and copper wire. They are suitable for various applications requiring effective common mode noise suppression, with a wide operating temperature range of -40 to +85. The products are RoHS compliant and designed for reflow soldering processes.
Product Attributes
- Product Type: Chip Common Mode Choke Coils
- Series: CMC0805S, CMC1206S
- Core Material: Ni-Zn ferrite
- Cover Plate Material: Ni-Zn ferrite
- Electrode Material: Silver (Ag), Nickel (Ni), Tin (Sn)
- Wire Material: Copper (Cu)
- Adhesive Material: Epoxy Resin
- Certifications: RoHS compliant
- Packaging: Tape & Reel (T), Bulk (B)
Technical Specifications
| Part Number | Dimensions (L x W x T) (mm) | Nominal Impedance () | Tolerance (%) | Test Frequency (MHz) | Max. DC Resistance () | Rated Voltage (Vdc) | Rated Current (mA) | Min. Insulation Resistance (M) |
|---|---|---|---|---|---|---|---|---|
| CMC0805S-670T | 2.00.2 x 1.20.2 x 1.20.2 | 67 | 25 | 100 | 0.25 | 50 | 400 | 10 |
| CMC0805S-700T | 2.00.2 x 1.20.2 x 1.20.2 | 70 | 25 | 100 | 0.30 | 50 | 400 | 10 |
| CMC0805S-750T | 2.00.2 x 1.20.2 x 1.20.2 | 75 | 25 | 100 | 0.30 | 50 | 400 | 10 |
| CMC0805S-900T | 2.00.2 x 1.20.2 x 1.20.2 | 90 | 25 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-121T | 2.00.2 x 1.20.2 x 1.20.2 | 120 | 25 | 100 | 0.30 | 50 | 370 | 10 |
| CMC0805S-161T | 2.00.2 x 1.20.2 x 1.20.2 | 160 | 25 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-181T | 2.00.2 x 1.20.2 x 1.20.2 | 180 | 25 | 100 | 0.35 | 50 | 330 | 10 |
| CMC0805S-261T | 2.00.2 x 1.20.2 x 1.20.2 | 260 | 25 | 100 | 0.40 | 50 | 300 | 10 |
| CMC0805S-301T | 2.00.2 x 1.20.2 x 1.20.2 | 300 | 25 | 100 | 0.42 | 50 | 290 | 10 |
| CMC0805S-361T | 2.00.2 x 1.20.2 x 1.20.2 | 360 | 25 | 100 | 0.45 | 50 | 280 | 10 |
| CMC0805S-371T | 2.00.2 x 1.20.2 x 1.20.2 | 370 | 25 | 100 | 0.45 | 50 | 280 | 10 |
| CMC0805S-451T | 2.00.2 x 1.20.2 x 1.20.2 | 450 | 25 | 100 | 0.50 | 50 | 250 | 10 |
| CMC0805S-601T | 2.00.2 x 1.20.2 x 1.20.2 | 600 | 25 | 100 | 0.60 | 50 | 220 | 10 |
| CMC0805S-901T | 2.00.2 x 1.20.2 x 1.20.2 | 900 | 25 | 100 | 0.90 | 50 | 150 | 10 |
| CMC1206S-900T | 3.20.2 x 1.60.2 x 1.80.2 | 90 | 25 | 100 | 0.30 | 50 | 370 | 10 |
| CMC1206S-161T | 3.20.2 x 1.60.2 x 1.80.2 | 160 | 25 | 100 | 0.40 | 50 | 340 | 10 |
| CMC1206S-261T | 3.20.2 x 1.60.2 x 1.80.2 | 260 | 25 | 100 | 0.50 | 50 | 310 | 10 |
| CMC1206S-371T | 3.20.2 x 1.60.2 x 1.80.2 | 370 | 25 | 100 | 0.50 | 50 | 300 | 10 |
| CMC1206S-601T | 3.20.2 x 1.60.2 x 1.80.2 | 600 | 25 | 100 | 0.80 | 50 | 260 | 10 |
| CMC1206S-801T | 3.20.2 x 1.60.2 x 1.80.2 | 800 | 25 | 100 | 0.90 | 50 | 240 | 10 |
| CMC1206S-102T | 3.20.2 x 1.60.2 x 1.80.2 | 1000 | 25 | 100 | 1.00 | 50 | 230 | 10 |
| CMC1206S-142T | 3.20.2 x 1.60.2 x 1.80.2 | 1400 | 25 | 100 | 1.00 | 50 | 220 | 10 |
| CMC1206S-202T | 3.20.2 x 1.60.2 x 1.80.2 | 2000 | 25 | 100 | 1.20 | 50 | 200 | 10 |
| CMC1206S-222T | 3.20.2 x 1.60.2 x 1.80.2 | 2200 | 25 | 100 | 1.20 | 50 | 200 | 10 |
| Reliability Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Operating Temperature Range | -40~+85 | |
| Solder ability | Electrode surface solder coverage: 80% | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2455 for 51s. |
| Resistance to Soldering Heat | Impedance shall not change more than 20% | Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at 2605 for 101s. |
| Insulation Resistance | 10 M | The rated voltage is applied between the two windings for a minute. |
| Vibration | Impedance shall not change more than 20% | Amplitude 1.5mm, frequency 10~55Hz, for 2h in each of three (X, Y, Z) axes. |
| Adhesion of electrode | The end electrode did not fall off after the test. | Apply force as shown in diagram. CMC0805 Series: 5 N, CMC1206 Series: 10 N. Keep time: (101)s, Speed: 1.0 mm/s. |
| Low temperature resistance | Impedance shall not change more than 20% | Subjected to -402 for 1000 24 0 + h. |
| High Temperature resistance | Impedance shall not change more than 20% | Subjected to 852 for 1000 24 0 + h. |
| Temperature Characteristic | Impedance shall not change more than 20% | Hold at 202, -402, 202, 852 for 4 hours each. Calculate variation rate based on 202. |
| Thermal Shock | Impedance shall not change more than 20% | +85 60 min -40 60 min, 32 Cycles. Transition time: 23 min. |
| High temperature load | Impedance shall not change more than 20% | Apply rated current. Subjected to 852 for 1000 24 0 + h. |
| Static Humidity | Impedance shall not change more than 20% | Subjected to 90%95% RH at 602 for 1000 24 0 + h. |
| Bending strength | No visible mechanical damage. | Install on test substrate, apply force vertically. Bend down 2 mm at a rate of (10.5) mm/s, hold for 5 s. |
| Solvent Resistance | Impedance shall not change more than 20% | Soak in isopropyl alcohol solution at 235 for 50.5 min. |
| Packaging Quantity (Pcs) | 0805 Size | 1206 Size |
|---|---|---|
| Per Reel | 3000 | 2000 |
| Per Box (3 Reels) | 9000 | 6000 |
| Per Box (5 Reels) | 15000 | 10000 |
| Per Box (10 Reels) | 30000 | 20000 |
| Per Case (1.5 Boxes) | 45000 | 30000 |
| Per Case (3 Boxes) | 90000 | 60000 |
| Per Case (4 Boxes) | 120000 | 80000 |
| Per Case (5 Boxes) | 180000 | 120000 |
| Soldering Conditions | Details |
|---|---|
| Recommended Process | Reflow soldering |
| Flux | Rosin-based flux. Avoid highly acidic flux with halide content exceeding 0.2(wt)%. |
| Solder | Lead-free solder (96.5Sn /3.0Ag/0.5Cu). |
| Temperature Difference (Pre-heating) | Max 150 between solder and ferrite surface. |
| Temperature Difference (Cooling) | Max 100 between ferrite surface and solvent. |
| Iron Soldering (Manual) | Tip Temperature: 350 (Max), Power: 30W (Max), Time: < 5S. Avoid contact with coils and encapsulation layer. |
| Cleaning Conditions | Details |
|---|---|
| Cleaning Temperature | 60 (Max) |
| Cleaning Time | 5 minutes (Max) |
| Ultrasonic Power | 200W (Max) |
| Storage Requirements | Details |
|---|---|
| Storage Period | Use within 6 months from factory inspection date. If exceeded, check solderability before use. |
| Storage Conditions | Temperature: -10 ~ +40, Relative Humidity: 30 ~ 70%. Store away from corrosive substances. Keep on a pallet, avoid heat shock, vibration, and direct sunlight. Store in airtight packaging. |
| ODS Usage | Status |
|---|---|
| ODS (CCl4, HCFC, etc.) | Not used in production process. |
| Notes | Details |
|---|---|
| RoHS Directive | Products are RoHS compliant. |
| Product Evaluation | Ensure your product is evaluated and confirmed against your specifications when our product is mounted. |
| Deviations from Specification | No warranty against failure caused by use deviating from this specification. |
| Handling | Do not touch wire with sharp objects such as tweezers to prevent wire breakage. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina