Noise Suppression Ferrite Bead FH CBG321609U302T with Silver Inner Electrodes and Nickel Tin Plating
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The CBG321609U Series Chip Ferrite Beads are designed for noise suppression. These components are manufactured using a nickel-copper-zinc ferrite system with pure silver inner electrodes and silver/Ni-Sn plating terminal electrodes. They are available in various impedance values and are suitable for reflow soldering.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Nickel/Tin (Ni/Sn) plating
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Part NO. | Impedance () | Tolerance | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | Rated Current (mA)max |
| CBG321609U000T | 0 | 015 | 0.05 | 100 | 50 | 2200 |
| CBG321609U050T | 5 | 015 | 0.05 | 100 | 50 | 2200 |
| CBG321609U070T | 7 | 011 | 0.05 | 100 | 50 | 2200 |
| CBG321609U090T | 9 | 513 | 0.05 | 100 | 50 | 2000 |
| CBG321609U110T | 11 | 715 | 0.05 | 100 | 50 | 2000 |
| CBG321609U150T | 15 | 921 | 0.05 | 100 | 50 | 2000 |
| CBG321609U190T | 19 | 1225 | 0.05 | 100 | 50 | 2000 |
| CBG321609U260T | 26 | 25% | 0.05 | 100 | 50 | 2000 |
| CBG321609U310T | 31 | 25% | 0.05 | 100 | 50 | 2000 |
| CBG321609U600T | 60 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U700T | 70 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U800T | 80 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U101T | 100 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U121T | 120 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U151T | 150 | 25% | 0.15 | 100 | 50 | 1000 |
| CBG321609U181T | 180 | 25% | 0.15 | 100 | 50 | 1000 |
| CBG321609U221T | 220 | 25% | 0.20 | 100 | 50 | 800 |
| CBG321609U301T | 300 | 25% | 0.20 | 100 | 50 | 800 |
| CBG321609U501T | 500 | 25% | 0.30 | 100 | 50 | 600 |
| CBG321609U601T | 600 | 25% | 0.30 | 100 | 50 | 600 |
| CBG321609U801T | 800 | 25% | 0.35 | 100 | 50 | 600 |
| CBG321609U102T | 1000 | 25% | 0.35 | 100 | 50 | 600 |
| CBG321609U122T | 1200 | 25% | 0.60 | 100 | 50 | 300 |
| CBG321609U152T | 1500 | 25% | 0.60 | 50 | 50 | 300 |
| CBG321609U182T | 1800 | 25% | 0.80 | 50 | 50 | 100 |
| CBG321609U202T | 2000 | 25% | 1.00 | 50 | 50 | 100 |
| CBG321609U252T | 2500 | 25% | 1.20 | 50 | 50 | 50 |
| CBG321609U302T | 3000 | 25% | 1.50 | 50 | 50 | 50 |
Dimensions
Size: 321609 (1206)
L: 3.20.20 mm (0.1260.008 inch)
W: 1.60.20 mm (0.0630.008 inch)
T: 0.90.20 mm (0.0350.008 inch)
Internal structure plating thickness: 0.50.3 mm (0.0200.012 inch)
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
| Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s |
| Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N for 3216 series. Keep time: 101S |
| Low temperature | No mechanical damage. Impedance change: within 30% | Temperature: -552; Testing time: 1000+24-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm; Test time: 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature | No mechanical damage. Impedance change: within 30% | Testing time: 1000+24-0 h; Temperature: 1252 |
| Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000+24-0 h |
| High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: rated current; Testing time: 1000+24-0 h; Temperature: 852 |
| Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
Packaging
Packaging quantity (Unit: Pcs):
321609 Size: 4000 per REEL, 40000 per BOX, 240000 per CASE.
Recommended Soldering Conditions
Products are suitable for reflow soldering.
Soldering Conditions:
- Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to 150 max. Cooling into solvent after soldering should be limited to 100 max.
- Products should be soldered within the allowable range indicated by the reflow soldering profile curve.
Iron soldering:
- Soldering temperature: 350 (Max)
- Power: 30W (Max)
- Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes).
Cleaning
Cleaning Conditions:
- Cleaning temperature: 60 max
- Cleaning time: 1 minute min.
- Ultrasonic output power: 200W max
Storage Requirements
Storage period:
Products can be used within 1 year from the factory inspection date. The inspection date can be confirmed by the inspection number marked on the outside of the packaging.
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina