Electronic components FH CBG321609U121T chip ferrite beads with wide impedance and current ratings
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Approval Sheet
Customer: [Customer Name]
Part Name: Chip Ferrite Beads
Specification: CBG321609U Series
Version No.: 23.01
Date: 2023-9-8
Product Overview
The CBG321609U Series are multilayer chip ferrite beads designed for EMI suppression. They offer a wide range of impedance values and current ratings, suitable for various electronic applications. The product features a ceramic body with inner and terminal electrodes, plated with Ni/Sn for good solderability.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Ferrite (Ni-Cu-Zn system), Silver (Ag), Ni/Sn plating
- Color: Not specified
- Certifications: Not specified
Technical Specifications
| Part NO. | Size (LWT mm) | Tolerance | Impedance () | RDC ()max | Rated Current (mA)max |
|---|---|---|---|---|---|
| CBG321609U000T | 3.21.60.9 | 015 | 0 | 0.05 | 2200 |
| CBG321609U050T | 3.21.60.9 | 015 | 5 | 0.05 | 2200 |
| CBG321609U070T | 3.21.60.9 | 011 | 7 | 0.05 | 2200 |
| CBG321609U090T | 3.21.60.9 | 513 | 9 | 0.05 | 2000 |
| CBG321609U110T | 3.21.60.9 | 715 | 11 | 0.05 | 2000 |
| CBG321609U150T | 3.21.60.9 | 921 | 15 | 0.05 | 2000 |
| CBG321609U190T | 3.21.60.9 | 1225 | 19 | 0.05 | 2000 |
| CBG321609U260T | 3.21.60.9 | 25% | 26 | 0.05 | 2000 |
| CBG321609U310T | 3.21.60.9 | 25% | 31 | 0.05 | 2000 |
| CBG321609U600T | 3.21.60.9 | 25% | 60 | 0.10 | 1000 |
| CBG321609U700T | 3.21.60.9 | 25% | 70 | 0.10 | 1000 |
| CBG321609U800T | 3.21.60.9 | 25% | 80 | 0.10 | 1000 |
| CBG321609U101T | 3.21.60.9 | 25% | 100 | 0.10 | 1000 |
| CBG321609U121T | 3.21.60.9 | 25% | 120 | 0.10 | 1000 |
| CBG321609U151T | 3.21.60.9 | 25% | 150 | 0.15 | 1000 |
| CBG321609U181T | 3.21.60.9 | 25% | 180 | 0.15 | 1000 |
| CBG321609U221T | 3.21.60.9 | 25% | 220 | 0.20 | 800 |
| CBG321609U301T | 3.21.60.9 | 25% | 300 | 0.20 | 800 |
| CBG321609U501T | 3.21.60.9 | 25% | 500 | 0.30 | 600 |
| CBG321609U601T | 3.21.60.9 | 25% | 600 | 0.30 | 600 |
| CBG321609U801T | 3.21.60.9 | 25% | 800 | 0.35 | 600 |
| CBG321609U102T | 3.21.60.9 | 25% | 1000 | 0.35 | 600 |
| CBG321609U122T | 3.21.60.9 | 25% | 1200 | 0.60 | 300 |
| CBG321609U152T | 3.21.60.9 | 25% | 1500 | 0.60 | 300 |
| CBG321609U182T | 3.21.60.9 | 25% | 1800 | 0.80 | 100 |
| CBG321609U202T | 3.21.60.9 | 25% | 2000 | 1.00 | 100 |
| CBG321609U252T | 3.21.60.9 | 25% | 2500 | 1.20 | 50 |
| CBG321609U302T | 3.21.60.9 | 25% | 3000 | 1.50 | 50 |
Reliability Testing Items
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration : 51s |
| 3 | Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration : 101s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N force for 3216 series. Keep time 101S |
| 5 | Low temperature | No mechanical damage. Impedance change: within 30% | Temperature:-552; Testing time:1000 +240/-0 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| 7 | Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| 8 | High temperature | No mechanical damage. Impedance change: within 30% | Testing time: 1000 +240/-0 h; Temperature: 1252 |
| 9 | Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +240/-0 h |
| 10 | High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: rated current; Testing time: 1000 +240/-0 h; Temperature: 852 |
| 11 | Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
Packaging
Packaging quantity (Unit: Pcs):
| Size | Quantity per REEL | Quantity per BOX | Quantity per CASE |
|---|---|---|---|
| 321609 | 4000 | 40000 | 240000 |
Recommended Soldering Conditions
Soldering Conditions: Products can be applied to reflow soldering.
Reflow soldering profile: [Profile details not provided in text]
Iron soldering:
- Soldering temperature: 350 (Max)
- Power: 30W (Max)
- Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes)
Cleaning
Cleaning Conditions:
- Cleaning temperature: 60 (max)
- Cleaning time: 1 minute (min.)
- Ultrasonic output power: 200W (max)
Storage Requirements
Storage period: Products can be used within 1 year from the factory inspection date. The inspection date can be confirmed by the inspection number marked on the outside of the package.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina