Noise suppression chip ferrite bead FH CBG321609U152T featuring Ni Cu Zn ferrite body and pure silver inner electrodes
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The CBG321609U Series is a range of chip ferrite beads designed for noise suppression. These components are manufactured using a Ni-Cu-Zn ferrite system and pure silver inner electrodes, with Ni/Sn plating on the terminal electrodes. They are suitable for reflow soldering and offer various impedance and current ratings.
Product Attributes
- Brand: (Not specified in text)
- Origin: (Not specified in text)
- Material: Ni-Cu-Zn Ferrite (Body), Pure Silver (Inner Electrode), Silver/Ni-Sn Plating (Terminal Electrode)
- Color: (Not specified in text)
- Certifications: (Not specified in text)
Technical Specifications
| Part NO. | Impedance () | Tolerance | RDC ()max | Test Frequency (MHz) | Test Voltage (mV) | Rated Current (mA)max |
| CBG321609U000T | 0 | 015 | 0.05 | 100 | 50 | 2200 |
| CBG321609U050T | 5 | 015 | 0.05 | 100 | 50 | 2200 |
| CBG321609U070T | 7 | 011 | 0.05 | 100 | 50 | 2200 |
| CBG321609U090T | 9 | 513 | 0.05 | 100 | 50 | 2000 |
| CBG321609U110T | 11 | 715 | 0.05 | 100 | 50 | 2000 |
| CBG321609U150T | 15 | 921 | 0.05 | 100 | 50 | 2000 |
| CBG321609U190T | 19 | 1225 | 0.05 | 100 | 50 | 2000 |
| CBG321609U260T | 26 | 25% | 0.05 | 100 | 50 | 2000 |
| CBG321609U310T | 31 | 25% | 0.05 | 100 | 50 | 2000 |
| CBG321609U600T | 60 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U700T | 70 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U800T | 80 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U101T | 100 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U121T | 120 | 25% | 0.10 | 100 | 50 | 1000 |
| CBG321609U151T | 150 | 25% | 0.15 | 100 | 50 | 1000 |
| CBG321609U181T | 180 | 25% | 0.15 | 100 | 50 | 1000 |
| CBG321609U221T | 220 | 25% | 0.20 | 100 | 50 | 800 |
| CBG321609U301T | 300 | 25% | 0.20 | 100 | 50 | 800 |
| CBG321609U501T | 500 | 25% | 0.30 | 100 | 50 | 600 |
| CBG321609U601T | 600 | 25% | 0.30 | 100 | 50 | 600 |
| CBG321609U801T | 800 | 25% | 0.35 | 100 | 50 | 600 |
| CBG321609U102T | 1000 | 25% | 0.35 | 100 | 50 | 600 |
| CBG321609U122T | 1200 | 25% | 0.60 | 100 | 50 | 300 |
| CBG321609U152T | 1500 | 25% | 0.60 | 50 | 50 | 300 |
| CBG321609U182T | 1800 | 25% | 0.80 | 50 | 50 | 100 |
| CBG321609U202T | 2000 | 25% | 1.00 | 50 | 50 | 100 |
| CBG321609U252T | 2500 | 25% | 1.20 | 50 | 50 | 50 |
| CBG321609U302T | 3000 | 25% | 1.50 | 50 | 50 | 50 |
| Item | Requirements | Test Methods and Remarks |
| Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| Solder ability | At least 95% of terminal electrode should be covered with solder | Preheating temperature:120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth:10mm; Duration: 51s; Dip performance to a flux of about:3 ~ 5 s |
| Resistance to Soldering | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth:10mm; Duration: 101s; Dip performance to a flux of about:3 ~ 5 s |
| Adhesion of electrode | The termination and body should be no damage. | Applied force: 10N force for 3216 series. Keep time: 101S |
| Low temperature | No mechanical damage. Impedance change: within 30% | Temperature:-552; Testing time:1000 +240/-0 h |
| Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate; For 0.5 mm/s compression speed, curvature: 2mm, hold time 20s1s |
| Vibration | No mechanical damage. Impedance change: within 30% | Amplitude modulation: 1.5mm; Test time: A period of 2h in each of 3 mutually perpendicular directions. Frequency range: 10Hz to 55Hz to 10Hz for 1min. |
| High temperature | No mechanical damage. Impedance change: within 30% | Testing time: 1000 +240/-0 h; Temperature: 1252 |
| Static Humidity | No mechanical damage. Impedance change: within 30% | Humidity: 90% to 95% RH; Temperature: 602; Testing time: 1000 +240/-0 h |
| High temperature load | No mechanical damage. Impedance change: within 30% | Impose current: rated current; Testing time: 1000 +240/-0 h; Temperature: 852 |
| Temperature Shock | No mechanical damage. Impedance change: within 30% | Temperature: -55 for 303min +125 for 303min; Number of cycles: 100 |
| Size | A | B | C | N | G |
| 321609 | 1782.0 | 22.02.0 | 12.51.5 | 572.0 | 8 |
| Size | Paper tape |
| 321609 | (Dimensions not fully specified, only 'Paper tape' mentioned) |
| Size | REEL | BOX | CASE |
| 321609 | 4000 | 40000 | 240000 |
| Soldering Conditions | Details |
| Reflow soldering profile | Products should be soldered within the allowable range indicated by the slanted line. Un-enough pre-heating may cause cracks on the ferrite. Temperature difference between solder and ferrite surface limited to 150 max during pre-heating. Temperature difference between product surface and solvent after soldering limited to 100 max. |
| Iron soldering | Soldering Iron Temperature: 350 (Max); Power: 30W (Max); Soldering Time: < 5S (Take care not to apply the tip of the soldering iron to the terminal electrodes). |
| Cleaning Conditions | Details |
| Cleaning Temperature | 60 (max) |
| Cleaning Time | 1 minute (min) |
| Ultrasonic output power | 200W (max) |
| Storage Requirements | Details |
| Storage period | Within 1 year from the factory inspection date. Inspection number can be confirmed by markings on the outer packaging. |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina