Multilayer chip ferrite beads FH CBM201209U600T suitable for SMT mounting in communication equipment
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Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, suitable for automatic SMT mounting. They are designed for noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication devices, computers, and LCD TVs.
Features
- Higher impedance than plug-in beads in the same size.
- Effective EMI and RFI suppression with simple PCB mounting.
- Shapes and sizes conform to EIA standards for SMT equipment compatibility.
Applications
- Noise suppression in power lines or extra-large current signal lines of electrical equipment like communication devices, computers, and LCD TVs.
Product Structure
- Ag layer
- Ni/Sn plating
- Inner electrode
- Body
Technical Specifications
| Part No | Dimensions (LWT) mm | Impedance () | Packaging Style | DCR ()Max | Rated Current Ir (mA)Max |
| CBM060303 | 0.60.30.3 | 22, 33, 80, 120 | T, X, B | 0.040 - 0.160 | 1800 - 900 |
| CBM100505 | 1.00.50.5 | 0 - 1000 | T, X, B | 0.02 - 0.65 | 2000 - 300 |
| CBM160808 | 1.60.80.8 | 0 - 1000 | T, X, B | 0.01 - 0.35 | 6000 - 700 |
| CBM201209 | 2.01.20.9 | 0 - 1000 | T, X, B | 0.01 - 0.12 | 6000 - 1500 |
| CBM321609 | 3.21.60.9 | 0 - 1000 | T, X, B | 0.01 - 0.12 | 6000 - 2100 |
| CBM322513 | 3.22.51.3 | 11 - 1000 | T, X, B | 0.02 - 0.23 | 6000 - 2500 |
| CBM451616 | 4.51.61.6 | 19 - 800 | T, X, B | 0.009 - 0.025 | 6000 - 3000 |
| CBM453215 | 4.53.21.5 | 19 - 600 | T, X, B | 0.01 - 0.08 | 6000 - 4000 |
Reliability Test Method
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature:120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2455, Immersion tin depth:10mm, Duration: 51s, Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature:120~150, Preheating time: 60s, Solder: 96.5%Sn/3.0%Ag/0.5%Cu, Solder temperature: 2605, Immersion tin depth:10mm, Duration: 101s, Dip performance to a flux of about:35 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time:101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature:-552, Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage. | Testing board: glass epoxy-resin substrate, Forcing speed: 0.5mm/s, Deflection: 2mm, Keep time:20s1s |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina