Multilayer chip ferrite beads FH CBM321609U391T with high permissible current and tape reel packaging
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Negotiable
MOQ:
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Delivery Time:
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Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range. Their unique terminal electrode structure allows for a high permissible current of up to 6.0A. Designed to comply with EIA standards, they are suitable for automatic SMT equipment mounting and reflow/wave soldering. Ideal for noise suppression in power lines or ultra-high current signal lines of electrical equipment such as communication devices, computers, and LCD TVs.
- Product Code: CBM
- Material: Ferrite
- Packaging Styles: Tape & Reel (T), Bulk (B)
| Part Number | Dimensions (LWT mm) | Impedance () | Packaging |
|---|---|---|---|
| CBM 201209 U 121 T | 2.01.20.9 | 120 | Tape & Reel |
| CBM 060303 X 220 T | 0.60.30.3 | 22 | Tape & Reel |
| CBM 100505 U 050 T | 1.00.50.5 | 5 | Tape & Reel |
| CBM 160808 U 150 T | 1.60.80.8 | 15 | Tape & Reel |
| CBM 321609 U 101 T | 3.21.60.9 | 100 | Tape & Reel |
| CBM 322513 U 110 T | 3.22.51.3 | 11 | Tape & Reel |
| CBM 451616 U 190 T | 4.51.61.6 | 19 | Tape & Reel |
| CBM 453215 U 190 T | 4.53.21.5 | 19 | Tape & Reel |
| Part NO | Tolerance | Impedance () | Test Frequency (MHz) | DCR ()Max | Rated Current Ir (mA)Max |
|---|---|---|---|---|---|
| CBM060303X220T | 25% | 22 | 100 | 0.040 | 1800 |
| CBM100505U000T | 015 | 0 | 100 | 0.02 | 2000 |
| CBM100505U101T | 25% | 100 | 100 | 0.15 | 1000 |
| CBM160808U000T | 015 | 0 | 100 | 0.01 | 6000 |
| CBM160808U101T | 25% | 100 | 100 | 0.06 | 2500 |
| CBM201209U000T | 015 | 0 | 100 | 0.01 | 6000 |
| CBM201209U101T | 25% | 100 | 100 | 0.045 | 4000 |
| CBM321609U000T | 015 | 0 | 100 | 0.01 | 6000 |
| CBM321609U101T | 25% | 100 | 100 | 0.035 | 4000 |
| CBM322513U110T | 715 | 11 | 100 | 0.02 | 6000 |
| CBM322513U121T | 25% | 120 | 100 | 0.03 | 5000 |
| CBM451616U190T | 1225 | 19 | 100 | 0.009 | 6000 |
| CBM453215U190T | 1225 | 19 | 100 | 0.01 | 6000 |
| CBM453215U101T | 25% | 100 | 100 | 0.02 | 6000 |
| No. | Items | Requirements | Test Methods and Remarks |
|---|---|---|---|
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature:120~150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu), Solder temperature: 2455, Immersion tin depth:10mm, Duration: 51s, Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%. | Preheating temperature: 120~150, Preheating time: 60s, Solder: (96.5%Sn/3.0%Ag/0.5%Cu), Solder temperature: 2605, Immersion tin depth:10mm, Duration: 101s, Dip performance to a flux of about:35 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature: -552, Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate, Forcing speed: 0.5mm/s, Deflection: 2mm, Duration: 20s1s |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina