Multilayer chip ferrite beads FH CBM321609U190T for EMI suppression in power lines and signal circuits
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, suitable for various electronic devices. Their compact size and SMT compatibility allow for easy integration into PCB designs. They are designed for noise suppression in power lines and ultra-high current signal lines of communication equipment, computers, and LCD TVs.
Features
- Higher impedance compared to plug-in beads in the same size.
- Effective EMI and RFI suppression without leads, requiring simple PCB mounting.
- Shape and size conform to EIA standards for automatic SMT placement.
- Unique terminal electrode structure ensures a permissible current of up to 6.0A (max).
Applications
- Noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication equipment, computers, and LCD TVs.
Product Structure
- Ag layer
- Ni/Sn plating
- Inner electrode
- Body
Technical Specifications
| Part Number | Dimensions (LWT) mm | Material Code | Impedance () | Packaging Style | D (mm) | DCR ()Max | Rated Current Ir (mA)Max |
| CBM060303X220T | 0.60.30.3 | U | 22 | T | 0.150.05 | 0.040 | 1800 |
| CBM060303X330T | 0.60.30.3 | U | 33 | T | 0.150.05 | 0.055 | 1500 |
| CBM060303X800T | 0.60.30.3 | U | 80 | T | 0.150.05 | 0.130 | 1000 |
| CBM060303X121T | 0.60.30.3 | U | 120 | T | 0.150.05 | 0.160 | 900 |
| CBM100505U000T | 1.00.50.5 | U | 0 | T | 0.250.1 | 0.02 | 2000 |
| CBM100505U050T | 1.00.50.5 | U | 5 | T | 0.250.1 | 0.02 | 2000 |
| CBM100505U101T | 1.00.50.5 | U | 100 | T | 0.250.1 | 0.15 | 1000 |
| CBM100505U102T | 1.00.50.5 | U | 1000 | T | 0.250.1 | 0.65 | 300 |
| CBM160808U000T | 1.60.80.8 | U | 0 | T | 0.30.2 | 0.01 | 6000 |
| CBM160808U050T | 1.60.80.8 | U | 5 | T | 0.30.2 | 0.01 | 6000 |
| CBM160808U101T | 1.60.80.8 | U | 100 | T | 0.30.2 | 0.06 | 2500 |
| CBM160808U102T | 1.60.80.8 | U | 1000 | T | 0.30.2 | 0.35 | 700 |
| CBM201209U000T | 2.01.20.9 | U | 0 | T | 0.50.3 | 0.01 | 6000 |
| CBM201209U050T | 2.01.20.9 | U | 5 | T | 0.50.3 | 0.01 | 6000 |
| CBM201209U101T | 2.01.20.9 | U | 100 | T | 0.50.3 | 0.045 | 4000 |
| CBM201209U102T | 2.01.20.9 | U | 1000 | T | 0.50.3 | 0.12 | 1500 |
| CBM321609U000T | 3.21.60.9 | U | 0 | T | 0.50.3 | 0.01 | 6000 |
| CBM321609U050T | 3.21.60.9 | U | 5 | T | 0.50.3 | 0.01 | 6000 |
| CBM321609U101T | 3.21.60.9 | U | 100 | T | 0.50.3 | 0.035 | 4000 |
| CBM321609U102T | 3.21.60.9 | U | 1000 | T | 0.50.3 | 0.12 | 2100 |
| CBM322513U110T | 3.22.51.3 | U | 11 | T | 0.50.3 | 0.02 | 6000 |
| CBM322513U150T | 3.22.51.3 | U | 15 | T | 0.50.3 | 0.02 | 6000 |
| CBM322513U102T | 3.22.51.3 | U | 1000 | T | 0.50.3 | 0.23 | 2500 |
| CBM451616U190T | 4.51.61.6 | U | 19 | T | 0.50.3 | 0.009 | 6000 |
| CBM451616U600T | 4.51.61.6 | U | 60 | T | 0.50.3 | 0.009 | 6000 |
| CBM453215U190T | 4.53.21.5 | U | 19 | T | 0.50.3 | 0.01 | 6000 |
| CBM453215U600T | 4.53.21.5 | U | 60 | T | 0.50.3 | 0.01 | 6000 |
| CBM453215U101T | 4.53.21.5 | U | 100 | T | 0.50.3 | 0.02 | 6000 |
Reliability Test Method
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature:120~ 150 Preheating time: 60s Solder: (96.5%Sn/3.0%Ag/0.5%Cu) Solder temperature: 2455 Immersion tin depth:10mm Duration : 51s Dip performance to a flux of about:3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30% | Preheating temperature: 120~150 Preheating time: 60s Solder: (96.5%Sn/3.0%Ag/0.5%Cu) Solder temperature: 2605 Immersion tin depth:10mm Duration : 101s Dip performance to a flux of about:35 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N force for 1005 series7N force for 1608 series10N force for 20123216 series. 15N force for 32254532 series. Keep time 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature:-552 Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate For 0 |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina