Multilayer chip ferrite beads FH CBM201209U800T designed for high impedance and easy PCB installation
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Multilayer Chip Ferrite Ultra-High Current Beads
These multilayer chip ferrite beads offer high impedance and effective EMI/RFI suppression over a wide frequency range, suitable for automatic mounting with SMT equipment. Their unique terminal electrode structure allows for high permissible currents.
Features
- Higher impedance compared to plug-in beads in the same size.
- No leads, allowing simple installation on PCBs for EMI and RFI suppression.
- Shape and size comply with EIA standards for SMT automatic mounting.
Applications
Noise suppression in power lines or extra-large current signal lines of electrical equipment such as communication equipment, computers, and LCD TVs.
Part Number System
CBM (Product Code) - 201209 (Dimensions) - U (Material Code) - 121 (Impedance) - T (Packaging Style)
Product Structure
- Ag layer
- Ni/Sn plating
- Inner electrode
- Body
Technical Specifications
| Part No | Dimensions (LWT mm) | Impedance () | Test Frequency (MHz) | DCR () Max | Rated Current (mA) Max |
| CBM060303X220T | 0.60.30.3 | 22 | 100 | 0.040 | 1800 |
| CBM060303X330T | 0.60.30.3 | 33 | 100 | 0.055 | 1500 |
| CBM060303X800T | 0.60.30.3 | 80 | 100 | 0.130 | 1000 |
| CBM060303X121T | 0.60.30.3 | 120 | 100 | 0.160 | 900 |
| CBM100505U000T | 1.00.50.5 | 0 | 100 | 0.02 | 2000 |
| CBM100505U050T | 1.00.50.5 | 5 | 100 | 0.02 | 2000 |
| CBM100505U101T | 1.00.50.5 | 100 | 100 | 0.15 | 1000 |
| CBM100505U102T | 1.00.50.5 | 1000 | 100 | 0.65 | 300 |
| CBM160808U000T | 1.60.80.8 | 0 | 100 | 0.01 | 6000 |
| CBM160808U050T | 1.60.80.8 | 5 | 100 | 0.01 | 6000 |
| CBM160808U101T | 1.60.80.8 | 100 | 100 | 0.06 | 2500 |
| CBM160808U102T | 1.60.80.8 | 1000 | 100 | 0.35 | 700 |
| CBM201209U000T | 2.01.20.9 | 0 | 100 | 0.01 | 6000 |
| CBM201209U050T | 2.01.20.9 | 5 | 100 | 0.01 | 6000 |
| CBM201209U101T | 2.01.20.9 | 100 | 100 | 0.045 | 4000 |
| CBM201209U102T | 2.01.20.9 | 1000 | 100 | 0.12 | 1500 |
| CBM321609U000T | 3.21.60.9 | 0 | 100 | 0.01 | 6000 |
| CBM321609U050T | 3.21.60.9 | 5 | 100 | 0.01 | 6000 |
| CBM321609U101T | 3.21.60.9 | 100 | 100 | 0.035 | 4000 |
| CBM321609U102T | 3.21.60.9 | 1000 | 100 | 0.12 | 2100 |
| CBM322513U110T | 3.22.51.3 | 11 | 100 | 0.02 | 6000 |
| CBM322513U150T | 3.22.51.3 | 15 | 100 | 0.02 | 6000 |
| CBM322513U121T | 3.22.51.3 | 120 | 100 | 0.03 | 5000 |
| CBM322513U102T | 3.22.51.3 | 1000 | 100 | 0.23 | 2500 |
| CBM451616U190T | 4.51.61.6 | 19 | 100 | 0.009 | 6000 |
| CBM451616U600T | 4.51.61.6 | 60 | 100 | 0.009 | 6000 |
| CBM451616U800T | 4.51.61.6 | 80 | 100 | 0.025 | 3000 |
| CBM453215U190T | 4.53.21.5 | 19 | 100 | 0.01 | 6000 |
| CBM453215U300T | 4.53.21.5 | 30 | 100 | 0.01 | 6000 |
| CBM453215U101T | 4.53.21.5 | 100 | 100 | 0.02 | 6000 |
| CBM453215U501T | 4.53.21.5 | 500 | 100 | 0.08 | 4000 |
Reliability Test Method
| No. | Items | Requirements | Test Methods and Remarks |
| 1 | Operating Temperature Range | -55+125 | Includes product surface temperature rise |
| 2 | Solder ability | No visible damage; 95% or more of electrode area shall be coated by new solder. | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2455; Immersion tin depth: 10mm; Duration: 51s; Dip performance to a flux of about: 3 ~ 5 s |
| 3 | Resistance to Soldering Heat | At least 95% of terminal electrode should be covered with solder. No mechanical damage. Impedance change: within 30%. | Preheating temperature: 120 to 150; Preheating time: 60s; Solder: 96.5%Sn/3.0%Ag/0.5%Cu; Solder temperature: 2605; Immersion tin depth: 10mm; Duration: 101s; Dip performance to a flux of about: 3 ~ 5 s |
| 4 | Adhesion of electrode | The termination and body should be no damage. | Applied force: 5N for 1005 series; 7N for 1608 series; 10N for 2012, 3216 series; 15N for 3225, 4532 series. Keep time: 101S |
| 5 | Low temperature resistance | No mechanical damage. Impedance change: within 30%. | Temperature: -552; Testing time: 10000 +24 h |
| 6 | Bending strength | No mechanical damage | Testing board: glass epoxy-resin substrate; For 0.5mm/s bending speed, 2mm deflection, hold time 20s1s |
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Company
Beijing Silk Road Enterprise Management Services Co., Ltd.
Location
16 Floor, Unit B, Jiatai International Mansion, No 41, Dongsihuan Zhong Road, Chaoyang District, Beijing
Contact Person
Sellina